AWARD
59 -- Circuit Card Assembly
- Notice Date
- 9/14/2010
- Notice Type
- Award Notice
- NAICS
- 334418
— Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Contracting Office
- Defense Logistics Agency, DLA Acquisition Locations, DLA Land and Maritime - BSM, P O Box 3990, Columbus, Ohio, 43216-5000, United States
- ZIP Code
- 43216-5000
- Solicitation Number
- SPM7M509R0098
- Archive Date
- 9/28/2010
- Point of Contact
- Ruth A Smith, Phone: 614-692-7428
- E-Mail Address
-
ruth.smith@dla.mil
(ruth.smith@dla.mil)
- Small Business Set-Aside
- N/A
- Award Number
- SPRPA1-09-G-001ZYM22
- Award Date
- 9/13/2010
- Awardee
- Northrop Grumman , 21240 Burbank Boulevard, Woodland Hills, California 91367, United States
- Award Amount
- $505035
- Line Number
- 0001,0002
- Description
- P/N 166890 87 Each Del: 14 mos NSN:5998006184757 FOB and I/A at origin
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DLA/J3/DSCC-BSM/Awards/SPRPA1-09-G-001ZYM22.html)
- Record
- SN02280699-W 20100916/100914235439-c5ac1e9f3f72e1a5fccf7c55420c1ea2 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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