SOURCES SOUGHT
A -- 3D Readout Integrated Circuit for Infrared Focal Plan Array Technology
- Notice Date
- 7/9/2013
- Notice Type
- Sources Sought
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- ACC-APG - Washington, ATTN: CCCE-CW, 10205 Burbeck Road, Fort Belvoir, VA 22060-5863
- ZIP Code
- 22060-5863
- Solicitation Number
- W909MY-13-Q-ROIC
- Response Due
- 8/9/2013
- Archive Date
- 9/7/2013
- Point of Contact
- MICHELLE HODGES, 703-704-0846
- E-Mail Address
-
ACC-APG - Washington
(michelle.l.hodges10.civ@mail.mil)
- Small Business Set-Aside
- N/A
- Description
- The Army Contracting Command - Aberdeen Proving Ground, Belvoir Division is seeking sources for 3 Dimensional (3D) Readout Integrated Circuit (ROIC) for Infrared Focal Plan Array (IRFPA) Technology. This survey will be managed by the US Army Research Development and Engineering Command (RDECOM), Communications and Electronics Research and Development Engineering Center (CERDEC), Night Vision Electronics Sensors Directorate (NVESD), which seeks to advance the current infrared (IR) technology through innovative investigations and development of 3D ROIC architecture suitable for large format, small pixel high performance cooled dual-band IRFPAs. Many current IR imaging applications demand high sensitivity, very large dynamic range, high resolution, large field of view (FOV), and fast data rate. Conventional ROIC approaches have limited data-rate and dynamic-range capabilities. The majority of current ROICs are analog with the integration capacitor taking up most of pixel area. The challenge for current ROIC technology is how to implement sufficient well capacity in small pixel pitch to meet sensitivity and dynamic range requirements. The purpose of this Request For Information (RFI) is to invite interested parties to submit technical solutions for a 3D ROIC architecture/design that meets the requirements as describe herein below: The readout will be large format (~1Kx1K), small pixel pitch ( less than 12um) and shall be designed to exhibit high injection efficiency, low noise, low power dissipation ( less than 150mW @ 60Hz), A/D conversion on-chip with greater than 20 bits of dynamic range, an effective well capacity greater than 5e8 electrons and non-linearity less than.1%. The readout shall also be capable of operating greater than 1KHz frame rate. 3D Integrated Circuit (IC) Integration is quickly proliferating in the commercial silicon industry as a way to continue to increase performance; ('More than Moore quote mark ). 3D ICs (chip stacking) are made possible through advances in the Through Silicon Via (TSV) technology, Deep Silicon Via (DSV) technology, combined with the wafer thinning and wafer bonding technology. In addition to the government's interest in the current capabilities to fabricate and demonstrate a 3D ROIC that will meet the performance goals of the RFI, there is also considerable interest in developing a viable, highly producible, and affordable path to 3D ROICs. Responses to the RFI should address/answer the following questions: 1) How can the IR community leverage the commercial 3D IC integration activities to meet our ROIC needs? 2) What are the trades between 2D and 3D ROIC architecture (cost, performance, etc.)? 3) What are the main challenges and key technologies for 3D ROIC implementation? 4) What on chip processing functionality/capability should be implemented with 3D ROICs (Local Area Contrast Enhancement, Local Area Processing, Non-uniformity Correction (NUC), data compression, etc.)? 5) What are the system impacts of 3D ROICs? 6) Cost impact? 7) What are the reliability issues of 3D ROICs if any? 8) Do you have the capability in-house to perform wafer thinning? 9) Do you have the capability in-house to perform wafer bonding? 10) If you do not have these capabilities, who would you partner with to perform these tasks? 11) What TSV development activities has your company been involved with currently or in the past? 12) What 3D ROIC development effort either through Internal Research & And Development (IRAD) or government funded are you currently engaged in? 13) Which silicon foundry would you choose or you feel is most suitable for your 3D ROIC development effort? Explain why? 14) The Government is considering sponsoring a 3D ROIC workshop. At the workshop, companies will have the opportunity to present their ideas and concepts to a government only forum. There also may be a session that will be open to all invitees, government and contractors, to discuss 3D ROIC solutions. Are you agreeable to participating in open forum with other contractors? In the spirit of a workshop, there may be an opportunity for your company to present to the group your thoughts or ideas that could be beneficial to IR community. Would you like to take advantage of this opportunity? Sources possessing potential solutions are invited to submit a White Paper not to exceed 15 pages in length describing their capabilities and 3D ROIC concepts. The White Paper must include, at a minimum, comprehensive descriptions supported by facts and rigorous scientific reasoning, that address the RFI goals and questions. The ideas presented in the white paper will be discussed and assessed by U.S. Army RDECOM CERDEC NVESD. Government support contractors will be involved in the review and assessment of responses submitted under this RFI. Each respondent should also provide point of contact information to include: company name, contact name, company Address, website (if applicable), contact phone number, and contact email address. In addition to the above, please provide answers to the following questions (No more than 3 pages)(Not included in the above 15 page limit). 1. Does your company have a SECRET facility or access to one should it be required? Personnel performing work under an eventual contract will be required to have a SECRET Facility Clearance. Do your employees who would work on this effort have a SECRET Facility Clearance? (Contractor personnel working on-site at NVESD (Ft. Belvoir, VA.) must obtain a security clearance of Secret (minimum)). The contractor shall require access to Foreign Government Information and For Official Use Only (FOUO) information. The contractor must be authorized to use the Defense Technical Information Center (DTIC). Contractor will be required to have automated information system (AIS) processing at their site. Administrative duties performed by the contractor will not require a clearance but will require an investigation for IT sensitive duties. 2. Please identify whether you are a Large Business, Small Business, Very Small Business, Small Disadvantaged Business, 8(a) Program Small Business, Women-owned Small Business, HUB Zone Small Business, Veteran-owned Small Business, Service-disabled Veteran-owned Small Business, and/or a Native American Small Business under the proposed NAICS code 541712. Responses should also include the company name, CAGE code, point of contact, and address. a. If you identify your company as a Small Business or any of the SB subcategories, is your company interested in a prime contract? b. Under the current SB recertification regulations, do you anticipate your company remaining a small business, under primary NAICS Code 541712? c. Does your firm possess an approved Defense Contract Audit Agency (DCAA) accounting system? d. Does your company meet the Non-manufacturing Rule? If so How? e. If you are planning on teaming with other companies, Please list the process used in selecting the members? If you are a SB answer questions f. and g. f. If your company is awarded the contract, will you be able to perform at least 50% (percent) of the work? g. If you are a small business can you go without a payment for 90 days? Responses should be submitted no later than close of business on 9 August 2013. Responses should be emailed to michelle.l.hodges10.civ@mail.mil with a copy to khoa.v.dang.civ@mail.mil. The subject of the mail message shall be: W909MY-13-Q-ROIC, Market Research Response, Your Company's Name. All questions of a technical nature should be addressed to Ms. Michelle Hodges, Contracting Officer, at michelle.l.hodges10.civ@mail.mil and Mr. Khoa Dang at khoa.v.dang.civ@mail.mil. NO TELEPHONIC QUESTIONS WILL BE ACCEPTED. The Government may elect to conduct one-on-one discussions with Industry based on its analysis of the RFI responses, the quality of submission, and the level and specification of the information provided. Please note the Government is under no obligation to conduct these sessions. This Request for Information does not constitute an invitation for bid or Request for Proposal, and is not to be construed as a commitment by the Government to issue a contract or order. The Government will not reimburse interested sources or respondents to notice, for any costs incurred in association with this announcement or for subsequent exchanges of information. It is desirable that data be received with unlimited rights to the Government. However, we recognize that proprietary data may be included with the information provided. If so, clearly mark such proprietary information and clearly separate it from the unrestricted information as an addendum.
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- Place of Performance
- Address: ACC-APG - Washington ATTN: CCCE-CW, 10205 Burbeck Road Fort Belvoir VA
- Zip Code: 22060-5863
- Zip Code: 22060-5863
- Record
- SN03111238-W 20130711/130709235348-8e0165135ff201f1570a968d6598646d (fbodaily.com)
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