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FBO DAILY ISSUE OF DECEMBER 24, 2008 FBO #2585
SOLICITATION NOTICE

59 -- Integrated Circuits (ICs) in support of High Energy Physics, 3D integrated circuit project, 8 " diameter CMOS Wafers with 0.13 micron feature size.

Notice Date
12/22/2008
 
Notice Type
Presolicitation
 
NAICS
334419 — Other Electronic Component Manufacturing
 
Contracting Office
Department of Energy, Fermi National Accelerator Laboratory, Fermilab, P.O. BOX 500, MAIL STOP 210 (WH4W), BATAVIA, Illinois, 60510
 
ZIP Code
60510
 
Solicitation Number
205867-TRP(RFC)
 
Archive Date
1/23/2009
 
Point of Contact
Robert F Cibic,, Phone: 630-840-3528, Joe P. Collins,, Phone: 630-840-4169
 
E-Mail Address
bcibic@fnal.gov, jcollins@fnal.gov
 
Small Business Set-Aside
N/A
 
Description
Technical Requirements: 8 " diameter CMOS Wafers with 0.13 micron feature size. Wafer pairs are to be vertically integrated using face-to-face copper thermocompression bondingprovidingtwo tiers of interconnected CMOS transistors and associated metalization. The top Waferof the pair is to be thinned to expose topside through-silicon-vias. connection to external circuite is provided by patterning contacts to the exposed through-silicon-vias. Quantity: One lot of ~25 Wafers. Delivery Requirement: 20 weeks after delivery of design files by Fermilab. Project: The Wafers are in support of High Energy Physics. Experience: Manufacturer shall have proven experience in the design/production of this Wafer requirement.
 
Web Link
FedBizOpps Complete View
(https://www.fbo.gov/?s=opportunity&mode=form&id=b65115b04ab4dfaadc55cd5f49a384dd&tab=core&_cview=1)
 
Place of Performance
Address: Fermi Research Alliance LLC, Kirk Road & Wilson Street, PO Box 500, Batavia, Illinois, 60510, United States
Zip Code: 60510
 
Record
SN01722820-W 20081224/081222214951-b65115b04ab4dfaadc55cd5f49a384dd (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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