AWARD
59 -- SEMICONDUCTOR DEVIC
- Notice Date
- 3/6/2017
- Notice Type
- Award Notice
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- DLA LAND AND MARITIME
- ZIP Code
- 00000
- Solicitation Number
- SPE7M517T4373
- Archive Date
- 3/21/2017
- Point of Contact
- Jessica Booth614-692-7971
- E-Mail Address
-
Jessica.Booth@dla.mil
(Jessica.Booth@dla.mil)
- Small Business Set-Aside
- N/A
- Award Number
- SPE7M517P6030
- Award Date
- 3/6/2017
- Awardee
- FORWARD COMPONENTS, INC. 20918 BAKE PKWY STE 110 LAKE FOREST 92630-2173 US
- Award Amount
- 30839.90
- Line Number
- 0001
- Description
- No Description Provided
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DLA/J3/DSCC-BSM/Awards/SPE7M517P6030.html)
- Record
- SN04423749-W 20170308/170306234120-bd17bf71619a67a0cc8c09ee5fee534a (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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