SOLICITATION NOTICE
A -- DPA Title III 3D Microelectronics for Information Protection Project - Funding Opportunity Announcement (FOA)
- Notice Date
- 6/15/2016
- Notice Type
- Presolicitation
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Department of the Air Force, Air Force Materiel Command, AFRL/RQK - WPAFB, AFRL/RQK, 2130 Eighth Street, Building 45, Wright-Patterson AFB, Ohio, 45433, United States
- ZIP Code
- 45433
- Solicitation Number
- FOA-AFRL-RQKM-2016-0017
- Archive Date
- 8/16/2016
- Point of Contact
- Dianna C. Aniton, Phone: (937) 713-9897
- E-Mail Address
-
dianna.aniton@us.af.mil
(dianna.aniton@us.af.mil)
- Small Business Set-Aside
- N/A
- Description
- Title III Funding Guidelines Sample Cost Proposal Spreadsheet Sample Summary Business Plan Outline Sample Technology Investment Agreement Title III Certifications & Representations FOA Initial Announcement The objective of this DPA Title III Project is to expand existing domestic supplier production capabilities to produce three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus of this effort shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD supplier of 3D microelectronics modules incorporating Information Protection. The quality of ultra-high density modules produced throughout this effort will be verified against current industry standards; quality verification efforts will include production and testing of the 3D ultra-high density microelectronics modules.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/USAF/AFMC/AFRLWRS/FOA-AFRL-RQKM-2016-0017/listing.html)
- Record
- SN04151352-W 20160617/160615235213-9ed32ad6c141dee2ee3493a5c7b0f075 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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