FILE | 66 | RAPID THERMAL PROCESSOR SYSTEM FOR SEMICONDUCTOR WAFERS - Specifications

FBO DAILY ISSUE OF AUGUST 27, 2008 FBO #2466
DOCUMENT

66 -- RAPID THERMAL PROCESSOR SYSTEM FOR SEMICONDUCTOR WAFERS - Specifications

Notice Date: 8/25/2008
Notice Type: Specifications
NAICS: 333295 — Semiconductor Machinery Manufacturing
Contracting Office: NASA/Glenn Research Center, 21000 Brookpark Road, Cleveland, OH 44135
ZIP Code: 44135
Solicitation Number: NNC08266570Q
Response Due: 9/5/2008
Archive Date: 8/25/2009
Point of Contact: Karin E. Huth, Contracting Officer, Phone 216-433-2770, Fax 216-433-5489, />
E-Mail Address: karin.e.huth@nasa.gov<br
Small Business Set-Aside: Total Small Business
Web Link: FedBizOpps Complete View
(https://www.fbo.gov/?s=opportunity&mode=form&id=856add9ab2986962b749758ce2e4ae87&tab=core&_cview=1)
Document(s): Specifications; File Name: Specifications (http://prod.nais.nasa.gov/eps/eps_data/132029-OTHER-001-001.doc); Link: http://prod.nais.nasa.gov/eps/eps_data/132029-OTHER-001-001.doc; Note: If links are broken, refer to Point of Contact above or contact the FBO Help Desk at 877-472-3779.
Record: SN01649733-W 20080827/080825220942-856add9ab2986962b749758ce2e4ae87 (fbodaily.com)
Source: FedBizOpps Link to This Notice
(may not be valid after Archive Date)

| FSG Index | This Issue's Index | Today's FBO Daily Index Page |