SOLICITATION NOTICE
36 -- PICK AND PLACE MACHINE
- Notice Date
- 4/1/2005
- Notice Type
- Solicitation Notice
- NAICS
- 334419
— Other Electronic Component Manufacturing
- Contracting Office
- NASA/Glenn Research Center, 21000 Brookpark Road, Cleveland, OH 44135
- ZIP Code
- 44135
- Solicitation Number
- NNC05096146R
- Response Due
- 4/15/2005
- Archive Date
- 4/1/2006
- Description
- This notice is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; offers are being requested and a written solicitation will not be issued. This notice is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice. This procurement is being conducted under the Simplified Acquisition Procedures (SAP). This announcement constitutes the only solicitation; offers are being requested and a written solicitation will not be issued. This procurement is NOT set aside for small business. This notice is being issued as a Request for Offer (RFO) for: Item 1) one Pick and Place System, Item 2) one installation and checkout of Item 1 and Item 3) Training for 2 people to operate Item 1. Project Background The NASA Glenn Research Center (GRC) has a requirement for a die bonder (also known as a pick & place machine). A pick & place machine is used to select various electronic chips from several styles of containers and then precisely install them onto a large wafer or work-piece using some type of conductive or non-conductive adhesive. The pick & place machine shall be used to support the assembly of several phased array antennas currently under development at GRC. Statement of Work The Contractor shall provide a turn-key pick & place system that consists of all the servo mechanisms (X, Y, Z and Theta axis), vision systems (CCD camera, optics, and illumination) for inspection and pattern recognition, adhesive dispenser systems, computer and Windows based graphical user interface, and substrate handling systems to meet, as a minimum, the following specifications. 1. Capability to handle wafer (work-piece) sizes up to 33 cm in diameter. That is, the various die will be placed and bonded to a surface that may be up to 33 cm in diameter. 2. The machine must be able to handle die sizes ranging from 0.2 mm up to 2 cm on a side. 3. The machine shall be able to handle die thicknesses ranging from 0.1 mm up to 2.5 mm. 4. The X-Y +/- 3 sigma placement accuracy shall be 10 microns or better. 5. The machine shall be capable of placing two die, each up to 1 cm on an edge, adjacent to one another to within a 25 micron spacing. 6. The machine shall have a wafer mapping ability to reject unwanted die. For example, individual die will be screened and left on the wafer saw tape. Rejected die can be identified by location on the tape. The machine must ignore these identified rejected die during the pick & place process. 7. The machine shall be capable of placing a parasitic (i.e. overlay) die onto a previously placed and bonded die with a +/- 3 sigma theta accuracy of 0.15 degrees. 8. The machine shall be able to dispense conductive and non-conductive adhesives, including superglue (i.e. cyanoacrylate). For example, the parasitic die mentioned in specification #6 must be attached with superglue. 9. The machine shall be able to bond multiple die sizes (A, B, C) automatically. For example, the anticipated process involves placing hundreds of die type A using a conductive epoxy, hundreds of die type B adjacent to die type A using a conductive epoxy, then bonding die type C atop die type A using superglue. 10. The machine shall be capable of selecting die from various carrier types, including waffle packs, GEL-PAKs, and Nitto tape. 11. The dispenser shall be able to pattern different adhesive trace and spot size designs, consistent with die dimensions given in # 2 above, to prevent adhesive from wicking up the die sides and potentially shorting components. 12. A chip needle ejector system shall be able to handle the various die sizes specified in # 2 and # 3 above. 13. One set of operation manuals shall be furnished with the system. Those offerors whose system meets the above minimum requirements shall perform the following demonstration within one week from notification in order for their system to be considered: Samples (coupons) will be provided by NASA GRC to the offerors with instructions. These coupons will be functionally equivalent to the die and wafer process to be used by NASA for assembly of the phased array antennas. The offeror shall satisfactorily demonstrate the die bonding process according to the instructions given using the proposed machine. NASA will evaluate the assembled coupons prior to any determination or selection for award. Within 2 weeks of delivery, the Contractor shall install the pick and place system at NASA Glenn Research Center and demonstrate functionality according to the above specifications. Installation and checkout shall be performed Monday thru Friday, non-government holidays from 8 a.m. to 5 p.m. or per other mutually agreeable times. The Contractor shall furnish training in the safe operation of the system either at GRC or at the Contractor's facility for up to five days and for up to two persons within 30 days of delivery of the system. Schedule The Contractor shall perform all of these tasks within 12 weeks from contract award. Solicitation Instructions The provisions and clauses in the RFQ are those in effect through FAC 01-25. The NAIC code is 334419 and the small business size standard for this procurement is 500 employees. All qualified responsible business sources may submit a quotation which shall be considered by the agency. Delivery to NASA Glenn Research Center is required within 12 weeks from contract award. Offerors proposing an accelerated delivery schedule shall propose a dual pricing in accordance with the following: One price for completion of the effort by 12 weeks from award. A second price for completion to their best schedule that is less than the 12 weeks time. Offerors shall propose an actual completion date for their best schedule (i.e. Completion by (date) if award is made not later than (date)). Offers shall state the location for the training. Delivery shall be FOB Destination. The DPAS rating for this procurement is DO-C9. Offers for the items(s) described above are due by April 15, 2005, 4:30p.m. GRC local time and may be mailed to NASA Glenn Research Center, 21000 Brookpark Road, MS 500-306, Cleveland, OH 44135, and include, solicitation number, FOB destination to this Center, proposed delivery schedule, discount/payment terms, warranty duration (if applicable), Cage Code, DUNS identification number (if they use Business Partner Network (BPN) Online Representations and Certifications Application (ORCA) and the Representations and Certifications (52.212-3) if not currently available on BPN, identification of any special commercial terms, description of items offered per 52.212-1 and as modified, and be signed by an authorized company representative. A copy of a published price list, catalog price or computer page printout showing the price for Items 1 thru 3 may also be included if desired. (Note, the Contracting Officer may request this information if only 1 source provides a proposal). Offerors are encouraged to use the Standard Form 1449, Solicitation/Contract/Order for Commercial Items form attached to this solicitation (Ensure that the track changes feature is turned off when word processing this form). Faxed offers are not acceptable. Offerors shall provide the information required by FAR 52.212-1. Note for those proposing advance payments: FAR limits advance payments for commercial items to not greater than 15% of the price. If the end product(s) quoted is other than domestic end product(s) as defined in the clause entitled "Buy American Act -- Supplies," the Offerors shall so state and shall list the country of origin. Note that the price proposed shall include all import duties or fees. Offerors must include completed copies of the provision at 52.212-3, Offeror Representations and Certifications - Commercial Items with their offer. These may be obtained via the internet at URL: http://www.grc.nasa.gov/WWW/Procure/rforms.html or The (BPN ORCA) Business Partner Network (BPN) Online Representations and Certifications Application (ORCA) website covers almost all reps and certs. Vendors access it at http://orca.bpn.gov . FAR 52.212-4 is applicable. FAR 52.212-5 Contract Terms and Conditions Required to Implement Statutes or Executive Orders-- Commercial Items is applicable. As prescribed in 12.301(b)(4), insert the following clauses: _X_ (1) 52.203-6, Restrictions on Subcontractor Sales to the Government (Jul 1995), with Alternate I (Oct 1995) (41 U.S.C. 253g and 10 U.S.C. 2402). __ (2) 52.219-3, Notice of Total HUBZone Set-Aside (Jan 1999) (15 U.S.C. 657a). __ (3) 52.219-4, Notice of Price Evaluation Preference for HUBZone Small Business Concerns (Jan 1999) (if the offeror elects to waive the preference, it shall so indicate in its offer) (15 U.S.C. 657a). __ (4)(i) 52.219-5, Very Small Business Set-Aside (June 2003) (Pub. L. 103-403, section 304, Small Business Reauthorization and Amendments Act of 1994). __ (ii) Alternate I (Mar 1999) of 52.219-5. __ (iii) Alternate II (June 2003) of 52.219-5. __ (5)(i) 52.219-6, Notice of Total Small Business Set-Aside (June 2003) (15 U.S.C. 644). __ (ii) Alternate I (Oct 1995) of 52.219-6. __ (iii) Alternate II (Mar 2004) of 52.219-6. __ (6)(i) 52.219-7, Notice of Partial Small Business Set-Aside (June 2003) (15 U.S.C. 644). __ (ii) Alternate I (Oct 1995) of 52.219-7.__ (iii) Alternate II (Mar 2004) of 52.219-7. __ (7) 52.219-8, Utilization of Small Business Concerns (May 2004) (15 U.S.C. 637(d)(2) and (3)). __ (8)(i) 52.219-9, Small Business Subcontracting Plan (Jan 2002) (15 U.S.C. 637(d)(4). __ (ii) Alternate I (Oct 2001) of 52.219-9. __ (iii) Alternate II (Oct 2001) of 52.219-9. __ (9) 52.219-14, Limitations on Subcontracting (Dec 1996) (15 U.S.C. 637(a)(14)). __ (10)(i) 52.219-23, Notice of Price Evaluation Adjustment for Small Disadvantaged Business Concerns (June 2003) (Pub. L. 103-355, section 7102, and 10 U.S.C. 2323) (if the offeror elects to waive the adjustment, it shall so indicate in its offer). __ (ii) Alternate I (June 2003) of 52.219-23. __ (11) 52.219-25, Small Disadvantaged Business Participation Program-Disadvantaged Status and Reporting (Oct 1999) (Pub. L. 103-355, section 7102, and 10 U.S.C. 2323). __ (12) 52.219-26, Small Disadvantaged Business Participation Program-Incentive Subcontracting (Oct 2000) (Pub. L. 103-355, section 7102, and 10 U.S.C. 2323). __ (13) 52.219-27, Notice of Total Service-Disabled Veteran-Owned Small Business Set-Aside (May 2004). __ (14) 52.222-3, Convict Labor (June 2003) (E.O. 11755). __ (15) 52.222-19, Child Labor-Cooperation with Authorities and Remedies (Jan 2004) (E.O. 13126). _X_ (16) 52.222-21, Prohibition of Segregated Facilities (Feb 1999). _X_ (17) 52.222-26, Equal Opportunity (Apr 2002) (E.O. 11246). _X_ (18) 52.222-35, Equal Opportunity for Special Disabled Veterans, Veterans of the Vietnam Era, and Other Eligible Veterans (Dec 2001) (38 U.S.C. 4212). _X_ (19) 52.222-36, Affirmative Action for Workers with Disabilities (Jun 1998) (29 U.S.C. 793). _X_ (20) 52.222-37, Employment Reports on Special Disabled Veterans, Veterans of the Vietnam Era, and Other Eligible Veterans (Dec 2001) (38 U.S.C. 4212). __ (21)(i) 52.223-9, Estimate of Percentage of Recovered Material Content for EPA-Designated Products (Aug 2000) (42 U.S.C. 6962(c)(3)(A)(ii)). __ (ii) Alternate I (Aug 2000) of 52.223-9 (42 U.S.C. 6962(i)(2)(C)). __ (22) 52.225-1, Buy American Act-Supplies (June 2003) (41 U.S.C. 10a-10d). __ (23)(i) 52.225-3, Buy American Act-Free Trade Agreements-Israeli Trade Act (Jan 2004) (41 U.S.C. 10a-10d, 19 U.S.C. 3301 note, 19 U.S.C. 2112 note, Pub. L. 108-77, 108-78). __ (ii) Alternate I (Jan 2004) of 52.225-3. __ (iii) Alternate II (Jan 2004) of 52.225-3. __ (24) 52.225-5, Trade Agreements (Jan 2004) (19 U.S.C. 2501, et seq., 19 U.S.C. 3301 note). __ (25) 52.225-13, Restrictions on Certain Foreign Purchases (Dec 2003) (E.o.s, proclamations, and statutes administered by the Office of Foreign Assets Control of the Department of the Treasury). _X_ (26) 52.225-15, Sanctioned European Union Country End Products (Feb 2000) (E.O. 12849). __ (27) 52.225-16, Sanctioned European Union Country Services (Feb 2000) (E.O. 12849). _X_ (28) 52.232-29, Terms for Financing of Purchases of Commercial Items (Feb 2002) (41 U.S.C. 255(f), 10 U.S.C. 2307(f)). __ (29) 52.232-30, Installment Payments for Commercial Items (Oct 1995) (41 U.S.C. 255(f), 10 U.S.C. 2307(f)). __ (30) 52.232-33, Payment by Electronic Funds Transfer-Central Contractor Registration (Oct 2003) (31 U.S.C. 3332). _X_ (31) 52.232-34, Payment by Electronic Funds Transfer-Other than Central Contractor Registration (May 1999) (31 U.S.C. 3332). __ (32) 52.232-36, Payment by Third Party (May 1999) (31 U.S.C. 3332). __ (33) 52.239-1, Privacy or Security Safeguards (Aug 1996) (5 U.S.C. 552a). __ (34)(i) 52.247-64, Preference for Privately Owned U.S.-Flag Commercial Vessels (Apr 2003) (46 U.S.C. Appx 1241 and 10 U.S.C. 2631).. __ (ii) Alternate I (Apr 1984) of 52.247-64. (c) The Contractor shall comply with the FAR clauses in this paragraph (c), applicable to commercial services, that the Contracting Officer has indicated as being incorporated in this contract by reference to implement provisions of law or Executive orders applicable to acquisitions of commercial items: None Marked as Applicable The FAR may be obtained via the Internet at URL: http://www.arnet.gov/far/ The NFS may be obtained via the Internet at URL: http://www.hq.nasa.gov/office/procurement/regs/nfstoc.htm Award will be based upon overall best value to the Government among those offers that meet the specifications of Item 1 thru Item 3 above. Consideration will given to the factors of meeting specifications, total price, and past performance. (Offerors shall provide a summary of their firm that includes how many years they have furnished the same or similar product required and the number of units sold in the last 2 years.) Other critical requirements (i.e., delivery) if so stated in the solicitation and best value will also be considered. Unless otherwise stated in the solicitation, for selection purposes past performance, delivery schedule, meeting specifications, and total price, and are essentially equal in importance. Best Value will be an important consideration in selection. Technical acceptability will be determined by information submitted by the offeror providing a description in sufficient detail to show that the product offered meets the Government's requirement (see specifications above); those that meet the specifications will be required to demonstrate the die bonding process according to Government instructions using the proposed machine with Government furnished coupons, and any best value criteria the offeror wishes to address. It is critical that offerors provide adequate detail to allow evaluation of their offer. (SEE FAR 52.212-1(b) and its amendment above). Best Value Criteria: The following will be BVC considerations: 1. The pick & place machine will be installed in a small laboratory with similar equipment. Because of floor space and load limitations, special consideration will be given to a machine that has a minimal footprint (i.e. that occupies the smallest possible volume and uses the least amount of floor space). 2. The pick & place machine will be used to assemble, among other things, phased array antennas. Three antennas are currently under development: an X-band receive array, A K-band 615 element transmit array, and a 26.5 GHz transmit array. Because the development schedule of each array imposes stringent milestones, special consideration will be given to early delivery and installation of the system. 3. Training that is provided at NASA GRC may be considered a better value than that performed at another location. 3. An offeror that can demonstrate that the proposed equipment is successfully used by industry or Government for the purposes outlined in the work statement will be given best value consideration. (I.e a system demonstrated to be commercially available equipment that can meet the specifications with minimal modifications and has been sold within the last year.) 4. The offeror shall satisfactorily demonstrate the die bonding process according to instructions using the proposed machine. NASA will evaluate the coupons and those machines providing for functionally equivalency closest to the die and wafer process to be used by NASA for assembly of the phased array antennas will be given best value consideration. Questions regarding this acquisition must be submitted in writing no later than 2 days after the posting date of this notice. Ombudsman has been appointed -- See NASA Specific Note "B". It is the offeror's responsibility to monitor the following Internet site for the release of solicitation amendments (if any): http://prod.nais.nasa.gov/cgi-bin/eps/bizops.cgi?gr=D&pin=22 . Potential offerors will be responsible for downloading their own copy of this combination synopsis/solicitation and amendments (if any). Any referenced notes can be viewed at the following URL: http://genesis.gsfc.nasa.gov/nasanote.html
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