FILE | A | Chip-Scale Mechanical Spectrum Analyzers (CSSA) - Full DARPA-BAA-08-66 document

FBO DAILY ISSUE OF OCTOBER 18, 2008 FBO #2518
DOCUMENT

A -- Chip-Scale Mechanical Spectrum Analyzers (CSSA) - Full DARPA-BAA-08-66 document

Notice Date: 10/16/2008
Notice Type: Full DARPA-BAA-08-66 document
NAICS: 541712 — Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
Contracting Office: Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, Virginia, 22203-1714
ZIP Code: 22203-1714
Solicitation Number: DARPA-BAA-08-66
Archive Date: 10/30/2009
Point of Contact: Dennis L Polla,, Phone: xxxxxxxxxxxx
E-Mail Address: dennis.polla@darpa.mil
Small Business Set-Aside: N/A
Description: DARPA is soliciting innovative research proposals in the area of Chip-Scale Spectrum Analyzers (CSSA). The objective of this program is to fully develop and demonstrate robust microsystem technologies for realizing high quality factor (Q) resonators and associated filter circuits that reduce the size and power consumption while enhancing the performance of spectrum analyzers and other devices. CSSA technologies will advance the state-of-art in fabricating individual resonators and similar devices. It is anticipated that these advances will enable the fabrication of highly miniaturized, high-Q resonators in circuits and arrays interconnected with electronics to significantly improve system performance. Arrays can make massive parallelism possible and new flexible circuit architectures capable of much higher performance levels can then be attained. DARPA will post a consolidated Question and Answer response after November 24, 2008 before final full proposals are due. In order to receive a response to your question, submit your question by November 17, 2008 to BAA08-66@darpa.mil. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this DARPA BAA, should be directed to BAA08-66@darpa.mil. Full DARPA-BAA-08-66 document attached.
Web Link: FedBizOpps Complete View
(https://www.fbo.gov/?s=opportunity&mode=form&id=f72c4da46778e93f16d9519e52e6dd3e&tab=core&_cview=1)
Document(s): Full DARPA-BAA-08-66 document; File Name: Full DARPA-BAA-08-66 document (cssa_darpa_baa_08_66_for_posting_16oct08.pdf); Link: https://www.fbo.gov//utils/view?id=2c9884e8334307945a4b247b3ae989e0; Bytes: 476.30 Kb; Note: If links are broken, refer to Point of Contact above or contact the FBO Help Desk at 877-472-3779.
Place of Performance: Address: United States
Record: SN01692579-W 20081018/081016214727-f72c4da46778e93f16d9519e52e6dd3e (fbodaily.com)
Source: FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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A -- Chip-Scale Mechanical Spectrum Analyzers (CSSA) - Full DARPA-BAA-08-66 document