SPECIAL NOTICE
A -- Request for Information (RFI): High-Density Energy Conversion Magnetic MEMS (HiDEC)
- Notice Date
- 11/10/2009
- Notice Type
- Special Notice
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, Virginia, 22203-1714
- ZIP Code
- 22203-1714
- Solicitation Number
- DARPA-SN-10-04
- Archive Date
- 12/15/2009
- Point of Contact
- Jack Judy,
- E-Mail Address
-
DARPA-SN-10-04@darpa.mil
(DARPA-SN-10-04@darpa.mil)
- Small Business Set-Aside
- N/A
- Description
- DESCRIPTION The Microsystems Technology Office (MTO) of the Defense Advanced Research Projects Agency (DARPA) is seeking ideas that may support a new DARPA program to demonstrate innovative concepts and technologies that dramatically increase the Department of Defense's (DoD's) technology for the use of MEMS devices featuring magnetic materials having dimensions from 1 to 1000 micrometers in thickness that can be formed or patterned with a high aspect ratio. It is known that the advantages of electrostatic interaction are dominant at submicron dimensions, but that magnetics have substantial advantages at larger dimensions. To date, no broad effort has successfully exploited magnetic features over the full 3-D size range of 1 to 1000 micrometers. This has limited the miniaturization of inductors, transformers, energy-storage/energy-conversion systems, actuators, motors, sensors, magnetocaloric coolers, and other magnetically enhanced devices. The use of novel materials or fabrication techniques at these scales has only been demonstrated at very small production volumes and with poor repeatability. DARPA is interested in detailed submissions that provide new ideas on approaches to design, fabricate, and test high-performance thick magnetic MEMS. These magnetic materials must possess the potential to radically change the state-of-the-art with respect to multiple magnetic properties, such as magnetic moment, coercivity, remanence, energy product, or high-frequency loss. Ideas related to advances of technologies such as memory, read-write heads, and spintronics should not be submitted. REQUESTED INFORMATION DARPA appreciates responses from all capable and qualified sources including, but not limited to, universities, university affiliated research centers, FFRDCs, and private or public companies. To ensure that all technically relevant aspects of the Request for Information (RFI) are fully addressed, technologies and capabilities should target the following criteria: •1. Novelty: Of particular interest are novel methods for fabricating, assembling, or patterning of magnetic materials over the full range of 1 to 1000 micrometers in thickness with high aspect ratios. Intellectual property should be clearly established. Specifically excluded from this RFI are iterative improvements on existing magnetic film technologies. Any ideas submitted should be revolutionary in approach, and submitters should clearly indicate how their approach radically shifts the traditional paradigms of working at these dimensions. Concepts submitted must also address the underlying science and limitations of a proposed approach. Primary data is strongly encouraged. •2. Capability: Any concepts submitted must display revolutionary improvements over state-of-the-art devices in both feature size and placement complexity such as multiple magnetization orientations. Additionally, concepts must provide advancement across multiple performance parameters (permeability, coercivity, remanence, etc.). Large sacrifices to improve only one measure of performance are not of interest. The CMOS process compatibility and low-stress nature of magnetic material processing technologies is desired but not required. •3. Market readiness: A goal of this RFI is to identify scalable concepts for use in electronic systems at all levels from the military base to the soldier in the field. If available information describing a pathway to production is relevant, then it should be included. A risk analysis specific to the proposed concept including risk factors for both engineering and economical aspects of the technology is also encouraged. INSTRUCTIONS TO RESPONDERS When responding to this RFI, please include examples of current and previous work that have enabled the technology. Experimental demonstration of concepts, models, and/or information about currently licensed products is of particular interest. Acknowledged technological barriers that should be addressed include scientific development and optimization, scale-up and manufacturing, limits on operational conditions, as well as expected device operational lifetime. An analysis of limiting factors such as materials, chemistry, and/or engineering required for the proposed concept should be highlighted. Respondents are encouraged to be as succinct as possible while providing actionable insight. FORMAT Responses should adhere to the following formatting and outline instructions: •1. Written submission format specifications include 12 point font, single spaced, single-sided, and 8.5 by 11 inches paper, with 1-inch margins. All submissions must be electronic, adhere to the content formatting described below and use one of the following file formats: Adobe PDF or Microsoft Word. •2. Cover Page (1-page) •a. Title •b. Organization •c. Responder's technical and administrative points of contact (names, addresses, phone and fax numbers, and email addresses) •3. Technical areas (up to 3-pages) •a. A discussion of the capability/challenge addressed (from your perspective) •b. A technical description of the proposed material or process including but not limited to its novelty, scalability, and limitations •c. Examples of success •d. Identify current data (if any) •e. Market readiness •4. References (1-page) •a. All references to previously published work should be contained within this space. Additionally, all interested parties should submit a Microsoft PowerPoint slide presentation, not to exceed 3 slides, addressing the technical aspects of the response. Two slides are to be used for a bulleted summarization of the information presented in the written submission. Figures not included in the written submission may be inserted into the space available on these slides. The third slide is to be a 'penta-chart' summarization of the technology (the 'penta chart' should follow the format given on https://www.fbo.gov/utils/view?id=4715340db520ba4ef2f2a7fa69d55557 ). The purpose of this slide is to visually and succinctly indicate the new insights motivating the proposed effort, the main objectives, the underlying technical mechanisms, fundamental assumptions and limitations, key innovations, expected impact, and other unique aspects of the proposal. SUBMISSION Responses to this RFI should be submitted to DARPA-SN-10-04@darpa.mil. DO NOT SEND ZIP FILES. Please refer to the "HiDEC RFI" in all correspondence. All technical and administrative correspondence and questions regarding this announcement should also be submitted to the same email address. The due date for responses is November 30, 2009. DISCLAIMERS AND IMPORTANT NOTES This is an RFI issued solely for information and new program planning purposes; it does not constitute a formal solicitation for proposals. In accordance with FAR 15.201(e), responses to this notice are not offers and cannot be accepted by the Government to form a binding contract. Submission is voluntary and is not required to propose to a subsequent Broad Agency Announcement (BAA) (if any) or other research solicitation (if any) on this topic. DARPA will NOT provide reimbursement for costs incurred in responding to this RFI. NO CLASSIFIED INFORMATION SHOULD BE INCLUDED IN THE RFI RESPONSE OR SLIDES. It is the submitter's responsibility to clearly define to the Government what is considered proprietary data. Any proprietary information should be clearly labeled as "proprietary". DARPA will disclose submission contents only for the purpose of review by DARPA staff, other Government agencies, or DARPA Support Contractors/SETA's. Respondents are advised that DARPA is under no obligation to acknowledge receipt of the information received or provide feedback to respondents with respect to any information submitted under this RFI.
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