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SAMDAILY.US - ISSUE OF MARCH 23, 2023 SAM #7786
SOLICITATION NOTICE

59 -- Multiple Award PCB Fab and Assembly BPAs

Notice Date
3/21/2023 9:51:07 AM
 
Notice Type
Combined Synopsis/Solicitation
 
NAICS
334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
 
Contracting Office
DEFENSE MICROELECTRONICS ACTIVITY MCCLELLAN CA 956522100 USA
 
ZIP Code
956522100
 
Solicitation Number
HQ072723RRC01
 
Response Due
4/3/2023 2:00:00 PM
 
Archive Date
04/18/2023
 
Point of Contact
Robert Crandell, Ryan Tung
 
E-Mail Address
robert.d.crandell.civ@mail.mil, ryan.c.tung.civ@mail.mil
(robert.d.crandell.civ@mail.mil, ryan.c.tung.civ@mail.mil)
 
Small Business Set-Aside
SBA Total Small Business Set-Aside (FAR 19.5)
 
Description
DMEA�s mission includes developing electronics solutions that solve DoD obsolescence issues and/or provides state of the art SatCom solutions to DoD Programs.� As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DoD operational environments. The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes.� Maximum ordering ceiling for each BPA holder is $1.2M over a 3 year period. Additionally, the second phase of proposal and evaluation described in this solicitation serves as an RFQ for an actual order of PCBs, for which the Government anticipates multiple initial orders to be placed to have 500 units PCBs delivered.�� Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein.� Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the Contracting Officer, Robert Crandell, via e-mail to robert.d.crandell.civ@mail.mil, no later than 2:00pm (Pacific), Tuesday, 4 April 2023.
 
Web Link
SAM.gov Permalink
(https://sam.gov/opp/d211211b22cf44208becfa60dddc4449/view)
 
Place of Performance
Address: USA
Country: USA
 
Record
SN06625511-F 20230323/230321230108 (samdaily.us)
 
Source
SAM.gov Link to This Notice
(may not be valid after Archive Date)

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