SOLICITATION NOTICE
A -- Wafer Level Packaging (WLP) for Anti-Access Area Denied (A2AD) Environment - Broad Agency Announcement (BAA) - Full Solicitation
- Notice Date
- 10/23/2013
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Department of the Air Force, Air Force Materiel Command, AFRL/RQK - WPAFB, AFRL/RQK, 2310 Eighth Street, Building 167, Wright-Patterson AFB, Ohio, 45433-7801, United States
- ZIP Code
- 45433-7801
- Solicitation Number
- BAA-RQKM-2014-0004
- Archive Date
- 12/25/2013
- Point of Contact
- Gina Shrider, Phone: (937) 656-9887
- E-Mail Address
-
gina.shrider@us.af.mil
(gina.shrider@us.af.mil)
- Small Business Set-Aside
- N/A
- Description
- Initial Announcement The Air Force Research Laboratory, Materials & Manufacturing Directorate, Manufacturing Technologies Division (AFRL/RXM), Wright Research Site is seeking the development and implementation of manufacturing technologies to reduce the cost of Wafer Level Packaging (WLP) hardware for A2AD environment, weapon's applications and Net-Centric applications in communication. The WLP program will focus to increase the manufacturing readiness level from 2 to 6 to provide risk reduction for the Air Force B-2 EHF communication program and other WLP space and defense applications.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/USAF/AFMC/AFRLWRS/BAA-RQKM-2014-0004/listing.html)
- Record
- SN03221204-W 20131025/131023234557-0dea103405bb45d05ef2d210b14d5491 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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