SOLICITATION NOTICE
66 -- Suss Substrate Bonder
- Notice Date
- 6/1/2007
- Notice Type
- Solicitation Notice
- NAICS
- 333298
— All Other Industrial Machinery Manufacturing
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, MD, 20899-1640, UNITED STATES
- ZIP Code
- 00000
- Solicitation Number
- NB841030-7-04519
- Response Due
- 6/15/2007
- Archive Date
- 6/30/2007
- Description
- The Department of Commerce, National Institute of Standards and Technology (NIST) intends to negotiate a firm fixed price purchase order, on a sole source basis with Suss Micro Tec, Inc., WaterBury Center, VT for a Suss SB63 Substrate Bonder under Other than Full and Open competition by the authority of the Federal Acquisition Regulation (FAR) Subpart 6.302-1, Only one responsible source and no other supplies or services will satisfy agency requirements. Sole source determination is based on the need for a substrate bonder which can only be obtained from Suss Microtec, Inc. Suss Microtec, Inc. is the sole manufacturer of the equipment which includes unique proprietary capabilities that are required to satisfy the Government?s minimum requirements: The Bonder system must be 100% compatible with the Suss Microtec contact aligner MA/BA6 bond adaptors, transport fixtures, and bond chucks. The system must be compatible for Class 100 Cleanroom operation (Fed. Std. 209E). The system must be complete with the capability to bond 3?, 4? and 6?wafers out-of-the-box. The system must provide anodic bonding capability with a high current (60 milliamp) negative and positive power supply when delivered. The system must be capable to provide thermal compression bonding when delivered. The unit must provide an environmentally isolated bond chamber to reduce contamination. The bond processes that the system must be capable of are Anodic, Eutectic, Glass Frit, Fusion, Thermo-compression, SOI, adhesive and temporary bonding for triple and multiple stacks of wafers and substrates. The system must be setup for 208 Volt Electrical Services. The system software must be PC Windows operating system compatible. Unit must provide a lower heated bonding chuck to heat a substrate from room temperature up to at least 550 Degrees Celsius. Must provide bond alignment accuracy down to at least 3 micron. The unit must be of compact design to fit into an installation location no larger than 48x48 inch area. This tool must be new and not refurbished. The vendor must provide operational instruction and hands-on application training after tool installation has been completed. Delivery shall be FOB destination and be completed in accordance with the Contractor?s commercial schedule. The North American Industrial Classification system (NAICS) code for this acquisition is 33298, and the size standard is 500 employees. No solicitation package will be issued. This notice is not a request for competitive proposals; however, interested persons may identify their interest and capability to respond to this requirement. Inquires will only be accepted via email to lorena.cruz@nist.gov. The government will consider responses received by 5:00 p.m., EST, 06/15/07. A determination by the Government not to compete this proposed acquisition based on responses to this notice is solely within the discretion of the Government. Information received will normally be considered solely for the purpose of determining whether to conduct a competitive procurement in the future. No telephone requests will be honored.
- Record
- SN01308273-W 20070603/070604102819 (fbodaily.com)
- Source
-
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