Loren Data's SAM Daily™

fbodaily.com
Home Today's SAM Search Archives Numbered Notes CBD Archives Subscribe
FBO DAILY - FEDBIZOPPS ISSUE OF OCTOBER 06, 2019 FBO #6524
SOLICITATION NOTICE

A -- Thermal Protection System (TPS) Production for Mars Sample Return (MSR)

Notice Date
10/4/2019
 
Notice Type
Justification and Approval (J&A)
 
NAICS
541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
 
Contracting Office
NASA/Ames Research Center, JA:M/S 241-1, Moffett Field, California, 94035-1000
 
ZIP Code
94035-1000
 
Solicitation Number
MSR-RFI
 
Archive Date
11/18/2019
 
Point of Contact
Jeanne Chun, Phone: 6506041769, Veronica L. Gutierrez, Phone: 6506045626
 
E-Mail Address
jeanne.s.chun@nasa.gov, Veronica.L.Gutierrez@nasa.gov
(jeanne.s.chun@nasa.gov, Veronica.L.Gutierrez@nasa.gov)
 
Small Business Set-Aside
N/A
 
Award Number
TBD
 
Award Date
1/31/2020
 
Description
NASA Ames Research Center (ARC) proposes to negotiate a sole source contract with Fiber Materials Inc. (FMI), located at 5 Morin Street, Biddeford, ME 04005 pursuant to 10 U.S.C 2304(c)(1) and FAR 6.302-1, Only One Responsible Source and No Other Supplies or Services will Satisfy Agency Requirements. This contract is for Thermal Protection System (TPS) products in support of the Mars Sample Return (MSR) Earth Entry Vehicle (EEV) mission: 1. Phenolic Impregnated Carbon Ablator (PICA) infusion/processing and part machining of various flat and curved composite panels, tooling, and fittings. These articles will provide the necessary TPS for the backshell of the MSR EEV. 2. Single-piece, 1.3 [TBR] meter diameter PICA forebody heat shields for the forebody of the EEV. 3. Infusion and machining of Heatshield for Extreme Entry Environment Technology (HEEET) preforms for a tiled forebody heat shield. 4. Infusion and machining of single-piece, 1.3 [TBR] meter diameter HEEET heat shields for the forebody of the EEV. FMI has a long history of manufacturing PICA TPS and other lightweight ablator materials and components for NASA and its prime customers, and has experience with HEEET materials. FMI has an unique capacity to fabricate billets and/or near-net-shape single piece articles of carbon FiberForm using a proprietary process and resin infuse FMI supplied carbon FiberForm to yield a NASA certified PICA TPS or to resin infuse NASA supplied 3D carbon weave to yield NASA certified HEEET TPS. FMI is also unique in that it has relevant process specifications, staff and training in place to manufacture PICA and/or HEEET immediately without the need to purchase and/or modify capital equipment or facilities. This in-house capability will allow NASA to meet critical MSR milestones necessary for the MSR EEV project to perform their roles, as directed by NASA Headquarters. The Government does not intend to acquire a commercial item using FAR Part 12. The proposed contract action is for services for which the Government intends to solicit and negotiate with only one source under the authority of FAR 6.302-1. Interested organizations may submit their capabilities and qualifications to perform this requirement in writing to the identified point of contact no later than 5 p.m. PST on October 18, 2019. Submitted capabilities/qualifications will be evaluated solely for determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this requirement on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the Government. Oral communications are not acceptable in response to this notice. NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html.
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/spg/NASA/ARC/OPDC20220/MSR-RFI/listing.html)
 
Place of Performance
Address: NASA Ames Research Center, Moffett Field, California, 94035, United States
Zip Code: 94035
 
Record
SN05468460-W 20191006/191004230341-0bdd7c204c9e5c6ebfbf16f2dd3c80cb (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

FSG Index  |  This Issue's Index  |  Today's FBO Daily Index Page |
ECGrid: EDI VAN Interconnect ECGridOS: EDI Web Services Interconnect API Government Data Publications CBDDisk Subscribers
 Privacy Policy  Jenny in Wanderland!  © 1994-2024, Loren Data Corp.