MODIFICATION
A -- High Temperature Diode Pumped Laser Igniter Assembly for Artillery
- Notice Date
- 4/16/2010
- Notice Type
- Modification/Amendment
- Contracting Office
- US Army, Army Contracting Command, Joint Munitions and Lethality (JM&L) Contracting Center, Picatinny Arsenal, New Jersey 07806-5000
- ZIP Code
- 07806-5000
- Solicitation Number
- W15QKN-10-R-0202
- Response Due
- 5/10/2010
- Archive Date
- 5/10/2011
- Point of Contact
- Jessica Bird, Contract Specialist, (973)724-6965
- E-Mail Address
-
Jessica Bird
(jessica.l.stogner@us.army.mil)
- Small Business Set-Aside
- N/A
- Description
- This solicitation announcement is in advance of the formalized amendment to beissued on 19 April 2010. Due to system issues, an amendment is not possible to post until this date. However the question and answer which will be posted in that amendment are listed below for review. Question 10: The Governments answer to question #9 (Amendment 0003) states, The offeror must be vertically integrated and have in house processing capability to manufacture high temperature diode laser bars from silicon wafer substrates. Is the use of silicon substrates a new requirement for this contract? Answer 10: This is not a new requirement. Our understanding is that industry typically uses silicon wafer substrates however; any substrate material may be used providing the requirements identified in the solicitation are satisfied.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/notices/b739c73ad16a1c396ab6a1b9c9f101fd)
- Record
- SN02124248-W 20100418/100416235149-b739c73ad16a1c396ab6a1b9c9f101fd (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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