MODIFICATION
N -- RAPID THERMAL PROCESSING SYSTEM - AMENDMENT
- Notice Date
- 4/13/2011
- Notice Type
- Modification/Amendment
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- RDECOM Contracting Center - Adelphi (RDECOM-CC), ATTN: AMSRD-ACC, 2800 Powder Mill Road, Adelphi, MD 20783-1197
- ZIP Code
- 20783-1197
- Solicitation Number
- W911QX11T0071
- Response Due
- 4/14/2011
- Archive Date
- 6/13/2011
- Point of Contact
- Barbara DeSchepper, 410-278-5425
- E-Mail Address
-
RDECOM Contracting Center - Adelphi (RDECOM-CC)
(barbara.deschepper@us.army.mil)
- Small Business Set-Aside
- Total Small Business
- Description
- The purpose of this amendment is to extend the response date to April 14, 2011 by 11:59 PM EST in order to provide answers to questions from potential offerors and change C.4.3 and C.4.4 (in bold) of the Statement of Work (SOW) as follows: Question: In the statement of work, C.4.3 and C.4.4 require quartz tubes and liners compatible with an AG Associates model 610 RTP system, are they for an existing AG 610 system? Answer: That is correct. These are OPTIONAL items that are requested for an EXISTING AG 610 system. STATEMENT OF WORK C.1 Background The US Army Research Laboratory (ARL), Adelphi, MD requires a commercially available automated rapid thermal anneal/process (RTA) or RTP) system. Processing piezoelectric materials comprised of lead zirconate titanate (PZT) is central to micro and nanodevice processing in the Specialty Electronic Materials and Sensors Cleanroom (SEMASC) facility. The RTA or RTP is critical to ensuring proper crystallization within PZT thin films so as to meet mission requirements. C.2 Requirements (CLIN 0001) The Contractor shall ensure that the available automated RTA or RTP system meets the materials compatibility listed in Table one (1) and specifications listed in Table two (2). Table 1. RTA/RTP Processed Materials Lead zirconate titanate (PZT) Lead titanate (PT) Plasma Enhanced Chemical Vapor Deposited (PECVD) Silicon Dioxide (SiO2) Titanium Dioxide (TiO2) Table 2. Specifications: Properties and Values of Required Processed Materials PROPERTYVALUE Uniformity across wafer [percent]greater than or equal to plus or minus 3.0 Uniformity wafer to wafer in batch [percent]greater than or equal to plus or minus 3.0 Uniformity across run [percent]greater than or equal to plus or minus 3.0 Uniformity run to run [percent]greater than or equal to plus or minus 3.0 Thermal Processing System - The Contractor shall ensure that the RTA/RTP system consists of the following: - a temperature heating rate of at least 100 degrees Celsius per second. - robotic wafer handling capable of operating with 100 millimeter (mm), 150mm, and 200mm diameter wafer sizes - a minimum temperature range of operation of 300 degrees Celsius to 900 degrees Celsius - across wafer temperature uniformity of plus or minus one (1) percent over full temperature range with no oscillations in temperature - an integrated chill station to thermally cool wafers prior to returning to wafer cassettes - a quartz processing chamber configured with a replaceable quartz liner - has a quartz wafer processing tray - a quad-layer tungsten halogen lamp array with individual lamp control - type N thermocouple temperature measurement. - an extended range pyrometer plus (ERP plus) internally cooled for extended temperature range from 350 to 1250 degrees Celsius - an electro polished stainless steel (316 liter) gas plumbing with VCR style connectors - three (3) mass flow controller (MFC) controlled gas lines for use with Argon, Nitrogen, and Oxygen gases - atmospheric pressure operation within process chamber - an integrated pre-mixing of gas prior to entry into processing chamber - fully exhausted such that all vapors generated during the thermal process are captured and are sent through Army Research Laboratory's (ARL) scrubbed exhaust - computer controlled interface for operating system - meet coating thickness performance requirements as outlined in Table two (2) - across wafer uniformity ranging from zero (0) to three (3) percent - wafer-to-wafer uniformity ranging from zero (0) to three (3) percent - computer controls with the following attributes: - Computer controller with integrated touch screen monitor - Multi-tasking multi-processor, real-time process control for maximum wafer throughput - Flexible calibration and robot alignment routines - User configurable password assignments - Real-time process data logging - Tracking by lot and wafer number - Alarm log with date and time in text format - Event log with date and time in text format - Local hard disk storage of all data - File transfer via 3.5 inch Floppy and/or a CD-RW and/or a Universal Serial Bus (USB) port for flash drive storage - Recipe file storage and retrieval - Gas compatibility safety tests during recipe creation - Interlock monitoring during processing - electrical components based on voltages, frequency and currents used in the USA - Class 100 compatibility in its entirety - has process programming and history logging backup through a disk drive based system (3.5 inch Floppy and/or a CD-RW) and/or a USB port for flash drive storage. - control systems that are operated in automatic mode utilizing one of the three modes: - programmed process operations - semi-automatic utilizing safety interlock features - manual mode allowing independent control of all operating components. - met current industry standard requirements for safety including the use of EMO (Emergency Off) panic buttons, shielding and interlocks for hazardous areas including high voltages and moving parts. C.2.1 Pre-installation Acceptance Tests - The Contractor shall ensure that the system is fully functional at the Contractor's facility in accordance with the Government's Pre-installation Acceptance Tests as follows: C.2.1.1. Demonstrate that the RTA or RTP system meets specifications as described in the salient characteristics, which includes wafer handling, thermal processing temperatures, ramp rates, temperature uniformity, gas line configuration, and computer control. C.2.1.2. Demonstrate that the RTA or RTP system is operationally functional, which includes: a. Substrate handling, queuing, and processing for at least 200 wafers (100mm in diameter) b. Temperature uniformity by processing 25 wafers coated with titanium in oxygen ambient to convert titanium to titanium dioxide. Final films to be measured by ellipsometry to verify across wafer uniformity and wafer-to-wafer uniformity. Ti coated wafers supplied as Government Furnished Property (GFP). c. Temperature range of operation of at least 300 degrees Celsius to 900 degrees Celsius d. Temperature heating ramp of at least 100 degrees Celsius per second C.2.2 Pre-installation Acceptance Tests Report - The Contractor shall submit a pre-installation acceptance tests report to the Contracting Officer Representative (COR) outlining the results of the acceptance tests. The COR will review and approve the acceptance test report within one (1) week of receiving the results and based on the results will authorize delivery of the RTA or RTP system. C.2.3 Delivery and Installation - The Contractor shall deliver and install the RTA or RTP system to the Army Research Laboratory, 2800 Powder Mill Road, Building 207, Room 3B-41 within eighteen (18) weeks of receiving approval of the acceptance test report from the COR C.2.4 Post-installation Acceptance Tests - The Contractor shall ensure that the RTA or RTP system is fully functional after the system has been installed in room 3B-41 at ARL using the following Government created acceptance tests: C.2.4.1. Demonstrate that the RTA or RTP system meets base specifications as described in C.2, which includes wafer handling, thermal processing temperatures, ramp rates, temperature uniformity, gas line configuration, and computer control. C.2.4.2. Demonstrate that the RTA or RTP is operationally functional, which includes: a. Substrate handling, queuing, and processing for at least 200 wafers (100mm in diameter) b. Temperature uniformity by processing two batches of 25 wafers coated with titanium in oxygen ambient to convert titanium to titanium dioxide. Final films to be measured by ellipsometry to verify across wafer uniformity and wafer-to-wafer uniformity. Ti coated wafers supplied as GFE. c. Temperature range of operation of at least 300 degrees Celsius to 900 degrees Celsius d. Temperature heating ramp of at least 100 degrees Celsius per second e. Crystallization of PZT thin films on PT coated substrates. Non-crystallized PZT coated substrates to be supplied as GFP. The Government shall complete verification via x-ray diffraction. C.2.5 Post-installation Acceptance Tests Report - The Contractor shall submit a post-installation acceptance test report to the COR outlining the results of the acceptance tests. The COR will approve the post installation acceptance test report within one (1) week of receiving the results. C.2.6 Operator and Maintenance Training - The Contractor shall provide two (2) days of on-site operator and maintenance training for eight (8) participants following the installation of the RTA or RTP system at the US Army Research Laboratory (ARL) in Adelphi, MD. The Contractor shall ensure the training occurs within one (1) month of receiving post installation acceptance test report approval from the COR. C.2.7 Troubleshooting - The Contractor shall respond to service call(s) (via email or telephone) and provide access via email or telephone to a technical support person to answer questions regarding tool operation, hardware troubleshooting and basic equipment operation and maintenance within 48 hours. C.2.8 Warranty - The Contractor shall provide a warranty for one (1) year beginning the first day of approval of the post-installation report as defined in C.2.5. The warranty shall include all labor, parts (excluding consumable parts and materials) including shipping, and travel to return the non-functional RTA or RTP system to the operational acceptance test specifications in Section C.2.4. C.3 DELIVERABLES C.3.1 The Contractor shall provide two (2) complete sets of electrical diagrams and operating manuals written in English at time of installation and delivery. The Contractor shall ensure that one (1) of the two (2) manuals provided is on clean room paper. C.3.2 The Contractor shall ensure that the software provided is current with a 2011 year of production. C.3.3 The Contractor shall deliver equipment within twenty (20) weeks of contract award. C.4 OPTIONAL ACCESSORIES (CLIN 0002): The Contractor shall price each option below separately. C.4.1 Closed loop water chiller to supply constant supply of chilled processed water to the RTA/RTP system C.4.2 Spare parts kit including but not limited to quartz tube, quartz tray, thermocouple (TC) wafer, ceramic end effectors for robotic handler, and o-rings. The Contractor shall ensure the spare parts kit consists of items such as subject to relatively rapid ware such as would be provided to customers operating the equipment in a 24 hour, seven (7) days a week environment. C.4.3 A quartz tube with integrated quartz liner compatible with the existingGovernment owned Model AG Associates 610 system. C.4.4 A quartz liner for aforementioned quartz tube compatible with the existingGovernment owned Model AG Associates 610 system.
- Web Link
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FBO.gov Permalink
(https://www.fbo.gov/notices/3d701938f7e87eea94f33b55c270ea37)
- Place of Performance
- Address: RDECOM Contracting Center - Adelphi (RDECOM-CC) ATTN: AMSRD-ACC, 2800 Powder Mill Road Adelphi MD
- Zip Code: 20783-1197
- Zip Code: 20783-1197
- Record
- SN02423935-W 20110415/110413234627-3d701938f7e87eea94f33b55c270ea37 (fbodaily.com)
- Source
-
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