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FBO DAILY ISSUE OF MARCH 21, 2009 FBO #2672
SOLICITATION NOTICE

A -- Y-Dimensional Enhanced Sensor (YES) - DARPA-BAA-09-30 document

Notice Date
3/19/2009
 
Notice Type
Presolicitation
 
NAICS
541712 — Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
 
Contracting Office
Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, Virginia, 22203-1714
 
ZIP Code
22203-1714
 
Solicitation Number
DARPA-BAA-09-30
 
Archive Date
4/2/2010
 
Point of Contact
Stuart Horn,, Phone: 571-218-4271
 
E-Mail Address
Stuart.Horn@darpa.mil
 
Small Business Set-Aside
N/A
 
Description
Full DARPA-BAA-09-30 document DARPA seeks innovative proposals that address the technical and fabrication issues based on a preliminary design of a single chip focal plane array (FPA) that detects passive radiation in the Visible to Short Wave Infrared Vis-SWIR and Mid Wave Infrared MWIR bands and a laser return for three-dimensional (3D) imaging. This effort planned as a short duration single phase program that provides the preliminary design and performance measures of the single chip FPA. The results of this design and analysis may be used to specify technical and performance metrics in a potential follow-on BAA solicitation leading to a program which will address the development of the FPA integrated into a package suitable for laboratory evaluation and demonstration in prototype systems. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a full proposal to this BAA, should be directed to BAA09-30@darpa.mil. See full BAA document attached.
 
Web Link
FedBizOpps Complete View
(https://www.fbo.gov/?s=opportunity&mode=form&id=0491eb721c40c1b55ee22a6961a8935d&tab=core&_cview=1)
 
Record
SN01773058-W 20090321/090319220039-0491eb721c40c1b55ee22a6961a8935d (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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