MODIFICATION
59 -- Admendment to solicitation W911QX07T0221 to include SOW
- Notice Date
- 8/29/2007
- Notice Type
- Modification
- NAICS
- 334516
— Analytical Laboratory Instrument Manufacturing
- Contracting Office
- RDECOM Acquisition Center - Adelphi, ATTN: AMSRD-ACC, 2800 Powder Mill Road, Adelphi, MD 20783-1197
- ZIP Code
- 20783-1197
- Solicitation Number
- W911QX07T0221
- Response Due
- 9/10/2007
- Archive Date
- 11/9/2007
- Point of Contact
- crystal.demby, 301-394-5332
- E-Mail Address
-
RDECOM Acquisition Center - Adelphi
(crystal.demby@us.army.mil)
- Small Business Set-Aside
- N/A
- Description
- C.1 Overview: C.1.1 The required system is to be a Brand Name or Equal purchase of a Nanoquest III ION microprocessor controled Beam Etching system. The Ion Beam Etching system shall be used for general purpose etching of thin films for micro device research and fabri cation. The system shall be capable of both inert gas etching and reactive etching. C.1.2 The system is intended for use in developing new processes and techniques in semiconductor and Micro Electro Mechanical Systems (MEMS) fabrication and shallbe capable of handling a minimum of a 3-wafer batch and multiple wafer sizes with planetary operation. C.1.3 Materials to be ion beam etched include: Table 1. MATERIALS Gold (Au) Nickel (Ni) Gold Tin (AuSn) Platinum (Pt) Chromium (Cr) Silicon (Si) Aluminum (Al) Titanium (Ti) Germanium (Ge) Silver (Ag) Palladium (Pd) PZT (Lead Zirconate Titanate) Copper (Cu) Pyrex Silicon Dioxide (SiO2) Silicon Nitride (Si3N4) Aluminum Nitride (AlN) Titanium Dioxide (TiO2) C.1.4 Performance specifications: Table 2. PERFORMANCE SPECS PROPERTY VALUE Substrate temperature Not to exceed 90 degrees celcius with chiller running Process vacuum 4x10-4 Torr Base pressure less than 1x10-7 Torr Pumpdown rate 5x10-7 Torr in 60 minutes Uniformity across wafer [%] less than or equal to +/- 5.0 across a 150mm wafer less than or equal to +/- 3.0 across a 100mm wafer Uniformity wafer to wafer in batch [%] less than or equal to +/- 3.0 Uniformity run to run [%] less than or equal to +/- 5.0 Etch rates Typical of published values re: Commonwealth Scientific ARL materials at 5 degrees off normal incidence and 500eV Pt: ~525 A/min SiO2: ~355 A/min AlN: ~175 A/min PZT: ~225 A/min C.2 Salient Characteristics: C.2.1 Basic System: The Contractor shall provide a system consisting of a non-magnetic stainless steel vacuum chamber minimum size of 25 feet DIA x 26 feet deep, with welded stainless steel cooling/heating passages. The Contractor shall provide ports for the ion source, p umping, substrate stage, viewing windows with manual shutters, auxiliary, electrical and gas feedthroughs, and future end point detection probe. The Contractor shall ensure that a hinged rear door is provided for easy maintenance access to the process ch a mber. C.2.2 The Contractor shall ensure overall system dimensions do not exceed 8 feet long by 5 feet deep by 7feet 4 inches tall and outfitted with wheels for easy positioning. The Contractor shall ensure that the systems electrical components are based on vo ltages, frequency and currents commonly used in the USA. The Contractor shall ensure that the system is Class 100 compatible in its entirety. C.2.3 The Contractor shall ensure that the process control is computer based with independent control of ion energy, ion current density, and incidence angle. The Contractor shall ensure that recipes are capable of multiple step processing at varying pro cess parameters. C.3 Ion Beam Etch System: C.3.1 The Contractor shall provide a system that includes tooling to handle 4 foot and 6 foot wafers. The Contractor shall ensure that the substrate stage is a double rotating planetary and direct water cooled via a dedicated heat exchanger. The Contra ctor shall ensure that the stage is capable of ion beam milling wafers at normal incidence as well as angles ranging between +/- 90 degrees from normal incidence. The Contractor shall ensure that the substrate stage iscapable of providing wafer rotation s peeds between 0 and 10 rpm. The Contractor shall provide a beam probe mounted on the stage to measure ion beam current density. The Contractor shall snure that stage positioning and ion source shutter are pneumatically operated. C.3.2 The Contracto r shall ensure that ion source is to be at least 22 cm, RF based filament-less and utilizing a hollow cathode neutralizer. C.3.3 The Contractor shall ensure that the chamber is heated, settable from room temperature up to 80 degree celcius. The Contractor shall provide two 2 sets of chamber liners with the system. C.3.4 The Contractor shall ensure that the process controller provides programmable recipe development with capability for multiple step processing at various stage angles, ion source conditions, and gas flows. C.3.5 The Contractor shall provide two 2 additional digital mass flow controllers for reactive gases - Oxygen and Nitrogen along with the possibility of using CF4 using the N2 calibrated mass flow controller in addition to digital mass flow control for th e ion source and neutralizer operation,. C.4 Pumping System: The Contractor shall ensure that the system provides high vacuum capabilities through a cryopump based vacuum system with a VAT valve for pump isolation. The Contractor shall ensure that the roughing pump shall be an oil-free design to reduce maintenance and contamination. The Contractor shall ensure that the pumping system is capable of achieving the performance specifications listed in Table 3. Table 3. Pump System Specifications: Base Pressure (48 hour pump down) [Torr] less than or equal to 5.0 e -8 Leak Rate [Torr*l/s] less than or equal to 4.0 e -5 Base Pressure after 1 hour of pumping [Torr] less than or equal to 4.0 e -7 C.5 Safety: The Contractor shall meet current industry standard requirements for safety including the use of EMO Emergency Off panic buttons, shielding and interlocks for hazardous areas including high voltages and moving parts. C.6 Software: The Contractor shall provide current Tool Control Software. The Contractor shall provide all new tool control software issues and upgrades at no cost for a time of no less than 3 three years after the acceptance of the tool. C.7 Testing: The Constractor shall provide the Government the option to witness pre-delivery acceptance testing of the ion mill tool at the manufacturer's site. The exact acceptance tests will be worked out by the government prior to testing and will include a demonst ration of any or all of the specifications in this SOW. The Contractor shall not ship the tool until the Government has given written authorization after confirming the acceptance test results. C.8 Training: The Contractor shall provide a minimum of two 2 days of Operations and Maintenance training, on-site at the Army Research Laboratory, Adelphi, MD, for up to six 6 participants. C.9 Documentation: The Contractor shall provide 2 two complete sets of electrical/vacuum/pneumatic/assembly diagrams and operating manuals. The Contrator shall provide one manual on clean room paper. C.10 Maintenance and Service: The Contractor shall provide technical support during business hours 8:00 AM to 5:30 PM EST for the life of the tool The Contractor shall provide service calls with required repair parts within 48 hours from notification by the Government Technical Point of Contact. C.11 Installation and Acceptance: The Contractor shall deliver and install the tool to the Zahl Physical Science Laboratory building in Adelphi MD. The Contractor shall demonstrate full conformance to the requirements and specifications as called out in the Statement of Work. C.12 Warranty: The Contractor shall provide a standard warranty to include parts excepting consumable parts and materials and labor for a period of at least one 1 year from the date of installation and demonstration of full operational compliance with the Statement of Wo rk and acceptance by the Government. C.14 Option: Wearable Parts: A Spare parts kit, consisting of items subject to relatively rapid ware such as would be provided to 24 x 7 customers, shall be available for purchase. This would inc lude such items as valves, O rings, relays, shields, etc. An extensive list of all wearable items is to be provided. NOTE: THIS NOTICE WAS NOT POSTED TO FEDBIZOPPS ON THE DATE INDICATED IN THE NOTICE ITSELF (29-AUG-2007); HOWEVER, IT DID APPEAR IN THE FEDBIZOPPS FTP FEED ON THIS DATE. PLEASE CONTACT fbo.support@gsa.gov REGARDING THIS ISSUE.
- Web Link
-
Link to FedBizOpps document.
(http://www.fbo.gov/spg/USA/USAMC/DAAD17/W911QX07T0221/listing.html)
- Place of Performance
- Address: RDECOM Acquisition Center - Adelphi ATTN: AMSRD-ACC, 2800 Powder Mill Road Adelphi MD
- Zip Code: 20783-1197
- Country: US
- Zip Code: 20783-1197
- Record
- SN01390129-F 20070831/070829230302 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
| FSG Index | This Issue's Index | Today's FBO Daily Index Page |