SOLICITATION NOTICE
66 -- Vacuum Sputter Coater - RFQ
- Notice Date
- 4/1/2016
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 334516
— Analytical Laboratory Instrument Manufacturing
- Contracting Office
- Department of the Army, U.S. Army Corps of Engineers, USACE CERL, Champaign, 2902 Farber Drive, P O BOX 9005, CHAMPAIGN, Illinois, 61826-9005, United States
- ZIP Code
- 61826-9005
- Solicitation Number
- W9132T-16-T-0044
- Archive Date
- 4/23/2016
- Point of Contact
- Thomas F. Nowocin, Phone: 2173734478
- E-Mail Address
-
tom.f.nowocin@usace.army.mil
(tom.f.nowocin@usace.army.mil)
- Small Business Set-Aside
- Total Small Business
- Description
- W9132T-16-T-0044 This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation: quotes are being requested in accordance with the attached request for quotation (RFQ). The solicitation number is W9132T-16-T-0044 and is being issued as a request for quotation (RFQ). The U.S. Army Engineer Research and Development Center (ERDC), Construction Engineering Research Laboratory (CERL) has a requirement to procure a vacuum sputter coater for thin film deposition in accordance with the following minimum specifications: a. System must be capable of depositing thin films of various materials in controllable thicknesses onto substrates using a magnetron sputtering head. b. Must be able to accommodate circular sputter targets that are 55 - 60 millimeters in diameter, and at least 0.1 mm thick in the sputtering head. c. Must be able to repeatably and reliably sputter at least the following elements: aluminum (Al), copper (Cu), gold (Au), silver (Ag), platinum (Pt), palladium (Pd), cobalt (Co), iron (Fe), nickel (Ni), titanium (Ti), tantalum (Ta), tungsten (W), iridium (Ir), molybdenum (Mo). d. Sputtering head must either be air-cooled, or be equipped with water-cooling as part of the complete system. Sputtering head must have a shutter, or means of blocking the sputtering head from the substrate in order to remove impurities from the target before deposition. e. Must have a means of controlling, measuring and displaying sputtering voltage (V), sputtering current (mA), chamber pressure (Torr), sputtering time (seconds) (counting down or up) and any other relevant status/safety information, in real time. This must be in the form of an interface or control panel for straight-forward and quick use. f. Chamber must be capable of accommodating substrates of 4" (101.6 mm) in diameter with a stage on which to place said substrates. The following type(s) of stages are acceptable: tilting/rotatable, heated, biased, or any combination thereof. g. Chamber must be constructed of either metal (stainless steel) or glass (including quartz), and must be able to safely operate at an ultimate base pressure of 1x10-5 Torr or lower. In the case of glass, system must come with a metallic cage to serve as an implosion shield for safety purposes. Chambers must come with appropriate o-rings and/or sealing hardware, if required for operation. h. System must include a high vacuum pump (presumably a turbomolecular drag pump), that is able to reach the aforementioned ultimate base pressure, and either (1) a mechanical rough backing pump or, (2) means of connecting a pre-existing mechanical rough backing pump to the exhaust of the high vacuum pump. i. Sputtering head must be capable of DC sputtering (DC & RF acceptable), with currents of at least 35 milliamps DC, at whatever DC voltage is required to consistently maintain plasma discharge. j. System must be capable of operating with at least argon (Ar) gas, but may also operate with additional gases such as oxygen (O2), nitrogen (N2), etc. k. System must either include (1) a means of measuring film deposition measurement in real time via Quartz Crystal Microbalance (QCM) that measures both thickness and deposition rate, in metric units (kilo-angstroms kÅ, and angstroms/sec Å/s, respectively) or, (2) have an available port on the vacuum chamber to accommodate a pre-existing film deposition QCM. l. System input power of 110/120 VAC, single phase, requiring no more than 15 amps. m. System must conform to any and all safety requirements involving, high voltage, pressurized gases, vacuum, magnetic fields, etc. Failure to quote a product meeting all required specifications will result in the quote being determined technically unacceptable. See page 37 of the attached RFQ for quote submittal instructions. Delivery is required no later than 30 days after date of award. See the attached RFQ for all applicable provisions and clauses. Please provide responses to this RFQ no later than 8 April 2016, at 12:00 PM Central Time (CT), to: tom.f.nowocin@usace.army.mil Telephone responses will not be accepted. * Note: In order to be eligible for award of a Government contract, vendors must be actively registered in the System for Award Management (SAM), have no active exclusions, and complete FAR and DFARS representations and certifications. This system combines data that was formerly contained in the Central Contractors Registration (CCR), Online Representation and Certifications (ORCA), and the Excluded Parties List System (EPLS). For more information, review the SAM website at https://www.sam.gov.
- Web Link
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FBO.gov Permalink
(https://www.fbo.gov/spg/USA/COE/330/W9132T-16-T-0044/listing.html)
- Record
- SN04070167-W 20160403/160401234233-eee36ac3f66979ce5b3d0fc2d0f8dd28 (fbodaily.com)
- Source
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