SOLICITATION NOTICE
B -- AP210 Board Warpage Analysis
- Notice Date
- 8/24/2004
- Notice Type
- Solicitation Notice
- NAICS
- 541690
— Other Scientific and Technical Consulting Services
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition and Logistics Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 3571, Gaithersburg, MD, 20899-3571
- ZIP Code
- 20899-3571
- Solicitation Number
- Reference-Number-04-812-6150
- Response Due
- 9/1/2004
- Archive Date
- 9/3/2004
- Point of Contact
- Jo-Lynn Davis, Contract Specialist, Phone 301-975-6337, Fax 301-975-6319, - Jo-Lynn Davis, Contract Specialist, Phone 301-975-6337, Fax 301-975-6319,
- E-Mail Address
-
jo-lynn.davis@nist.gov, jo-lynn.davis@nist.gov
- Description
- The National Institute of Standards and Technology (NIST) intends on entering into a sole source procurement with Georgia Tech Research Corporation, Office of Sponsored Programs, Georgia Tech, Atlanta, GA 30332 under the authority of FAR Subsection 13.106-1(b). In order to perform this work the contractor must meet the following requirements: The Contractor must have a Ph. D. in Mechanical Engineering with specialization in information technology and knowledge based methods; The Contractor must be familiar with the AP210 standard with practical experience with its use in: thermal analysis, design optimization, and component bonding analysis in electronic packaging; Advanced collaborative engineering environments; PCB stackup design; PCB warpage analysis; and Printed Wiring Board (PWB) Warpage Analysis Framework (PWAF). Additionally, the contractor must have worked on at least three separate AP210 based projects and have published at least one article on board warpage using the AP210 standard; have knowledge of constrained objects (COBs), multi representational architectures (MRA) for CAD CAE interoperability, Manufactory Product Models (MPM), Analytical Product Models (APM), Solution Method Models (SMM), and contaxt based analysis models (CBAM); and must be familiar with the Principles of Shadow Moire for analysis of board warpage. The purpose of this work is to develop a set of software tools that help measure and predict printed circuit board warpage due to temperature differences and make use of the international standard 10303 Industrial Automation Systems and Integration ? Product Data Representation and Exchange (STEP) on Electrical Assembly Interconnect and Packaging Design (STEP-AP210) to store the board warpage information in a standard format. This is a continuation of work completed in a previous order; the required work is to update and extend the software board prototype initiated in the previous order, while maintaining the overall capabilities which must continue to be supported in the updated application version. It is anticipated that a firm-fixed price purchase order will be awarded with an option period. The option would be to continue to study the effect of board warpage based on thermal factors and added components. Any interested party may submit, in writing, a detailed capability statement to respond to this requirement. However, a determination by the Government to compete this proposed requirement based on responses to this notice is solely within the discretion of the Government. This notice of intent is not a request for quotes. If no affirmative responses are received by September 1, 2004 by 10:00am local time, the Contracting Officer will proceed with the award to Georgia Tech Research Corporation, Office of Sponsored Programs, Georgia Tech.
- Place of Performance
- Address: Atlanta, GA
- Zip Code: 30332
- Country: US
- Zip Code: 30332
- Record
- SN00650252-W 20040826/040825041741 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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