Loren Data's SAM Daily™

FBO DAILY ISSUE OF OCTOBER 26, 2005 FBO #1430
SOLICITATION NOTICE

59 -- Bump Bonding of Pixel Detector Modules Hybridization

Notice Date

10/6/2005
 

Notice Type

Solicitation Notice
 

NAICS

335999 — All Other Miscellaneous Electrical Equipment and Component Manufacturing
 

Contracting Office

Department of Energy, Fermi National Accelerator Laboratory, Fermilab, P.O. BOX 500 MAIL STOP 210 (WH4W), BATAVIA, IL, 60510
 

ZIP Code

60510
 

Solicitation Number

Reference-Number-182855WPK
 

Response Due

10/21/2005
 

Point of Contact

William Koncelik, Sr. Procurement Administrator, Phone 630-840-4173, Fax 630-840-2457, - William Koncelik, Sr. Procurement Administrator, Phone 630-840-4173, Fax 630-840-2457,
 

E-Mail Address

billk@fnal.gov, billk@fnal.gov
 

Description

Bump Bonding of Pixel Detector Modules Hybridization which include the following: (1) Demonstrated capability to provide comprehensive flip-chip service including generation of all masks, bumping, wafer thinning, dicing, and flip-chip mating; (2) Demonstrated capability of doing fine pitch (100 microns) and small Pb/Sn solder bumps (diameter 30 micron or less) with excellent yield; (3) Can handle both 4 inch silicon sensor wafers (270 micron thick) with Electrostatic sensitive structures on both sides and 8" silicon readout chip wafers; the readout chips needed to be thinned down to 200 microns before flip-chip assembly; (4) Can produce a large number of flip-chip mated multichip modules (up to 900) which will have between 2 to 10 readout chips with only 100 microns between the edges of abutting chips within a nine month time frame; (5) Previous experience with detectors for High Energy Physics and/or medical application will be advantageous. (6) Minimum of 5 years experience in the above area of expertise. NOTE: THIS NOTICE MAY HAVE POSTED ON WWW.FEDBIZOPPS.GOV ON THE DATE INDICATED IN THE NOTICE ITSELF (06-OCT-2005). IT ACTUALLY APPEARED OR REAPPEARED ON THE FEDBIZOPPS SYSTEM ON 24-OCT-2005, BUT REAPPEARED IN THE FTP FEED FOR THIS POSTING DATE. PLEASE CONTACT fbo.support@gsa.gov REGARDING THIS ISSUE.
 

Web Link

Link to FedBizOpps document.
(http://www.fbo.gov/spg/DOE/FERMI/FERMI/Reference-Number-182855WPK/listing.html)
 

Place of Performance

Address: Place of Contract Performance shall be at vendor facility. Our location is as follows: Fermilab Kirk Rd & Wilson St. PO Box 500, MS # 210 Batavia, Illinois

Zip Code: 60510

Country: USA
 

Record

SN00920304-F 20051026/051024212526 (fbodaily.com)
 

Source

FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)

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