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FBO DAILY ISSUE OF AUGUST 10, 2012 FBO #3912
MODIFICATION

66 -- High Density Plasma Enhanced Chemical Vapor Deposition (HD-PECVD) System

Notice Date
8/8/2012
 
Notice Type
Modification/Amendment
 
NAICS
334516 — Analytical Laboratory Instrument Manufacturing
 
Contracting Office
Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, Maryland, 20899-1640, United States
 
ZIP Code
20899-1640
 
Solicitation Number
SB1341-12-RP-0088
 
Archive Date
10/31/2012
 
Point of Contact
Joni L Laster, Phone: 301-975-8397, Patrick K Staines, Phone: (301)975-6335
 
E-Mail Address
joni.laster@nist.gov, patrick.staines@nist.gov
(joni.laster@nist.gov, patrick.staines@nist.gov)
 
Small Business Set-Aside
N/A
 
Description
This amendment is being issued to address vendor questions and answers as follows: Question: Does NIST have the intent to not connect the requirement for helium backside cooling with the "no kit - no open" substrate change requirement? Answer: NIST expects helium backside cooling to be available for all whole wafer processes. The due date/time remains unchanged. All respones shall be provided not later than 3pm EST on August 15, 2012.
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/spg/DOC/NIST/AcAsD/SB1341-12-RP-0088/listing.html)
 
Place of Performance
Address: 100 BUREAU DRIVE, GAITHERSBURG, Maryland, 20899, United States
Zip Code: 20899
 
Record
SN02832155-W 20120810/120809001357-917454bed08e9c58449029fa261e8b71 (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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