SOLICITATION NOTICE
A -- RADIATION TOLERANT INTELLIGENT MEMORY STACK (RTIMS) MODULE DESIGN, MANUFACTURE AND ANALYSIS
- Notice Date
- 6/16/2003
- Notice Type
- Solicitation Notice
- Contracting Office
- NASA/Langley Research Center, Mail Stop 144, Industry Assistance Office, Hampton, VA 23681-0001
- ZIP Code
- 23681-0001
- Solicitation Number
- 1-018-RTIMS
- Response Due
- 7/1/2003
- Archive Date
- 6/16/2004
- Point of Contact
- Sharon D. Deberry, Contract Specialist, Phone (757) 864-7928, Fax (757) 864-6131, Email S.D.DEBERRY@larc.nasa.gov
- E-Mail Address
-
Email your questions to Sharon D. Deberry
(S.D.DEBERRY@larc.nasa.gov)
- Description
- NASA/LaRC has a requirement for the design, manufacture, and analysis of the Radiation Tolerant Intelligent Memory Stack (RTIMS). NASA/LaRC proposed the RTIMS project in response to the NASA Office of Earth Science (OES), Advanced Information System Technology (AIST), NASA Research Announcement (NRA) 02-OES-04. NASA/Headquarters selected RTIMS project for award. The requirement involves the design and development of the RTIMS physical hardware. The design, fabrication, testing, analysis, and demonstration of a reconfigurable radiation tolerant heterogeneous stacked memory array based on state-of-the-art chip stacking, radiation shielding and Field Programmable Gate Array (FPGA) technologies will be required. A 2D brass board version of the module will be developed for initial performance measurements and NASA software integration. After a successful preliminary design review of the RTIMS module, a prototype RTIMS will be manufactured and electrically tested. After design verification and validation of the prototype RTIMS module, ten (10) RTIMS modules will be manufactured and delivered to NASA/LaRC with associated analyses and documentation. NASA/LaRC intends to issue a contract on a sole source basis to 3D Plus USA for the RTIMS module design, manufacture, and analysis and other requirements as defined above. The statutory authority permitting other than full and open competition is 10 U.S.C. 2304(c)(1), as implemented by FAR 6.302-1, "Only one responsible source". 3D Plus USA was competitively selected as the partner on the RTIMS project based on their extensive experience in designing and building proven mechanically rugged, radiation hardened, 3-dimensional interconnected, heterogeneous microelectronic modules for space application and their proprietary technology which enables the stacking of any kind of components in any available packaging. 3D Plus USA has played a key role, as a teaming partner, in the development of the RTIMS proposal and their unique skills are essential to the success of the project. The Government does not intend to acquire a commercial item using FAR Part 12. See Note 26. An Ombudsman has been appointed. See NASA Specific Note "B". Oral communications are not acceptable in response to this notice. All responsible sources may submit an offer, which shall be considered by the agency. See Note 22. Any questions should be directed to Sharon D. DeBerry at (757) 864-7928 or by email: s.d.deberry@larc.nasa.gov
- Web Link
-
Click here for the latest information about this notice
(http://prod.nais.nasa.gov/cgi-bin/eps/bizops.cgi?gr=D&pin=23#106213)
- Record
- SN00348790-W 20030618/030616213540 (fbodaily.com)
- Source
-
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