AWARD
59 -- Sub-Micron Die-Bonder
- Notice Date
- 5/18/2015
- Notice Type
- Award Notice
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- Department of the Air Force, Air Force Materiel Command, AFTC/PZIO - Eglin, 308 West D. Ave, Bldg 260, Suite 130, Eglin, Florida, 32542-5418, United States
- ZIP Code
- 32542-5418
- Solicitation Number
- FA2823-15-Q-8004
- Archive Date
- 6/2/2015
- Point of Contact
- Rebecca C. Hoppe, Phone: 8508820335
- E-Mail Address
-
rebecca.hoppe@us.af.mil
(rebecca.hoppe@us.af.mil)
- Small Business Set-Aside
- N/A
- Award Number
- FA2823-15-P-8017
- Award Date
- 5/18/2015
- Awardee
- Finetech, 560 E German Road Suite 103, Gilbert, Arizona 85297, United States
- Award Amount
- $118,450.00
- Description
- CLIN 0001: Fineplacer Manual Lambda Die-Bonder, P/N: A6HD CLIN 0002: Bonding Force Module, P/N: FD3.1
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/notices/49a42fff98c194066f9073ec1f8d5feb)
- Record
- SN03734185-W 20150520/150518234713-49a42fff98c194066f9073ec1f8d5feb (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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