FBODaily.com | FedBizOpps: PRESOL | 59 | Equip-Flip-Chip C4 Die Bonder Module

FBO DAILY - FEDBIZOPPS ISSUE OF JUNE 06, 2019 FBO #6404
SOLICITATION NOTICE

59 -- Equip-Flip-Chip C4 Die Bonder Module

Notice Date: 6/4/2019
Notice Type: Combine Synopsis/Solicitation
NAICS: 334413 — Semiconductor and Related Device Manufacturing
Contracting Office: 4234 54th Street McClellan CA 95652
ZIP Code: 95652
Solicitation Number: HQ072719Q0003
Response Due: 6/12/2019
Point of Contact: Nicholas Roberts, Contract Specialist, Phone 9169992695
E-Mail Address: nicholas.roberts@dmea.osd.mil
Small Business Set-Aside: N/A
Description: See attachments NOTE: THIS NOTICE WAS NOT POSTED TO FEDBIZOPPS ON THE DATE INDICATED IN THE NOTICE ITSELF (04-JUN-2019); HOWEVER, IT DID APPEAR IN THE FEDBIZOPPS FTP FEED ON THIS DATE. PLEASE CONTACT 877-472-3779 or fbo.support@gsa.gov REGARDING THIS ISSUE.
Web Link: Link To Document
(https://www.fbo.gov/spg/ODA/DMEA/DMEA/HQ072719Q0003/listing.html)
Place of Performance: Address: 4234 - 54th Street McClellan, CA; Zip Code: 95652; Country: US
Record: SN05330882-F 20190606/190604230033 (fbodaily.com)
Source: FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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