SPECIAL NOTICE
A -- TECHNOLOGY BUSINESS OPPORTUNITY MEMS CONTACT STRESS SENSOR
- Notice Date
- 11/2/2005
- Notice Type
- Special Notice
- NAICS
- 238990
— All Other Specialty Trade Contractors
- Contracting Office
- Department of Energy, Lawrence Livermore National Laboratory (DOE Contractor), Industrial Partnerships & Commercialization, 7000 East Avenue L-795, Livermore, CA, 94550
- ZIP Code
- 94550
- Solicitation Number
- Reference-Number-FBO112-06
- Response Due
- 12/9/2005
- Archive Date
- 12/12/2005
- Description
- TECHNOLOGY BUSINESS OPPORTUNITY MEMS CONTACT STRESS SENSOR Opportunity: Lawrence Livermore National Laboratory (LLNL), operated by the University of California under contract with the U.S. Department of Energy (DOE), is offering the opportunity to license and commercially develop a flexible, extensible contact sensor for use in a variety of commercial applications. Background: This technology addresses a long understood need for contact stress sensing across a large variety of applications. At present there are no adequate products to solve the need for repeated, dynamic measurements on a two-axis curvature. By capitalizing on micromachining technology, pressure sensing techniques are scaled to assess contact stress in a device 50 microns thick. The flexibility of LLNL?s MEMS contact stress sensor allows it to conform to complex curvatures, while the small form factor means there is no extra pressure caused by the device. Description: The LLNL MEMS Contact Stress Sensor can be a single unit or a flexible array of sensors that measures mechanical or solid pressure. A large variety of load ranges can be easily accommodated by dimensioning of the MEMS sensing diaphragm. Single silicon sensors (for point measurements), and sensor arrays, can be 50 um thick or 125 um total thickness, including the package. While a single sensor measures loads (stress) perpendicular to the surface of contact, a sensor array can flex and stretch, allowing conformity to any curvature (i.e. a human hip joint) greater than 5mm. Advantages: Re-useable and stable (does not wear out), can be used as a component in a commercial product Minimally intrusive: very thin, does not alter stress being measured Arrays are flexible and extensible for wide application Flexible design for various load ranges Proven silicon performance; highly elastic, useful for high-speed (dynamic) measurements Potential Applications: Our technology is designed for any application that includes two contacting surfaces with a need to measure pressure of interfacing loads. Promising applications include: brake pads; in-situ tire monitoring; gaskets and seals; artificial joints; podiatry (foot pressure); seating, bedding, and prosthetics; tumor monitoring; robotics and haptic devices; injection molding; and impact studies. Development Status: A Patent Application has been filed. DOE is currently producing and using prototype sensors internally. Please see additional information on the IPAC website at http://www.llnl.gov/IPandC/technology/profile/announcement/MEMS_ContactStressSensor.php LLNL is seeking industry partners with a demonstrated ability to bring such inventions to the market. Moving critical technology beyond the Laboratory to the commercial world helps our licensees gain a competitive edge in the marketplace. All licensing activities are conducted under policies relating to the strict nondisclosure of company proprietary information. Please visit the IPAC website at http://www.llnl.gov/IPandC/workwithus/partneringprocess.php for more information on working with LLNL and the industrial partnering and technology transfer process. Note: THIS IS NOT A PROCUREMENT. Companies interested in commercializing LLNL's MEMs Contact Stress Sensor should provide a written statement of interest, which includes the following: 1. Company Name and address. 2. The name, address, and telephone number of a point of contact. 3. A description of corporate expertise and facilities relevant to commercializing this technology. Written responses should be directed to: Lawrence Livermore National Laboratory Industrial Partnerships and Commercialization P.O. Box 808, L-795 Livermore, CA 94551-0808 Attention: FBO 112-06 Please provide your written statement within thirty (30) days from the date this announcement is published to ensure consideration of your interest in LLNL's MEMs Contact Stress Sensor.
- Record
- SN00924949-W 20051104/051102211734 (fbodaily.com)
- Source
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