MODIFICATION
66 -- Inductively Coupled Plasma Reactive Ion Etching System
- Notice Date
- 4/30/2003
- Notice Type
- Modification
- Contracting Office
- Department of the Navy, Office of Naval Research, Naval Research Laboratory, 4555 Overlook Ave. S.W., Washington, DC, 20375
- ZIP Code
- 20375
- Solicitation Number
- N00173-03-R-CR05
- Response Due
- 5/16/2003
- Archive Date
- 4/16/2004
- Point of Contact
- Alan Crupi, Contract Specialist, Phone 202-767-3595, Fax 202-767-0430,
- E-Mail Address
-
crupi@contracts.nrl.navy.mil
- Description
- The purpose of this amendment is to address questions from potential offerors. Question 1. For options, the solicitation specifies "one each additional spare clamp with sputter guard for 3, 4, and 6 inch wafers". Are you requesting an electrostatic clamp? Please clarify. Answer to Question 1. The system must be able to etch 3, 4, and 6 inch samples without having to go through more than 10 minutes of tool configuring. An electrostatic chuck is acceptable if it allows changing sample sizes with ease of operation. Question 2. The specification does not state if you desire the system to be loadlocked or not. If you are planning on using corrosive chemistries (C12, BC13, HBr, etc) then it will need a loadlock and a gas cabinet with automatic purging. Can you specify the gases that are to be used in this system? Answer to Question 2. See Sections 1.00, 2.13, 3.01, and 3.02 of the Specifications.
- Place of Performance
- Address: CONTRACTOR FACILITY
- Record
- SN00315346-W 20030502/030430213909 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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