SRCSGT | A | Solder bumps diced and bonded

FBO DAILY ISSUE OF JULY 25, 2010 FBO #3165
SOURCES SOUGHT

A -- Solder bumps diced and bonded

Notice Date: 7/23/2010
Notice Type: Sources Sought
NAICS: 335999 — All Other Miscellaneous Electrical Equipment and Component Manufacturing
Contracting Office: Department of Energy, SLAC National Accelerator Lab, SLAC National Accelerator Lab, 2575 Sand Hill Road, Menlo Park, California, 94303, United States
ZIP Code: 94303
Solicitation Number: 155044
Point of Contact: Julie M. Greer, Phone: 6509264165
E-Mail Address: greer@slac.stanford.edu
(greer@slac.stanford.edu)
Small Business Set-Aside: N/A
Description: 1 EA solder bumps and UBM on 1 ASIC and 2 sensor wafers Vendor would then dice the wafers and bond the resulting chips together.
Web Link: FBO.gov Permalink
(https://www.fbo.gov/spg/DOE/SLAC/STAN/155044/listing.html)
Place of Performance: Address: 2575 Sand Hill Rd, Menlo Park, California, 94025, United States; Zip Code: 94025
Record: SN02215558-W 20100725/100723234811-4010aad5b47fb24cfd64897d62d71e96 (fbodaily.com)
Source: FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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