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FBO DAILY ISSUE OF MARCH 20, 2005 FBO #1210
SOLICITATION NOTICE

A -- Scalable Millimeter-wave Architectures for Reconfigurable Transceivers (SMART)

Notice Date
3/18/2005
 
Notice Type
Solicitation Notice
 
NAICS
541710 — Research and Development in the Physical, Engineering, and Life Sciences
 
Contracting Office
Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, VA, 22203-1714
 
ZIP Code
22203-1714
 
Solicitation Number
BAA05-27
 
Response Due
6/28/2005
 
Archive Date
3/18/2006
 
Description
The Defense Advanced Research Projects Agency (DARPA) is soliciting research proposals in the area of integrated, surface-emitting panel architectures for millimeter wave (MMW) transceiver arrays. The Scalable Millimeter-wave Architectures for Reconfigurable Transceivers (SMART) program will culminate in a required objective demonstration of a large (at least 400 element), coherent, active electronically steerable array (AESA) achieving a functional density (e.g., output power density expressed in W/cm3) vastly greater than achievable with current architectures (e.g., slats or bricks). A possible approach to realizing thin arrays of the desired type might make use of micro-fabrication and wafer-scale assembly techniques. The three-dimensional (3D) multi-layer modules that are expected to result will greatly reduce AESA packaging complexity. These, in turn, are expected to be used to form MMW arrays of arbitrary sizes that are composed of modular, batch-fabricated sub-array building blocks. New capabilities, such as the ability to construct reconfigurable and/or multi-band AESAs and other MMW circuits, will be enabled by this architectural approach. Successful attainment of the SMART program?s objectives is anticipated to result in an enormous improvement in the size, weight, performance, and cost of future military systems that operate at MMW frequencies. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices and systems. Specifically excluded is research which primarily results in evolutionary improvement to the existing state of practice. DARPA seeks innovative proposals in the following areas: 1. Mechanical Integrity of a Multilayer Transceiver Array, including the demonstration of reliable and high-yield integration of a 3D stack of layers in a thermally stressing environment; 2. Thermal Management of a Multilayer Transceiver Array, including the demonstration of thermal management solutions for a 3D integrated stack; 3. Electrical Integrity of a Multilayer Transceiver Array, including the demonstration of horizontal and vertical interconnections with acceptable insertion loss, tolerance to device manufacturing variations, and circuit stability. Additional information on these technology areas is provided in the Areas of Technical Interest section of the BAA 05-27 Proposer Information Pamphlet referenced below. PROGRAM SCOPE Awards are expected to be made during the second half of calendar year 2005. Multiple awards are anticipated. Collaborative efforts/teaming are highly encouraged. A web site http://www.davincinetbook.com/teams has been established to facilitate formation of teaming arrangements between interested parties. Specific content, communications, networking, and team formation are the sole responsibility of the participants. Neither DARPA nor the Department of Defense (DoD) endorses the destination web site or the information and organizations contained therein, nor does DARPA or the DoD exercise any responsibility at the destination. This web site is provided consistent with the stated purpose of this BAA. The technical POC for this effort is Dr. Mark J. Rosker, fax: (703) 696-2206, electronic mail: mrosker@darpa.mil. GENERAL INFORMATION Proposers must obtain a pamphlet entitled ?BAA 05-27, Scalable Millimeter-wave Architectures for Reconfigurable Transceivers (SMART) Program, Proposer Information Pamphlet? which provides further information in the areas of integrated, surface-emitting panel architectures for millimeter wave (MMW) transceiver arrays, the submission, evaluation, and funding processes, proposal formats, and other general information. This pamphlet may be obtained from the FedBizOpps website: http://www.fedbizopps.gov/, the FedGrants website: http://www.fedgrants.gov/, World Wide Web (WWW) at URL http://www.darpa.mil/ or by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. Proposers must submit an original and nine (9) copies of the proposal and two (2) electronic copies (i.e., two (2) separate disks) of the full proposal [in PDF (preferred), or MS-Word readable, each on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB) diskette, a single 100 MB Iomega Zip (registered) disk, or a CD-ROM]. Each disk must be clearly labeled with BAA 05-27, offerors organization, proposal title (short title recommended), and Copy __ of 2. The proposal abstract (an original, 9 copies and 2 electronic copies (i.e., two (2) separate disks)) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn: BAA 05-27) on or before 4:00 p.m., local time, Monday, May 2, 2005. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal, which may differ from the originally published date below. Proposers not submitting proposal abstracts must submit an original and nine (9) of the full proposal and two (2) electronic copies (i.e., two (2) separate disks) of the full proposal [in PDF (preferred), or MS-Word readable, each on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB) diskette, a single 100 MB Iomega Zip (registered) disk, or a CD-ROM]. Each disk must be clearly labeled with BAA 05-27, offerors organization, proposal title (short title recommended), and Copy __ of 2. The full proposal (an original, 9 copies and 2 electronic copies (i.e., two (2) separate disks)) must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn: BAA 05-27) on or before 4:00 p.m., local time, Tuesday, June 28, 2005, in order to be considered during the initial round of selections; however, proposals received after this deadline may be received and evaluated up to one year from date of posting on FedBizOpps and FedGrants. Proposals submitted after the due date specified in the BAA may be selected contingent upon the availability of funds. This notice, in conjunction with the BAA 05-27 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received and to make award without discussions. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Input on technical aspects of the proposals may be solicited by DARPA from non-Government consultants /experts who are bound by appropriate non-disclosure requirements. Non-Government technical consultants/experts will not have access to proposals that are labeled by their offerors as ?Government Only?. Historically Black Colleges and Universities (HBCUs), Minority Institutions (MIs), and Small and Small Disadvantaged Businesses are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for these organizations? participation due to the impracticality of reserving discrete or severable areas of research in the area of integrated, surface-emitting panel architectures for millimeter wave (MMW) transceiver arrays. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 05-27. Proposals may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. INDUSTRY DAY MEETING The DARPA Microsystems Technology Office (DARPA/MTO) will host a one-day, unclassified briefing of the planned Scalable Millimeter-wave Architectures for Reconfigurable Transceivers (SMART) Program. The Briefing to Industry will be held on 15 April 2005 from 9:00 am to 12:00 noon, at Booz Allen Hamilton, 3811 N. Fairfax Drive, Suite 600, Arlington, VA 22203. (Attendee check-in will open at 8:00 am.) Note: Attendance during one section of the briefing will be limited to U.S. citizens, because information will be presented that is subject to U.S. export control restrictions. Attendees must present evidence of U.S. citizenship to attend this portion of the meeting. Government briefing material not subject to export control regulations will be posted to the DARPA website at http://www.darpa.mil in the SOLICITATIONS area. The purpose of this Industry Day conference is to inform the technical community of the Government plans and activities related to DARPA's Scalable Millimeter-wave Architectures for Reconfigurable Transceivers (SMART) Program. Offerors wishing to attend this Briefing to Industry should register online via the following website, https://secure.davincinetbook.com/conference/default.cfm using the conference code DAR33718. This website contains necessary meeting details. Citizenship verification and International Traffic in Arms Regulation (ITAR) restriction forms needed for the portion of the meeting limited to U.S. citizens are also available. These forms must be faxed to (703) 816-5444, Attention: Denise Johnson, no later than Friday, April 8, 2005. The registration fee for this meeting is $30.00. Attendees must register via the secure website by 5:00 PM Eastern time on April 8, 2005, no walk in registration will be permitted. Checks should be payable to Booz, Allen & Hamilton. Due to the limited number of seats available, this conference is limited to seventy-five (75) participants. Individual organizations will be limited to no more than three (3) representatives. Any organizations having more than three (3) representatives should contact the conference coordinator directly to see if space is available. If you have any questions or need assistance, please contact Denise Johnson of Booz Allen Hamilton via phone at (703) 816-5265 or e-mail at johnson_denise@bah.com. EVALUATION CRITERIA Evaluation of proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (l) overall scientific and technical merit; (2) potential contribution and relevance to the DARPA mission; (3) plans and capability to accomplish technology transition; (4) offeror's capabilities and related experience; (5) realism of the proposed schedule; and (6) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 696-2206 (Addressed to: DARPA/MTO, BAA 05-27), Electronic Mail: BAA05-27@darpa.mil Mail: DARPA/MTO, ATTN: BAA 05-27 3701 North Fairfax Drive Arlington, VA 22203-1714 This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area.
 
Record
SN00771959-W 20050320/050318212639 (fbodaily.com)
 
Source
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)

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