SOURCES SOUGHT
66 -- CDMS Thin Film Deposition System
- Notice Date
- 11/18/2011
- Notice Type
- Sources Sought
- NAICS
- 333295
— Semiconductor Machinery Manufacturing
- Contracting Office
- Department of Energy, SLAC National Accelerator Lab, SLAC National Accelerator Lab, 2575 Sand Hill Road, Menlo Park, California, 94303, United States
- ZIP Code
- 94303
- Solicitation Number
- SLAC_171286(LL)
- Archive Date
- 12/4/2011
- Point of Contact
- Lorenza S. Ladao,
- E-Mail Address
-
lladao@SLAC.stanford.edu
(lladao@SLAC.stanford.edu)
- Small Business Set-Aside
- N/A
- Description
- SLAC seeks vendors that can provide the following: 1 Each of CDMS Thin Film Deposition System Instalation with the following minimum specifications: (1) The deposition system shall be capable of handling 4 or more 100 mm diameter by 33.33 mm thick Ge crystal substrates each weighing 1.4 kg. (2) Mechanical masking shall be provided to ensure that no film coatings occur on the side walls or reverse face of the crystal. The mechanical masking shall expose the front face of the crystal out to 1.6 mm from the outer edge of the substrate. (3) The deposition system shall be capable of simultaneous deposition on the four (or more) substrates and shall be capable of making depositions on both the front-side and back-side of the substrates without breaking vacuum (i.e., deposition on the front-sides, flip the substrates, followed by deposition on the back-sides). (4) A load-lock shall be provided for loading the Ge substrates. Initial pump down of the main chamber following substrate loading shall take less than 8 hours to reach a vacuum of 1×10-7 torr. Vendor shall specify type of high-vacuum pump to be used (turbo or cryo) and any associated throttle valves. (5) The vacuum chamber base pressure shall be 5×10-8 torr or better after overnight pumping. (6) The deposition system shall provide for sequential, DC magnetron sputtering with at least three targets (typically amorphous silicon, aluminum and tungsten) in a single deposition cycle, with the ability to apply a 0V to -200V DC bias to the substrates during deposition. Film thickness uniformity shall be better than ±3% across each substrate. Shutter(s) shall be provided to allow pre-sputtering of the targets. Vendor shall specify distance between target and substrate. (7) The deposition system shall be capable of substrate cleaning immediately prior to film depositions. Either RF etch with ground plane protection for the backside faces or an ion mill system is acceptable. The etch rate uniformity shall be ±10% or better. (8) The deposition system shall include at least two separate mass-flow-controllers with isolation valves and filters that will work with the following sputtering gases: Argon, Krypton and Nitrogen. (9) A Residual Gas Analyzer (RGA) with a mass range up to 100 amu and the ability to monitor the main chamber during depositions shall be provided. (10) All rotary-style pumps needed for operation and maintenance of the system (including RGA) shall be of oil-free design and operation. (11) The deposition system shall include computer control capability to operate, monitor and record parameters throughout the full deposition process (after the substrates are loaded). The system shall also be fully operational in a manual mode. (12) The deposition system shall be installed in room B04 of the Physics and Astrophysics Building on the Stanford University campus. The vendor shall verify that existing hallways and doorways provide sufficient clearance for delivery and installation of the deposition system and that the ceiling height (presently 100 inches) is sufficient for installation, operation and maintenance of the deposition system. The vendor shall maintain class 1000 clean-room protocol during installation. (13) The vendor shall list resources and services required to operate and maintain the deposition system, including electrical and cooling requirements. House chilled water, warm water, single-phase 120 V, and three-phase 480 V & 208 V are presently available in room B04. If additional services are required, vendor shall identify options for delivering the required services. Vendor shall specify the performance required of house chilled water in the absence of a chiller option and the cost of a vendor-supplied chiller option. THIS IS NOT A REQUEST FOR QUOTE. VENDORS INTERESTED IN BEING CONSIDERED AS A POTENTIAL SOURCE SHOULD IDENTIFY THEMSELVES AS AN "INTERESTED PARTY" VIA THE FBO PORTAL. DO NOT CONTACT THE SUBCONTRACT ADMINISTRATOR.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DOE/SLAC/STAN/SLAC_171286(LL)/listing.html)
- Place of Performance
- Address: SLAC NATIONAL ACCELERATOR LABORATORY, 2575 Sand Hill Road, Menlo Park, California, 94025, United States
- Zip Code: 94025
- Zip Code: 94025
- Record
- SN02625655-W 20111120/111118233942-a9bdc05b32fe881c58429cb0ca77f912 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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