AWARD
A -- WFIRST Sensor Chip Assembly
- Notice Date
- 6/18/2018
- Notice Type
- Award Notice
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- NASA/Goddard Space Flight Center, Code 210.S, Greenbelt, Maryland, 20771, United States
- ZIP Code
- 20771
- Solicitation Number
- 80GSFC17R0011
- Archive Date
- 6/29/2018
- Point of Contact
- Shanita Boykin, Phone: (301) 286-3220
- E-Mail Address
-
shanita.l.boykin@nasa.gov
(shanita.l.boykin@nasa.gov)
- Small Business Set-Aside
- N/A
- Award Number
- 80GSFC18C0095
- Award Date
- 6/14/2018
- Awardee
- Teledyne Scientific & Imaging, LLC, 5212 Verdugo Way<br />, Camarillo, California 93012, United States
- Award Amount
- $23,035,123
- Line Number
- 0001
- Description
- The contract shall provide 72 Short Wave Infrared Sensor Chip Assembly (SCA) devices for the WFIRST Space Flight Focal Plane Assembly. In addition, the contractor shall perform a Warm Functional Test and Cold Functional Screen Test for final space flight SCA testing and performance requirements verification.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/notices/e599e609ebd0fd6186ec1b1ca0b3a144)
- Record
- SN04957966-W 20180620/180618230625-e599e609ebd0fd6186ec1b1ca0b3a144 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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