SOURCES SOUGHT
59 -- Active RFID Assembly Device (ARAD) - ARAD Questionnaire
- Notice Date
- 5/4/2017
- Notice Type
- Sources Sought
- NAICS
- 334418
— Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Contracting Office
- Department of the Army, Army Contracting Command, ACC - APG (W91CRB ) Division D, 4310 Boothby Hill Rd, ABERDEEN PROV GND, Maryland, 21005-5001, United States
- ZIP Code
- 21005-5001
- Solicitation Number
- W91CRB-17-R-ARAD
- Archive Date
- 6/20/2017
- Point of Contact
- Ian Warner, , Lisa J. Yamakawa,
- E-Mail Address
-
ian.a.warner.civ@mail.mil, lisa.j.yamakawa.civ@mail.mil
(ian.a.warner.civ@mail.mil, lisa.j.yamakawa.civ@mail.mil)
- Small Business Set-Aside
- N/A
- Description
- ARAD Questionnaire This is a Sources Sought Notice FOR MARKET RESEARCH PURPOSED ONLY issued in accordance with FAR 15.201. This is not a Solicitation; therefore responses to this request are not offers. All questions relating to this notice shall be sent via email to Army Contracting Command - Aberdeen Proving Ground (ACC-APG) point of contact Ian Warner, ian.a.warner.civ@mail.mil. Submission of this information by a vendor is for planning purposes and is not to be construed as a commitment by the U.S. Government to procure any items/services, or for the Government to pay for the information received. The U.S. Government implies no intention or opportunity to acquire funding to support current or future production efforts. If a formal solicitation is generated at a later date, a solicitation notice will be published. No award will be made as a result of the market survey. All information is to be submitted at no cost or obligation to the U.S. Government. The U.S. Government reserves the right to reject, in whole or in part, any private sector input as a result of the market survey. The U.S. Government is not obligated to notify respondents of the results of this survey. Any documentation provided will not be returned. ACC- APG, in support of Program Executive Office Soldier (PEO Soldier), PM Soldier Warrior (PM SWAR) seeks manufacturers capable of manufacturing Active RFID Assembly Devices (ARAD) and of meeting ARAD delivery schedules that commence within four (4) weeks after receipt of a Delivery Order. Component parts, such as the TCXO, that typically have procurement lead-times in excess of two (2) weeks will be provided as Government Furnished Material (GFM). The ARAD consists of a flexible circuit board with a stainless steel backer plate behind the circuit board assembly area in order to provide stiffness for assembly of COTS electrical components. The flexible circuit board is populated with the Bill of Materials (BOM) electronic components. Each ARAD is individually serialized and labeled as specified, barcoded and digit readable. Every ARAD is programed and tested using test equipment and test code supplied as Government Furnished Equipment (GFE)/Government Furnished Information (GFI). The Government seeks a qualified ARAD manufacturer that is ITAR compliant and will maintain full ITAR compliance throughout the duration of ARAD manufacturing. The ARAD manufacturer will employ Industry standard fabrication and assembly procedures for all processing. They shall be capable of fabricating or otherwise obtaining flexible circuit boards that meet design drawing specifications. The ARAD manufacturer shall be capable of adjusting the GFE test equipment or providing any additional fixturing deemed necessary for the execution of ARAD assembly and test in order to meet all specifications. Test results shall be tracked, logged and archived for five years by the ARAD manufacturer. Any ARAD failing testing or otherwise not meeting specifications shall be reworked or scrapped, as determined by the ARAD manufacturer. Therefore, the ARAD manufacturer must have rework capabilities that does not compromise the integrity of the ARAD, any compromise shall result in scrap. All ARADs to be scrapped shall be destroyed and disposed per Government specification or shipped to the Government for proper destruction and disposal. ARADs that pass testing shall be packaged and shipped to the address specified by the Government on a weekly basis. In addition to the above, the Government seeks an ARAD manufacturer that possesses the capability to perform the following. 1. Assemble circuit board pick and place electrical components of size 0201 and larger. 2. X-ray underneath BGA electrical components and other non-passive electrical components to ensure that all components are properly soldered to the flexible circuit board. 3. Demonstrate and maintain ESD certification to ANSI/ESD S20.20 and/or IEC 61340-5-1. 4. Provide BOM end of life electrical component surveillance and provide the Government adequate time to find suitable replacement electrical components. 5. Provide configuration management, inventory and quality control functions. 6. Provide RF engineering, development and test, and manufacturing process control expertise in support of engineering development efforts to improve and/or ARAD design that will be performed in partnership with the Government. 7. Demonstrate experience manufacturing similar products. The intent of this survey, which includes a questionnaire, is to identify manufacturers who meet the qualifications required for ARAD production. Respondents are requested to answer each question on the attached questionnaire based upon the information and requirements presented in this RFI. In the event that the Government releases a Request For Proposal (RFP) for the ARAD, prospective offerors shall be willing to demonstrate ITAR compliance prior to receipt of the ARAD Technical Specification. Fifty (50) sample ARADs manufactured in accordance with the ARAD Technical Specification shall accompany the offerors' proposal. Respondents capable of meeting all of the above requirements are requested to answer each question on the attached questionnaire based upon the information presented in this RFI. Upon Government review of all RFI responses, there may be a need for further questions. If so, the Government will contact each vendor (as applicable), on an individual, one-on-one basis, and ask the necessary follow-on questions as required. This follow-on interview is also for market research purposes only. Data submitted in response to this RFI may be utilized to develop and document a formal RFP. To prevent inadvertent disclosure of proprietary information in any resulting RFP technical package, vendor responses shall clearly mark individual data elements that are considered proprietary in nature. The submitted responses and data will be reviewed by the NW technical team which consists of both Government and embedded support contractor personnel. Responses and technical questions should be emailed to Ian Warner - ian.a.warner.civ@mail.mil and/or Lisa Yamakawa - lisa.j.yamakawa.civ@mail.mil. All information must be submitted and received no later than 12:00pm EST, 5 June 2017. Verbal responses are not acceptable and will not be considered.
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- SN04496329-W 20170506/170504235447-d37c05e0697e6f23809fcc78b95e29a8 (fbodaily.com)
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