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FBO DAILY - FEDBIZOPPS ISSUE OF JUNE 17, 2016 FBO #5320
SOLICITATION NOTICE

A -- DPA Title III 3D Microelectronics for Information Protection Project - Funding Opportunity Announcement (FOA)

Notice Date
6/15/2016
 
Notice Type
Presolicitation
 
NAICS
541712 — Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
 
Contracting Office
Department of the Air Force, Air Force Materiel Command, AFRL/RQK - WPAFB, AFRL/RQK, 2130 Eighth Street, Building 45, Wright-Patterson AFB, Ohio, 45433, United States
 
ZIP Code
45433
 
Solicitation Number
FOA-AFRL-RQKM-2016-0017
 
Archive Date
8/16/2016
 
Point of Contact
Dianna C. Aniton, Phone: (937) 713-9897
 
E-Mail Address
dianna.aniton@us.af.mil
(dianna.aniton@us.af.mil)
 
Small Business Set-Aside
N/A
 
Description
Title III Funding Guidelines Sample Cost Proposal Spreadsheet Sample Summary Business Plan Outline Sample Technology Investment Agreement Title III Certifications & Representations FOA Initial Announcement The objective of this DPA Title III Project is to expand existing domestic supplier production capabilities to produce three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus of this effort shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD supplier of 3D microelectronics modules incorporating Information Protection. The quality of ultra-high density modules produced throughout this effort will be verified against current industry standards; quality verification efforts will include production and testing of the 3D ultra-high density microelectronics modules.
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/spg/USAF/AFMC/AFRLWRS/FOA-AFRL-RQKM-2016-0017/listing.html)
 
Record
SN04151352-W 20160617/160615235213-9ed32ad6c141dee2ee3493a5c7b0f075 (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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