AWARD
A -- Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)
- Notice Date
- 8/24/2017
- Notice Type
- Award Notice
- NAICS
- 541712
— Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Contracting Office
- Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 675 North Randolph Street, Arlington, Virginia, 22203-2114, United States
- ZIP Code
- 22203-2114
- Solicitation Number
- DARPA-BAA-16-62
- Archive Date
- 9/6/2017
- Point of Contact
- Mark Jones, , William J Rockwood,
- E-Mail Address
-
mark.jones@darpa.mil, william.j.rockwood@boeing.com
(mark.jones@darpa.mil, william.j.rockwood@boeing.com)
- Small Business Set-Aside
- N/A
- Award Number
- HR0011-17-C-0089
- Award Date
- 8/22/2017
- Awardee
- Boeing Company, The, 325 J S McDonnell Blvd, Hazelwood, Missouri 63042, United States
- Award Amount
- Phase 1/CLIN 0001 (Base) $4,283,842, Phase 2/CLIN 0002 (Option 1) $4,638,955, Phase 3/CLIN 0003 (Option 2) $2,329,414
- Description
- Award Notice for HR0011-17-C-0090: The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DARPA/CMO/Awards/HR0011-17-C-0089.html)
- Record
- SN04646146-W 20170826/170824233036-53a98e93883fc521ee323ac563e44e6d (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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