SPECIAL NOTICE
66 -- Notice of Intent to Sole Source - Accessories for Carl Suss Wafer bonder
- Notice Date
- 7/5/2017
- Notice Type
- Special Notice
- NAICS
- 334516
— Analytical Laboratory Instrument Manufacturing
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B130, Gaithersburg, Maryland, 20899-1410, United States
- ZIP Code
- 20899-1410
- Solicitation Number
- AMD17-NOI-03761
- Archive Date
- 8/4/2017
- Point of Contact
- Forest Crumpler, Phone: 3019756753
- E-Mail Address
-
forest.crumpler@nist.gov
(forest.crumpler@nist.gov)
- Small Business Set-Aside
- N/A
- Description
- DESCRIPTION: The United States Department of Commerce (DOC), National Institute of Standards and Technology (NIST), Acquisition Management Division (AMD) intends to negotiate a firm fixed price purchase order, on a sole source basis, with Suss MicroTec of 220 Klug Circle, Corona, CA 92880 for the purchase of one (1) set of wafer bonder accessories for the Carl Suss MA6/BA6 SB6e Wafer Bonder currently in use by NIST. The statutory authority for this sole source acquisition is FAR 13.106-1(b) by the authority of FAR Part 13 Simplified Acquisition Procedures. The Center for Nanoscale Science and Technology (CNST) at the National Institute for Standards and Technology (NIST) seeks to purchase to procure 1 set of wafer bonder accessories to support the operation of bonding alignment and wafer bonding in existing Carl Suss MA6/BA6 aligner and Suss Microtec SB6e wafer bonder. Wafer bonding is a fabrication process that two polished wafers adhere to each other without the application of any macroscopic gluing layer or outside force. It produces a mechanically stable interface and hermetically sealed encapsulation between two wafers. Bonding alignment is the precedent step before actual wafer bonding. It places two substrates in a particular orientation in order to enable the combined functions of two substrates. Wafer bonder accessories convert lithography contact aligner MA6 into bonding aligner BA6 for alignment, secure and transport aligned wafer pair into wafer bonder SB6e and support the material through bonding process. This set of wafer bonder accessories includes adapting frames and substrate transport fixtures with clamps and spaces for substrate sizes of 100 mm and 150 mm in diameter. Procurement is for one (1) set of wafer bonder accessories. Delivery shall be FOB DESTINATION and shall occur not later than 90 Days after receipt of order (ARO). Research has found that only one (1) company can meet the 100% compatibility with the proprietary Carl Suss MA6/BA6 SB6e wafer bonder. The North American Industry Classification System (NAICS) code for this acquisition is 334516- Analytical Laboratory Instrument Manufacturing with a size standard of 1,000 employees. No solicitation package will be issued. This notice of intent is not a request for competitive quotations; however, all responsible sources interested may identify their interest and capability to respond to this requirement. The Government will consider responses received by 3:00 p.m. Eastern on July 20, 2017. Inquiries will only be accepted via email to forest.crumpler@nist.gov. No telephone requests will be honored. A determination by the Government not to compete the proposed acquisition based upon responses to this notice is solely within the discretion of the Government. Information received will normally be considered solely for the purpose of determining whether to conduct a competitive procurement in the future.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DOC/NIST/AcAsD/AMD17-NOI-03761/listing.html)
- Place of Performance
- Address: 100 Bureau Drive, Gaithersburg, Maryland, 20899, United States
- Zip Code: 20899
- Zip Code: 20899
- Record
- SN04568056-W 20170707/170706000351-fe0b3991d6b33e61e9e77426bcd44310 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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