SOLICITATION NOTICE
36 -- Design consultation and wafer fabrication support
- Notice Date
- 7/29/2004
- Notice Type
- Solicitation Notice
- NAICS
- 334412
— Bare Printed Circuit Board Manufacturing
- Contracting Office
- Other Defense Agencies, Office of the Secretary of Defense, Defense Microelectronics Activity, Contracting Division 4234 54th Street, Building 620, McCellan, CA, 95652-1521
- ZIP Code
- 95652-1521
- Solicitation Number
- H94003-04-R-4006
- Response Due
- 8/31/2004
- Archive Date
- 11/10/2004
- Point of Contact
- Judy Hilton, Contracting Officer, Phone (916) 231-1526,
- E-Mail Address
-
hilton@dmea.osd.mil
- Description
- This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6 as supplemented with additional information included in this notice. The NAICS code is 334413 and the size standard for this requirement is 500. Solicitation H94003-04-R-4006 is issued as a Request for Proposal and is sole source to Intersil Corporation, of Palm Bay, FL 32905. This is a three year requirement for Masks, Masks Sets ,15 each, Individual Masks, 32 each; Wafer Fabrications consisting of Developmental Lot charges of 20 ea, Split Lot Charges of 20 lots, and Proven Design Lot Charges, 15 lots and Additional Production 4 inch wafers including 200 ea RSG, 200 ea EBHF, 200 ea of UHF-1X, 100 ea VHF, and 100 ea of HBC-10. Additionally there are three line items for Engineering Support hours of 750 hrs per year. The objective of this effort is to obtain a source of supply for the design and fabrication of high power and radiation hardened mixed signal microelectronic devices for military and space applications used to support the DMEA mission. Requirements: The contractor shall provide design consultation support, mask and wafer fabrication services for designs provided by DMEA engineers. The contractor shall provide updated design and simulation libraries for the RSG, EBHF, UHF, VHF, and HBC-10 processes when changes to the libraries are made due to changes in the fabrication processes. All specific requirements will be identified in individual DMEA generated tasks. Mask Fabrication: The contractor shall fabricate masks, as required in individual tasks, for wafer fabrication using Government provided designs. The designs will vary from personalization efforts on an existing contractor arrays or full custom devices. The contractor shall fabricate individual masks if a single mask change is required. The number of complete mask sets shall not exceed fifteen (15) for full custom devices, and shall not exceed thirty-two (32) individual mask fabrications. First Silicon Wafer Fabrication: The contractor shall perform wafer fabrications to support development efforts or DMEA customer requirements at the contractor?s facility as required in individual tasks. The contractor shall perform the fabrication efforts using government provided GDSII tapes or mask sets. The contractor shall provide for doing split lots. The number of developmental fabrications shall not exceed twenty (20) and the number of split lots shall not exceed twenty (20). Proven Design Wafer Fabrication: The contractor shall provide wafer fabrication services for their processes as required in individual tasks. The number of wafers to be fabricated shall not exceed 200 wafers, in lots of 20, for each the RSG, EBHF, and UHF and shall not exceed 100 wafers for the VHF, and HBC-10 processes. Design and Consultation Labor: The contractor shall provide design engineering labor as required in individual tasks which is over and above what is already included in paragraphs 3.1 ? 3.3 and 3.5 of this SOW. The contractor shall participate in design consultation meetings as required in individual tasks. The meetings shall be held at the contractor?s facility and all necessary contractor personnel shall attend. The amount of design engineering and consultation labor shall not exceed 750 hours per year. Status Reports: The contractor shall provide status/technical reports as required in individual tasks. The contractor shall document the efforts, results, effectiveness, and progress of the actions taken to satisfy the requirements of this SOW in status/technical reports. The contractor shall administratively reserve sufficient funds to cover the preparation cost of the status/technical reports. Inspection and acceptance of all reports/data will be by the DMEA project engineer identified in the individual tasks. For a complete purchase description and line item breakdown, send an email request to hilton@dmea.osd.mil or fax your request to (916) 231-2826, your complete company mailing address is required. Additionally, contractors must be registered in the Central Contractor Registration (CCR) prior to an award. The following FAR clauses apply: 52.212-3 Offeror Representations and Certifications-Commercial Items; 52.212-4 Contract Terms and Conditions-Commercial Items 52.212-5; Contract Terms and Conditions Required to Implement Statutes or Executive Orders-Commercial Items; 52.227-19 Commercial Computer Software-Restricted Rights; 52.216-18 Ordering; 52.216-19 Order Limitations and 52.216-21 Requirements. DPAS rating is A7. Questions regarding this solicitation should be addressed to J. Hilton at Hilton@dmea.osd.mil. Offerors are due at 3:00PM on 31 Aug 2004. See Note 22.
- Place of Performance
- Address: Defense Microelectronics Activity, 4234 54th Street, McClellan, CA
- Zip Code: 95652-2100
- Zip Code: 95652-2100
- Record
- SN00633367-W 20040731/040729213130 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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