DOCUMENT
59 -- CPU Boards - Presolicitation
- Notice Date
- 11/26/2013
- Notice Type
- Presolicitation
- NAICS
- 334418
— Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Contracting Office
- Department of the Navy, Naval Air Systems Command, Naval Air Warfare Center Weapons Division Dept. 2, Commander, NAWCWD, Code 220000D, 429 E. Bowen Rd - Stop 4015, China Lake, California, 93555-6100, United States
- ZIP Code
- 93555-6100
- Solicitation Number
- N6893614R0004
- Archive Date
- 12/11/2014
- Point of Contact
- Beth A. Steude, Phone: (760) 939-8195, Mary K Jacobs, Phone: (760) 939-6043
- E-Mail Address
-
beth.steude@navy.mil, mary.jacobs@navy.mil
(beth.steude@navy.mil, mary.jacobs@navy.mil)
- Small Business Set-Aside
- Total Small Business
- Description
- The Naval Air Warfare Center Weapons Division (NAWCWD) China Lake, CA intends to award a firm fixed price contract for the purchase of 2,500 each CPU4 Rev K1 Circuit Boards in support of remotely-controlled seaborne targets plus an option for an additional 2,500 each. 1. The contractor shall test 10 first-article units and shall deliver the 10 units and the test data to NAWCWD, Point Mugu, CA for inspection. The Navy will evaluate the first-article units and provide finding of acceptance or deficiencies within 7 days of receipt. Following acceptance, the remainder of the production lot shall be delivered within 180 days at a rate of not less than 250 per month. 2. The Assemblies shall meet IPIC Class 2 Requirements per IPC-A-610 and shall be inspected by an IPC-610 certified inspector. 3. In accordance with the supplied Technical Data Packages, which will be available with the solicitation, the contractor shall fabricate the bare boards and populate them with components per IPC Class 2 Standards. The vendor shall utilize the government furnished test set to program, test and serialize the boards. TS-20086 Rev K1 CPU-4 PCB TDP contains files that are applicable to completing the bare board. Materials: A. Printed Circuit Board: Epoxy Glass, IPC-4101/24, FR4. TG 170; Copper Clad 1 oz. inner & outer layers. Total board thickness;.062. B. Solder Mask: Green Semi-Gloss LPI per IPC-SM-840 Type A1, Class 3. C. Silkscreen Text: White Epoxy Ink Surface Finish; HASL (Hot Air Solder Leveling) Acceptability per IPC-A-600, Class 2, Qualification and Performance per IPC-6012, Class 2. TS-20087 Rev K1-6 CPU-4 TDP contains files that are applicable to completing the assembly. Materials: A. Soldering: Conforming to IPC-J-STD-001D. B. Conformal Coating: Humiseal 1A33 Urethane, Conforming to MIL-I-46058 and IPC-CC-830. 4. Any deviations must be approved in writing by the Navy prior to manufacture. 5. The US Navy will retain data rights and manufacturing rights to the design. Delivery under this procurement will be shipped to Port Hueneme, CA 93043. All responsible sources may submit a proposal, which shall be considered by the agency. Anticipated award date is March 06, 2014. Respond to Beth Steude by e-mail (preferred) beth.steude@navy.mil, fax (760) 939-3095 or mail to Commander, Code 220000D, NAWCWD 429 E. Bowen Road, Mail Stop 4015, China Lake, CA 93555-6108.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DON/NAVAIR/N68936D2/N6893614R0004/listing.html)
- Document(s)
- Presolicitation
- File Name: TDP Link-N68936-14-R-0004 (https://www.fbo.gov/fedteds/RFPN6893614F0004)
- Link: https://www.fbo.gov/fedteds/RFPN6893614F0004
- Note: If links are broken, refer to Point of Contact above or contact the FBO Help Desk at 877-472-3779.
- File Name: TDP Link-N68936-14-R-0004 (https://www.fbo.gov/fedteds/RFPN6893614F0004)
- Record
- SN03241681-W 20131128/131126234408-548270a4c173fc547f9eb6d87251f393 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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