SPECIAL NOTICE
66 -- Notice of Intent to Sole Source; Upgrade SISDEP sputter deposition system
- Notice Date
- 8/28/2017
- Notice Type
- Special Notice
- NAICS
- 333242
— Semiconductor Machinery Manufacturing
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), NIST AMD Boulder, 325 Broadway, Boulder, Colorado, 80305, United States
- ZIP Code
- 80305
- Solicitation Number
- NB687080-17-03389
- Archive Date
- 9/15/2017
- Point of Contact
- Michael G. Fredericks, Phone: 3034977763
- E-Mail Address
-
michael.fredericks@nist.gov
(michael.fredericks@nist.gov)
- Small Business Set-Aside
- N/A
- Description
- FEDBIZOPPS.GOV ANNOUNCEMENT: SUBJECT: Notice of intent to award a Sole Source SOLICITATION NUMBER: NB687080-17-03389 CONTACT POINTS: Michael Fredericks, Contracting Officer (303) 497-7763; 1.BACKGROUND OF PROPOSED ACQUISITION: The Boulder Microfabrication Facility (BMF) is an 18,000 square feet Class 100 cleanroom located in the Katharine Blodgett Gebbie Laboratory. It is operated by the MicroFabrication Group in the Quantum Electromagnetics Division of the Physical Measurement Laboratory, who is responsible for providing the NIST-Boulder staff with state-of-the-art microelectronic and microelectromechanical systems (MEMS) fabrication capability. 2.DESCRIPTION/PURPOSE OF ITEM/SERVICE TO BE ACQUIRED: The BMF requires an upgrade to an existing sputter deposition tool to enable more uniform processes on larger wafer sizes. This system (referred to as the SISDEP), is used grow Nb-AlOx-Nb tunnel junctions. While it has served us well for more than 10 years, there has been a consistent minor problem with the uniformity of the oxidation of the Al layer. To oxidize we remove the wafer from the process chamber, and admit O2 into the load lock for the desired dose (typically 1-20 Torr for 10 minutes to hours depending on the thickness of the tunneling barrier desired). We have found that the thickness of the tunneling barrier has a variable spatial dependence with the barrier being thickest at the point on the wafer nearest the gas port and thinnest farthest from the gas port. For three inch wafers, this effect is acceptable. We have found the effect to be unacceptable for larger wafers. Additionally, we have observed run-to-run variations in the wafer oxidation because the oxidation rate of the wafers is very temperature dependent. The existing system utilizes a thermal mass during deposition to maintain wafer temperature. We would like to upgrade the system wafer platen to allow for water cooling of the substrates during the sputter deposition phase. This will ensure that the wafers are at a controlled temperature during the oxidation phase. 3.SPECIFIC REQUIREMENTS Upgrade to SISDEP sputter deposition system to allow for more uniform substrate oxidation and temperature control TECHNICAL SPECIFICATIONS: Load Lock Upgrade: Fabricate new larger load lock chamber compatible with existing system. The new load lock must include a 150 mm (6 inch) or larger gas showerhead to provide for uniform oxygen dosing at the wafer surface. The new load lock should utilize existing instrumentation (gauges, pumps) where possible. It should include at least 2 additional 2.75 inch conflat ports for possible upgrade to system instrumentation. Integration of this new load lock will be primarily performed by NIST personnel. Wafer Platen Upgrade: Fabricate RF biased, water cooled rotating substrate platen compatible with existing system. This platen should utilize existing instrumentation where possible such as RF power supplies, matching networks, shutter pneumatics. The platen must be compatible with 3" and 150 mm (6") wafers. Integration of the new platen (including rotation and z-shift motor control) will be primarily performed by NIST personnel. GOVERNMENT FURNISHED PROPERTY OR INFORMATION: N/A DELIVERABLE SCHEDULE: December 1, 2017 ***** Sole Source Justification is based on the following: ***** This procurement is an upgrade to an existing piece of equipment use in for integrated circuit fabrication in the Boulder Microfabrication Facility. Because of the nature of the upgrade, it is very unlikely that any vendor other than the original equipment manufacturer (The Kurt J Lesker Company) would be able to successfully perform this upgrade. Any other vendor would be required to recreate the original system drawings and system software to successfully integrate the desired elements into the upgrade. It is estimate that use of a non-OEM vendor would require additional engineering costs and add additional risk to proper system functionality. Furthermore, a rewrite of the system software would require us to recreate the NIST developed recipes used in our specialized processes. This would also add an additional expense to NIST. The North American Industry Classification System (NAICS) code for this acquisition is 333242, Semiconductor Machinery Manufacturing. No solicitation package will be issued. This Notice of Intent is NOT a Request for Quotation (RFQ) nor is it a request for competition; however, interested parties may identify their interest and capability to respond to the requirement. Inquiries will only be accepted via e-mail to michael.fredericks@nist.gov. The government will consider responses received by 3:00PM, MT, 31 August, 2017. Interested parties that believe they could satisfy the requirements listed above for NIST may clearly and unambiguously identify their capability to do so in writing on or before the response date for this notice. Any prospective contractor must be registered in the System for Award Management (SAM) in order to be eligible for award. Information concerning SAM registered requirements may be viewed via the Internet at http://sam.gov. Written responses to this synopsis shall contain sufficient documentation to establish a bona fide capability to fulfill the requirement. A determination by the Government not to compete this proposed requirement based upon responses to this notice is solely within the discretion of the Government. Information received will normally be considered solely for the purpose of determining whether to conduct a competitive procurement in the future. No telephone requests will be honored.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/notices/7e53767cdcd84970a0f1edafe19bd178)
- Place of Performance
- Address: NIST, 325 Broadway, Boulder, Colorado, 80831, United States
- Zip Code: 80831
- Zip Code: 80831
- Record
- SN04650443-W 20170830/170828232343-7e53767cdcd84970a0f1edafe19bd178 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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