SOURCES SOUGHT
58 -- Market Survey for Second Generation Forward Looking Infrared (SGF): Thermal imaging components
- Notice Date
- 2/8/2016
- Notice Type
- Sources Sought
- NAICS
- 334519
— Other Measuring and Controlling Device Manufacturing
- Contracting Office
- Department of the Army, Army Contracting Command, ACC - APG (W15P7T) Division B, 6001 COMBAT DRIVE, Aberdeen Proving Ground, Maryland, 21005-1846, United States
- ZIP Code
- 21005-1846
- Solicitation Number
- MARKET-SURVEY-5973-1
- Archive Date
- 3/15/2016
- Point of Contact
- Van Nguyen, Phone: 443-861-3028
- E-Mail Address
-
van.t.nguyen36.civ@mail.mil
(van.t.nguyen36.civ@mail.mil)
- Small Business Set-Aside
- N/A
- Description
- ACC-APG-C4ISR intends to acquire individual spare parts for the thermal imaging components for a possible five year Indefinite Delivery Indefinite Quantity (IDIQ) contractual effort. The thermal imaging components consist of infrared optics, infrared detectors, and associated electronics. These components are utilized in the Abrams Thermal Receiver (TRU), the M1A2 Commander's Independent Thermal Viewer (CITV), the M2/M3A3 Improved Bradley Acquisition System (IBAS), the M2/M3A3 Commander's Independent Viewer (CIV), and the Long Range Advanced Scout Surveillance System (LRAS3) programs. They are also utilized in the Navy's Phalanx program. The purpose of this survey is to locate sources that have the capability of manufacturing and/or supplying thermal imaging components. This survey is published in compliance with Federal Acquisition Regulation (FAR) Part 10, (Market Research). Past history for this product indicates the only known sources with the capability to manufacture the spare parts of the thermal imaging components were Raytheon Network Centric Systems (McKinney, Texas) and DRS Technologies (Arlington, Virginia). This request for capability information does not constitute a request for proposals. Submission of any information in response to this market is purely voluntary. The US Government assumes no financial responsibility for any costs incurred in responding or in any subsequent exchange of information. The requirement for thermal imaging components includes the following National Stock Numbers (NSN): Description NSN Common Power Supply CCA 5998-01-530-1227 TIS Power Supply CCA 5998-01-530-1155 Imager 5855-01-464-1513 SADA IR Detector\Cooler Bench 5855-01-538-6686 Interface & Graphics CCA 5998-01-530-1095 Advanced Video Processor CCA 5998-01-530-3005 Motor Control CCA 5998-01-530-1438 Notched Afocal Assembly 6650-01-538-5879 SADA IR Detector\Cooler Bench 5855-01-538-6085 Advanced Video Processor CCA 5998-01-530-1174 EMI Filter 5915-01-534-2208 Answering this Market Survey The responses to this market survey will be used for informational purposes only. This is not a screening information request or request for proposal of any kind. The US Government is not seeking or accepting unsolicited proposals. The Government will not pay for any information received or costs incurred in preparing the response to the market survey. Therefore any cost associated with the market survey submission is solely at the interested vendor's expense. The purpose of this market survey is to solicit statements of interest and capabilities from industry, including small businesses, service-disabled veteran-owned small businesses and 8(a) certified firms. Potential vendors should provide information, data or documentation, which shows that they have previously supplied military-grade thermal imaging components. For example, prior thermal imaging components for US Government contract(s). Information received will be reviewed for form, fit and function. All proprietary and restricted information shall be clearly marked. All responses to this market survey should be emailed to the Technical Point of Contact Van T. Nguyen, van.t.nguyen36.civ@mail.mil, 443-861-3028 by 29 Feb 2016 at 5:00 PM EST. Technical questions regarding the requirements in this market survey may be sent to the Technical Point of Contact. Please include the announcement number in your e-mail. Van T. Nguyen, 443-861-3028 van.t.nguyen36.civ@mail.mil MARKET SURVEY QUESTIONNAIRE Responses can apply to any or all of the items. Additionally you may provide additional information to support your technical capabilities of manufacturing or supplying military-grade thermal imaging components with similar complexity and functionality of those assemblies/sub-assemblies used in the Second Generation Forward Looking Infrared (SGF). If you are interested in assisting us with market research information for these items, please answer the below market survey questionnaire. We also appreciate any additional comments that will help us identifying potential manufactures or suppliers. Please complete the following questions. If a question does not apply, please enter N/A or non-applicable. 1) Provide a brief summary of the company and its core competencies. 2) Please provide the following Point of Contact information on all responses: a. Company: Address: Point of Contact: Phone Number: Fax Numbers: Email Address: CAGE Code: DUNS Number: 3) Has your Company performed manufacturing and/or supplying thermal imaging components or similar type effort in the past, if so provide Contract Number, Point of Contact (POC), e-mail address, phone number, and a brief description of your direct support of the effort? 4) Describe the qualifications of your engineering staff, who have experience in the design and production of thermal imaging components similar in complexity and technology to what is used in Second Generation Forward Looking Infrared (SGF) equipment. 5) Describe your company's experience in identifying the test equipment for testing circuit card assemblies and thermal imaging components similar in complexity and technology to what is used in Second Generation Forward Looking Infrared (SGF) equipment. 6) Describe your company's experience in developing or updating a Technical Data Package. 7) Describe your company's experience in managing obsolescence issues. 8) Does your company maintain a Program and Assessment Tool to monitor and analyze the availability of components to allow clear and precise tracking of all obsolescence issues? If so, please elaborate on the Program and Assessment tool(s). 9) Describe your company's experience in identifying the alternatives for the unavailability of obsolete materials or components to mitigate obsolescence issues. 10) Describe your company's experience in re-designing an existing hardware component from a technical data package to meet specified Form, Fit and Function requirements. 11) Describe your company's experience in performing and completing First Article Testing (FAT) requirements for thermal imaging components similar in complexity to what is used in Second Generation Forward Looking Infrared (SGF) systems within a specified timeframe. 12) Discuss your company's capability in meeting US Government contracting delivery requirements.
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