SOURCES SOUGHT
59 -- ELECTRONIC MECHANICAL COMPOSITE HARDWARE FABRICATION SUPPORT SERVICES
- Notice Date
- 2/18/2014
- Notice Type
- Sources Sought
- NAICS
- 334418
— Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Contracting Office
- NASA/Langley Research Center, Mail Stop 12, Industry Assistance Office, Hampton,VA 23681-0001
- ZIP Code
- 23681-0001
- Solicitation Number
- NNL14ZB1002L
- Response Due
- 3/6/2014
- Archive Date
- 2/18/2015
- Point of Contact
- Ceseley Dunbar, Contract Specialist, Phone 757-864-2434, Fax 757-864-8863, Email ceseley.dunbar@nasa.gov - Teresa M Hass, Contracting Officer, Phone 757-864-8496, Fax 757-864-8863, Email Teresa.M.Hass@nasa.gov
- E-Mail Address
-
Ceseley Dunbar
(ceseley.dunbar@nasa.gov)
- Small Business Set-Aside
- N/A
- Description
- NASA/LaRC is hereby soliciting information for potential sources for ELECTRONIC MECHANICAL, COMPOSITE, HARDWARE FABRICATION SUPPORT SERVICES (EMCHFSS) follow-on support services contract to NASA Langley Research Center (LaRC), Hampton, Virginia. An advance notice is published herein to provide information about services that are required. The Contractor shall provide technical support to fabricate research-oriented electronics circuitry to include circuit assemblies for ground support, aircraft, spaceflight, laboratory, science, and research facility instrumentation requirements within Government provided facilities as well as in Contractor facilities. These services shall encompass four functional Electronics Fabrication work areas with support services provided for: General Electronics Fabrication, Aircraft Electronics Fabrication, Microelectronics Fabrication, and Special Fabrication Processes. In addition, the Contractor shall provide support for Metal Fabrication and Composite Fabrication of research oriented hardware. This procurement action is intended to result in a performance based contract with work requests being issued by the Government containing performance requirements and delivery schedules specified therein. The work locations for this effort are estimated as follows for the areas of work described above: General Electronics Fabrication 50% Contractor Facility 50% LaRC On-site; Aircraft Electronics Fabrication 100% LaRC On-site; Microelectronics Fabrication 100% LaRC On-site; Special Fabrication Processes 95% Contractor Facility, 5% LaRC On-site; Metal Fabrication 5% Contractor Facility and 95 % LaRC On-site: machining 95% LaRC On-site, Contractor Facility 5% and Composite Fabrication 100 % LaRC On-site. Support will be provided primarily for first shift operations, but some second and third shift work is required. The contractor should be prepared to perform emergency support work in all work areas on a 24-hour, 7-days a week basis. ELECTRONICS FABRICATION SUPPORT: General Electronics Fabrication -- This includes electronics fabrication support to produce general electronics circuitry and hardware. Requirements range from fabrication and assembly of printed circuit boards, cable assemblies, wiring harnesses, and electronics chassis; to installation and wiring of complete research test facilities; to fabrication and assembly of electronics hardware components and subsystems for Center aeronautical or aerospace research projects. Aircraft Electronics Fabrication -- This includes electronics fabrication support to produce aircraft electronics circuitry such as data acquisition instrumentation, telemetry systems, electronic display units, and a variety of ground support equipment for LaRC's flight research aircraft. This also includes mechanical fabrication of support equipment, racks, instrumentation pallets, hardware modifications for installation into various research aircraft and facilities. Microelectronics Fabrication -- This includes the performance of technical functions necessary for microelectronics circuit and sensor fabrication such as deposition of materials, photochemical patterning of circuit elements and interconnections, mounting of microminature components, etc. Special Fabrication Processes -- This includes printed circuit board fabrication; photoplotting, photographing, and processing of printed circuit board electronic artwork data files; graphics-related processes including computerized engraving and vinyl cutting, metal photo imaging and graphics artwork layout and other related processes; and coatings application processes including conformal coating, staking, encapsulating, brazing and other related processes. MECHANICAL FABRICATION SUPPORT: Research-oriented mechanical hardware made from steel, aluminum, titanium and similar materials. This includes hardware for aircraft instrumentation, ground support instrumentation equipment, spaceflight applications, and research test facility instrumentation. Aircraft structural modifications and fabrication, aircraft flight test hardware, simulator development, modification to commercial off-the-shelf (COTS) equipment, structural test article, and research instrumentation device fabrication are also among the support services required. This includes specialized machining, including programmers/operators for 3 and 5 axis CNC and conventional mills and lathes, 4 axis wire EDM programmer/operator and a 3 axis waterjet programmer/operator. COMPOSITE FABRICATION SUPPORT:Research-oriented mechanical hardware.This includes providing technical support for the fabrication, instrumentation and testing of composite aero elastic and force test wind tunnel test articles; free-flight, spin and dynamically scaled remotely piloted articles; flight and ground support hardware, facility components and laboratory testing apparatus. Supports processes in composites technology such as test article fabrication, patternmaking, material lay-up, laser tracker, CAD design, additive systems, ply cutters, fiber placement systems and resin infusion in conjunction with provided laboratory equipment including numerically controlled milling machines, high-speed routers, and autoclave systems to develop and instrument precision test articles and related structures and hardware for aerospace research applications. Information Requested: No solicitation currently exists, therefore do not request a copy of the solicitation package. If a solicitation is released it will be synopsized and posted accordingly. Interested parties are requested to submit a capabilities statement detailing the ability to meet the requirements listed above. Capabilities statements should be limited to 5 pages and please include any potential teaming/subcontracting partners; 3 customer Points of Contact, dollar value of the effort, contract type (fixed price, cost reimbursement, FP/CR hybrid, etc.,) and whether the work performed is/was considered commercial or non-commercial as defined in FAR 2.101. Please provide your companys demographics, (i.e. Other than Small Business, Small business, (8a), Veteran Owned, Woman Owned, and HubZone) and DUNS Number and NAICS code if known. This synopsis is for market research and planning purposes only and is not to be construed as a commitment by the Government nor will the Government pay for information solicited. Respondents will not be notified of any results of information collected. The information provided will assist the Government in its assessment of the current market and future acquisition planning strategy. All responses shall be submitted to Ceseley Dunbar via email ceseley.dunbar@nasa.gov no later than 4:00 p.m. EST, Thursday March 6, 2014. Electronic submission is encouraged however hard copy packages may be submitted to the address listed.
- Web Link
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- Record
- SN03290049-W 20140220/140218234119-d4c65969ee04d8936a3a1577ee7f762d (fbodaily.com)
- Source
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