SPECIAL NOTICE
A -- Special Notice for Intrachip/Interchip Enhanced Cooling Applications (ICECool Apps) Proposers’ Day
- Notice Date
- 1/15/2013
- Notice Type
- Special Notice
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 675 North Randolph Street, Arlington, Virginia, 22203-2114, United States
- ZIP Code
- 22203-2114
- Solicitation Number
- DARPA-SN-13-17
- Archive Date
- 2/8/2013
- Point of Contact
- Dr. Avram Bar-Cohen,
- E-Mail Address
-
DARPA-SN-13-17@darpa.mil
(DARPA-SN-13-17@darpa.mil)
- Small Business Set-Aside
- N/A
- Description
- Special Notice for Intrachip/Interchip Enhanced Cooling Applications (ICECool Apps) Proposers’ Day DARPA-SN-13-17 Dr. Avram Bar-Cohen, PM, DARPA/MTO Date: Thursday, February 7, 2013 Location: Westin Arlington Gateway Hotel at 801 N. Glebe Road Arlington, VA 22203 This Special Notice, DARPA-SN-13-17, is to announce that DARPA is holding a Proposers’ Day for Intrachip/Interchip Enhanced Cooling Applications (ICECool Apps) on February 7, 2013 in Arlington, VA. ICECool Apps is the second thrust of DARPA’s ICECool program, following the ICECool Fundamentals effort (DARPA-BAA-12-50), and specifically addresses the thermal management needs of RF MMIC power amplifiers and embedded high performance computer modules. The Broad Agency Announcement (BAA) for ICECool Apps, DARPA-BAA-13-21, is expected to be released prior to the Proposers’ Day. The specific goal of ICECool Applications is to enhance the performance of such defense electronic systems through the judicious application of intrachip/interchip microfluidic cooling and on-chip thermal interconnects that will together enable the removal of kW/cm 2 heat fluxes on the chip and kW/cm 3 heat densities in the targeted electronic modules. Successful completion of this program will substantially raise module-level heat removal density, without raising the operating temperature, thus enabling greater functionality per unit volume in high-performance, RF and computational electronic systems. The ICECool program is exploring disruptive embedded cooling technologies that will overcome present thermal performance limitations, while significantly reducing size, weight, and power consumption (SWaP) of defense electronic systems. These goals will be accomplished by integrating microfluidic cooling into the chip, substrate, and/or package structure, while significantly shrinking the dimensions of the cooling solution and providing superior heat removal capability at the chip and module levels. Implementation of embedded thermal management and integration of thermal design with functional design and power delivery are needed to remove the heat dissipation associated with full realization of the inherent capability of emerging solid state device technology. The integration of ICECool concepts and techniques into the commercial-off-the-shelf (COTS) supply chain, along with development and implementation of electrical-thermal co-design techniques, is aimed at overcoming the thermally-limited performance, as well as excessive weight and volume, of traditionally-cooled COTS electronic modules and sub-systems, when used in defense applications. The Proposers’ Day will be held on Thursday, February 7 at the Westin Arlington Gateway Hotel at 801 N. Glebe Road Arlington, VA 22203. The preliminary Proposers’ Day Agenda includes an ICECool Vision presentation by the DARPA ICECool Applications Program Manager (Dr. Bar-Cohen), brief presentations by academic and industry teams on current and planned “embedded cooling” efforts, and primer on responsding to DARPA solicitations by a representative from the DARPA Contracts Management Office (CMO). Following lunch, an opportunity will be provided for brief individual meetings with Dr. Bar-Cohen and breakout rooms will be available for organizations wishing to discuss potential collaborations. Both of these can be requested on a first-come, first serve basis by emailing DARPA-SN-13-17@darpa.mil with the type of meeting being requested in the subject line. An on-line registration form, preliminary Proposers Day agenda, citizenship verification, foreign national visit request form (DARPA Form 60), and meeting details for the Proposers Day can be found at the following registration website, https://safe.sysplan.com/confsys/icecool/index.html. Please note that there is a $90 Registration Fee for this event. Organizations are not limited in the number of attendees; however, in the event that the Proposers Day is oversubscribed, DARPA reserves the right to limit participation to two attendees per organization. The determination of what constitutes an organization will be decided by the DARPA Program Manager. DARPA will make the PM’s and CMO’s presentation available on the DARPA website after the meeting. All other presentations will not be made available. A limited number of hotel rooms are available for Wednesday and Thursday evenings at the Westin, which can be booked directly through the hotel by calling (703) 717-6200 or toll free (888) 627-7076 and referencing the ”DARPA” room block. If you would like to book your room online, please follow the link https://www.starwoodmeeting.com/StarGroupsWeb/res?id=1212274774&key=213F. This special notice is issued solely for information and potential new program planning purposes; the special notice does not constitute a formal solicitation for proposals or proposal abstracts; any so sent will be disregarded. In accordance with FAR 15.201(e), responses to this special notice are not offers and cannot be accepted by the Government to form a binding contract. Attendance at the Proposers Day is voluntary and is not required to propose to current or subsequent Broad Agency Announcements (if any) or Research Announcements (if any) on this topic. DARPA will not provide reimbursement for costs incurred in responding to this special notice. Respondents are advised that DARPA is under no obligation to acknowledge receipt of the information received, or provide feedback to respondents with respect to any information submitted under this special notice. DARPA intends to publish the ICECool Applications BAA prior to the scheduled Proposers Day. However, DARPA is not obligated to publish the BAA prior to conducting the Proposers Day or to publish an associated BAA at all. If and when published, the BAA will be made available - at a minimum - on the Federal Business Opportunities (FBO) website. Questions regarding this event may be directed to DARPA-SN-13-17@darpa.mil. Please refer to the "ICECool Applications Proposers Day" in the subject line. Contracting Office Address: 675 North Randolph Street Arlington, VA 22203-2114 United States Primary Point of Contact: BAA Administrator DARPA-SN-13-17@darpa.mil
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DARPA/CMO/DARPA-SN-13-17/listing.html)
- Record
- SN02965946-W 20130117/130115234646-cdd429b4d876113addae7521d63a55e5 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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