SOLICITATION NOTICE
66 -- Multipurpose Plasma Etcher
- Notice Date
- 7/27/2007
- Notice Type
- Solicitation Notice
- NAICS
- 333295
— Semiconductor Machinery Manufacturing
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, MD, 20899-1640, UNITED STATES
- ZIP Code
- 00000
- Solicitation Number
- SB1341-07-RQ-0347
- Response Due
- 8/17/2007
- Archive Date
- 9/1/2007
- Description
- THIS IS A COMBINED SYNOPSIS/SOLICITATION FOR COMMERCIAL ITEMS PREPARED IN ACCORDANCE WITH THE FORMAT IN FAR SUBPART 12.6-STREAMLINED PROCEDURES FOR EVALUATION AND SOLICITATION FOR COMMERCIAL ITEMS-AS SUPPLEMENTED WITH ADDITIONAL INFORMATION INCLUDED IN THIS NOTICE. THIS ANNOUNCEMENT CONSTITUTES THE ONLY SOLICITATION; QUOTATIONS ARE BEING REQUESTED, AND A WRITTEN SOLICITATION DOCUMENT WILL NOT BE ISSUED. THE SOLICITATION IS BEING ISSUED USING SIMPLIFIED ACQUISITION PROCEDURES UNDER THE AUTHORITY OF FAR 13.5 TEST PROGRAM FOR CERTAIN COMMERCIAL ITEMS. ***This solicitation is a Request for Quotation (RFQ). The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular (FAC) 2005-18.*** *** The associated North American Industrial Classification System (NAICS) code for this procurement is 333295 with a small business size standard of 500 employees. This requirement is unrestricted and all interested offerors may submit a quotation.*** ***The National Institute of Standards and Technology is seeking to purchase One (1) Multipurpose Plasma Etcher. ****All interested offerors shall provide a quote for the following: Line Item 0001: Quantity One (1) Multipurpose Plasma Etcher, which shall meet or exceed the following specifications: 1. System: a) System must be equipped with two process modules. One for chlorine type chemistries and one for fluorine type chemistries. b) Either two chambers in one system or two separate process systems is acceptable. c) Chlorine-based process module is primarily for etching III-V group materials (GaAs and InP, etc.) and metals (Al and Cr, etc.). d) Fluorine-based process module is primarily for 3-10um deep etching dielectric materials (SiO2 and SiNx, etc.) 2. Inductively Coupled Plasma (ICP) source: a) Each process module must have an ICP plasma or an equivalent source. b) ICP source must operate from 0 to 2000w or higher (higher is preferred) with power repeatability to plus or minus 2 percent. c) ICP source must be of sufficient diameter to satisfy the process uniformity plus or minus 5 percent or better over 200mm in diameter semi standard wafer. d) High ICP plasma density (10 superscript 11 to 10 superscript 12/cm cubed) with low chamber pressure, 5mTorr or less is preferred. e) Plasma with SF subscript 6 gas must be able to strike and support under chamber pressure 5mTorr or lower. 3. Reactive Ion Etching (RIE) Electrode: a) Each process module must have a RIE electrode. b) RIE electrode must operate from 0 to 600W or higher. c) The RIE electrode must have a feedback loop so that a constant DC bias can be maintained to plus or minus 3 percent. d) The electrode must accommodate variable wafer sizes and wafer pieces. No electrode change for matching wafer size is preferred. 4. Process Chamber: a) The process chamber must operate at pressures from less than 1 to 100 mTorr. b) Chamber material must sustain the corrosive reactive chemicals. c) Chamber must be equipped with heater to heat up to 80 degrees Celsius or higher. d) Chamber must be configured with windows to operate laser, optical emission spectroscopy (OES) end point detectors. 5. Chucks: a) Chucks must be able to accommodate semi-standard wafers 75mm, 100mm, 150mm, and 200mm in diameter as well as 100mm, 125mm and 150mm mask plates and wafer pieces. b) Contact force between the substrate and the chuck must be adjustable to accommodate 0-5mm wafers without damage. c) Chucks must be equipped with He backside cooling. d) Cooling must be uniform over 200mm in diameter wafers and 200mm mask plates without leaving any temperature patterns on the etched wafers. e) Chucks must be able to actively adjust the substrate temperature from 0 degrees Celsius to 60 degrees Celsius within plus or minus 2 percent accuracy. Broader temperature range is preferred. f) The temperature must be uniform across the wafer (within plus or minus 2 percent up to 200mm in diameter). g) Chucks must be able to reach temperature set-point from 0 degrees Celsius to 60 degrees Celsius and 60 degrees Celsius to 0 degrees Celsius in 15 minutes or less. h) Edge exclusion by clamping 5mm or less; by non-uniformity 7mm or less (smaller is preferred). 6. Pumping System a) Process modules must be able to reach and maintain a base pressure of 5x10 superscript - 7 Torr in 24 hours. b) Process modules must be able to reach and maintain a base pressure of 10 superscript - 5 Torr in 2 minutes after each process. c) Process pumps must be able to maintain process pressure set-point to plus or minus 2 percent. d) Turbo pump must be suitable for the corrosive gases and dry pump is required. 7. Gas Pod a) Gas pod must supply up to 12 different gases supplied to each chamber (more is preferred). b) Gas pod must allow operation independently from 5 to 200 sccm (broader is preferred). c) Digital MFC is preferred. d) Gases in chlorine based chamber: Cl2; BCl3; SiCl4; CH4; CF4 Ar; HBr; N2; H2; O2;SF6; He e) Gases in fluorine based chamber: SF6; C4F8; CF4; CHF3; C2F6; O2; H2; Ar; N2; He 8. Load-lock a) At least one load-lock must have to transfer the samples in and out of different process modules. b) Load-lock must be able to allow transfer under vacuum between the process chambers in any sequence as defined by the process recipe. c) Load-lock must be able to handle 75mm, 100mm, 150mm, 200mm SEMI standard wafers as well as 100mm, 125mm and 150mm mask plates and wafer pieces. d) Load-lock must be able to pump down in less than 5 minutes. That time must include the sample loading and transferring. e) Single wafer and manual loading of the wafer in the load-lock is preferred. f) Turbo pump is preferred. 9. Endpoint/Chamber Detection a) Both laser interferometer and OES endpoint detectors are required. b) Beam size of the laser detector must be less than 50um. c) The wavelength of the OES must be broad (200-800nm) with less than 2nm resolution. d) Electrode temperature and plasma power monitoring are optional. e) All end-point detectors must be able to operate simultaneously and independently. f) Standalone end-point system is preferred to monitor different chambers. 10. Maintenance a) Process modules must be easy to access for routine cleaning (less than 4 hours is preferred). b) Each module must be able to do the maintenance separately. 11. Software a) Windows XP based operative system is required. b) Etcher functions must be fully controllable from user-interface software. c) Process sequence and process steps must be easily set-up in the recipe in less than 20 minutes. d) Endpoint detector software interface must be able to operate simultaneously with the process interface. e) Software must have automated data logging for all process parameters and error logging for system status. f) Software upgrades must be provided to NIST, when released, at no additional charge for a period of 5-years. g) Software must support both manual and automatic operations. 12. Safety and Interlocks a) The system must be equipped with proper interlocks to prevent damage by mis-operation. b) All gases must be equipped with hardware interlock to prevent forbidden mixing. c) The system must meet NFPA318 requests. 13. General Requirements a) The Contractor must provide a paper copy of the operating and maintenance manual for the etcher. b) Pricing for a 1-year optional extended warranty shall be provided with the quotation. c) The Contractor shall provide a list of optional service/maintenance coverage with pricing. Failure to offer optional service/maintenance coverage shall not affect an award decision. The Government may include this optional service, if quoted, in the basic purchase order. 14. Packaging The equipment must be packaged using clean room packaging and markings. 15. Required Test Data All offerors are required to provide test data with the quotation. Offerors shall utilize their own available sample materials in providing the information below or shall provide the information based on previous testing of the types of sample data required herein. In either case, the offerors shall provide a detailed description of the sample materials utilized to generate the data. The data shall be provided from the type of system that the offeror is quoting in response to this solicitation. Tests shall be performed and test data provided at no cost to the Government. Processes/Tests: a) 100nm or smaller isolated lines, trenches, dots and equal lines are preferred. b) The following materials must be tested and the test data must be included in the quotation: GaAs (or InP), SiO2 and Al. Additional materials may be tested and submitted with the quotation. Materials: SiNx, Si, W, Cr, Mo, Ta, Ge, Au and others. More and detailed data are preferred. c) Polymer mask is preferred. d) Etching depth/width must be larger than 1 (higher is preferred). e) Higher etching selectivity (target etching material/polymer mask) is preferred. f) Straight etching profile 90 (plus or minus 1) degree is preferred. g) Etching feature critical dimension (CD) control should be plus or minus 5 percent or less. This number is defined as (CD after etching minus CD before etching) divided by CD before etching. h) Faster etching rate is preferred. i) Etching uniformity across 100mm diameter wafer should be 5 percent or less. The uniformity is defined as (maximum etching depth minus minimum etching depth) divided by twice the mean. The vendor must also provide the following with the quotation: 1. Sample description (mask material, thickness, substrate etc.) 2. Process conditions (etching recipe, etching rate, etc.) 3. SEM images associated with the data measurements. 16. Acceptance and Inspection: The following tests will be conducted, by NIST, post-award at the Contractor?s facility. NIST reserves the right to change or include additional materials for testing purposes. For Chlorine based module: GaAs etching a) Patterns are defined by the photo mask of NIST. NIST will provide the samples prior to testing at the Contractor?s facility. b) 1.2um thick S1813 photoresist etch mask c) Etching 1um deep over 100mm in diameter GaAs d) Selectivity greater than 5 e) Etching rate greater than 500nm/min. f) Side wall smoothness less than 5nm g) Profile 90 degrees (less than 1 degree deviation) h) CD control less than plus or minus 5 percent i) Etching uniformity across 100mm diameter wafer should be 5 percent or less. j) Wafer to wafer variation less than plus or minus 5 percent. Al etching a) Patterns are defined by the photo mask of NIST. NIST will provide the photo mask prior to testing at the Contractor?s facility. b) 1.2um thick S1813 photoresist etch mask a) Etching 1um Al on 100mm in diameter glass substrate b) Selectivity greater than 2 c) Etching rate greater than 300nm/min. i) Side wall smoothness less than 5nm j) Profile 90 degrees ( less than 1 degree deviation) k) CD control less than plus or minus 5 percent l) Etching uniformity across 100mm diameter wafer should be 5 percent or less. m) Wafer to wafer variation less than plus or minus 5 percent. For Fluorine based module: Deep SiO2 etching a) Patterns are defined by the photo mask of NIST. NIST will provide the samples prior to testing at the Contractor?s facility. b) 1.2um thick S1813 photoresist and/or 1um Al etch mask c) Etching 10um SiO2 over 100mm in diameter fused silica d) Selectivity greater than 10 e) Etching rate greater than 500nm/min. f) Side wall smoothness less than 5nm g) Profile 90 degrees (less than 1 degree deviation) h) CD control less than plus or minus 5 percent i) Etching uniformity across 100mm diameter wafer should be 5 percent or less. j) Wafer to wafer variation less than plus or minus 5 percent Line Item 0002: Installation and Training: The Contractor shall provide installation for the Multipurpose Plasma Etcher. Installation, at a minimum, shall include uncrating/unpackaging of all equipment, set-up and hook-up of the etcher, demonstration of all required specifications, and removal of trash. Onsite installation and demonstration shall be done at NIST, Gaithersburg, MD. The Contractor shall schedule and facilitate one (1) training session for three (3) technical personnel at NIST. The training shall provide a thorough demonstration of all equipment functions, data administration, basic troubleshooting, and hardware/software operation, cleaning and basic maintenance, leak-detection, and minor system modifications. The training may be completed at NIST immediately after installation and demonstration of performance specifications, but no later than 30 days after installation. ***The Contractor shall provide minimum of one (1) year warranty coverage for the instrumentation. On-site warranty coverage must be included at no additional cost to the Government. Twenty-Four (24) hour phone response time is required and forty-eight (48) hour on-site service is required. *** ***Delivery shall be provided not later than 4 months after receipt of an order and installation shall be no later than 30 days after delivery. Delivery shall be FOB Destination. FOB Destination means: The Contractor shall pack and mark the shipment (by clean-room equipment standard) in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The Contractor shall deliver all line items to NIST, Building 301, Shipping and Receiving, Gaithersburg, MD 20899-1640. *** Award shall be made to the offeror whose quote offers the best value to the Government, price and other factors considered. The Government will evaluate quotations based on the following evaluation criteria: 1) Technical Capability factor "Meeting or Exceeding the Requirement", 2) Past Performance, 3) Past Experience, and 4) Price. Technical Capability, Past Performance, and Past Experience, when combined, shall be more important than price. If Technical Capability, Past Performance, and Past Experience are reasonably equivalent among quotations, price shall be the determining factor. Technical Capability: Evaluation of Technical Capability will be based on the information provided in the quotation. Quoters shall include product literature, which addresses all specifications & clearly documents that the product offered meets or exceeds the specifications identified herein. Test data shall be evaluated and utilized to validate the performance specifications within the product literature and performance specifications not documented through product literature. Past Performance: Past Performance will be evaluated to determine the overall quality of the product and service provided and the offeror?s history of meeting delivery schedules for prior deliverables. Evaluation of Past Performance shall be based on the references provided and/or the quoter?s recent and relevant procurement history with NIST or its? affiliates. Offerors must provide a list of at least three (3) references to whom the same or similar equipment has been provided. Past Experience: The Contractor shall describe their past experience performing similar work, explain how their experience is relevant to this project and how their experience will ensure successful completion of the project. Past Performance, Past Experience, and Price shall not be evaluated on quotes that are determined technically unacceptable in accordance with the Technical Capability Evaluation factor. *** The full text of a FAR provision or clause may be accessed electronically at http://acquisition.gov/comp/far/index.html. *** *** The following provisions apply to this acquisition: 52.212-1 Instructions to Offerors-Commercial Items; 52.212-3 Offerors Representations and Certifications- Commercial Items. *** *** Offerors must complete annual representations and certifications on-line at http://orca.bpn.gov in accordance with FAR 52.212-3 Offerors Representations and Certifications- Commercial Items. If paragraph (j) of the provision is applicable, a written submission is required. ***The following clauses apply to this acquisition: 52.204-7 Central Contractor?s Registration (CCR) Database; 52.212-4 Contract Terms and Conditions?Commercial Items; 52.212-5 Contract Terms and Conditions Required to Implement Statutes or Executive Orders?Commercial Items including subparagraphs: (1) 52.203-6, Restrictions on Subcontractor Sales to the Government, with Alternate I; (3) 52.219-4, Notice of Price Evaluation Preferences for HUBZone Small Business Concerns (if the offeror elects to waive the preference, it shall so indicate in it?s offer); (7) 52.219-8, Utilization of Small Business Concerns; (8) (iii) 52.219-9 Small Business Subcontracting Plan; (15) 52.222-3, Convict Labor; (16) 52.222-19 Child Labor ? Cooperation With Authorities And Remedies; (17) 52.222-21, Prohibition of Segregated Facilities; (18) 52-222-26, Equal Opportunity; (19) 52.222-35, Equal Opportunity for Special Disabled Veterans, Veterans of the Vietnam Era, and Other Eligible Veterans; (20) 52.222-36, Affirmative Action for Workers with Disabilities; (21) 52.222-37, Employment Reports on Special Disabled Veterans, Veterans of the Vietnam Era, and Other Eligible Veterans; (22) 52.222-39, Notification of Employee Rights Concerning Payment of Union Dues or Feeds (Dec 2004) (E.O. 13201); (26) 52.225-5, Trade Agreements (NOV 2006); (27) 52.225-13 Restriction on Certain Foreign Purchases; (32) 52.232-33, Payment by Electronic Funds Transfer-Central Contractor Registration. Department of Commerce Agency-Level Protest Procedures Level above the Contracting Officer is also incorporated. It can be downloaded at www.nist.gov/admin/od/contract/agency.htm. *** This is an Open-Market Combined Synopsis/Solicitation for equipment as defined herein. The Government intends to award a Purchase Order as a result of this Combined Synopsis/Solicitation that will include the terms and conditions that are set forth herein. In order to facilitate the award process, ALL quotes shall include a statement regarding the terms and conditions herein as follows: The offeror shall state ?The terms and conditions in the solicitation are acceptable to be included in the award document without modification, deletion, or addition.? OR The offeror shall state ?The terms and conditions in the solicitation are acceptable to be included in the award document with the exception, deletion, or addition of the following: Offeror shall list exception(s) and rationale for the exception(s) ***All quoters shall submit the following: 1) An original and one (1) copy of a quotation which addresses all of the above line items; 2) An original and one (1) copy of the technical description and/or product literature; 3) Description of commercial warranty, 1 year extended warranty, and service/maintenance options; 4) An original and one (1) copy of the most recent published price list(s), 5) Past performance references which must include the company/organizations name, contact person, phone number, and e-mail address, 6) A description of relevant past experience, and 7) All required test data. ***All quotes shall be received not later than 3:00 PM local time, on August 17, 2007 at the National Institute of Standards & Technology, Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, MD 20899-1640, Attn: Andrea Parekh. Any questions or concerns regarding this solicitation should be forwarded in writing via e-mail to the Contract Specialist (Andrea G. Parekh) @ andrea.parekh@nist.gov. Because of heightened security, FED-EX, UPS, or similar delivery methods are the preferred method of delivery of quotes. If quotes are hand delivered, delivery shall be made on the actual due date through Gate A, and a 24-hour (excluding weekends and holidays) prior notice shall be made to the Contracts Office at 301-975-6984. NIST is not responsible for late delivery due to the added security measures. In addition, offerors/quoters who do not provide 24-hour notification in order to coordinate entrance to the NIST campus shall assume the risk of not being able to deliver offers/quotes on time. The Government is not responsible for the amount of time required to clear unannounced visitors, visitors without proper identification and without complete information that would allow delivery (i.e. point of contact, telephone POC, bldg., room number, etc.). If 24-hour notification was not provided, it is suggested your company representative or your courier service arrive at NIST at least 90 minutes prior to the closing time in order to process entry to the campus through the visitor center and complete delivery. Notice shall include the company name, name of the individual making the delivery, and the country of citizenship of the individual. For non-US citizens, the following additional information will be required: title, employer/sponsor, and address. Please ensure that the individual making the delivery brings photo identification, or they will be denied access to the facility. E-mailed quotes are acceptable. Faxed quotes will NOT be accepted. ***
- Place of Performance
- Address: 100 Bureau Drive, Gaithersburg, MD, Mailstop 1640
- Zip Code: 20899-1640
- Country: UNITED STATES
- Zip Code: 20899-1640
- Record
- SN01354397-W 20070729/070727220513 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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