Loren Data's SAM Daily™

SAMDAILY.US - ISSUE OF MARCH 29, 2023 SAM #7792
SOURCES SOUGHT

99 -- Ion Beam Etch and Ion Beam Deposition system

Notice Date

3/27/2023 2:20:23 PM
 

Notice Type

Sources Sought
 

NAICS

333242 — Semiconductor Machinery Manufacturing
 

Contracting Office

DEPT OF COMMERCE NIST GAITHERSBURG MD 20899 USA
 

ZIP Code

20899
 

Solicitation Number

AMD-SS23-09
 

Response Due

4/11/2023 2:00:00 PM
 

Point of Contact

Forest Crumpler, Tracy Retterer
 

E-Mail Address

forest.crumpler@nist.gov, Tracy.retterer@nist.gov
(forest.crumpler@nist.gov, Tracy.retterer@nist.gov)
 

Description

NO SOLICITATION DOCUMENTS EXIST AT THIS TIME NIST-Boulder has a state-of-the-art research laboratory (the Katharine Blodgett Gebbie Building) to support the most sensitive research done at NIST. Included in this building is a Class 100 microelectronics fabrication facility, called the Boulder Micro-fabrication Facility (BMF).� The BMF requires an Ion Beam Etch and Ion Beam Deposition (IBE/IBD) system in order to fabricate its next generation devices.� The system must be a vacuum chamber with a load lock that can perform ion beam etching of substrates and deposit materials including but not limited to; Germanium (Ge), Magnesium Fluoride (MgF2), Tantalum Pentoxide (Ta2O5), Silicon Nitride (SiNx), Gold (Au), Copper (Cu), Tantalum (Ta), Silicon (Si), Aluminum (Al) and methane-based diamond-like carbon deposition in a manner that is consistent with methods used for (IBE/IBD) in the semiconductor industry. In order to meet its research requirements, the BMF requires a system that can process on a substrate with lateral dimensions of a 150 mm SEMI spec wafer and that provides uniform etch and deposition rates.� Minimum Requirements The tool must provide a deposition uniformity of better than 1.5 % (� * range/mean) across a substrate with lateral dimensions of a 150 mm SEMI spec wafer that has one SEMI-standard flat at the bottom minus a 5 mm edge exclusion zone around the edge of the wafer and an etch uniformity of better than 2 % (� * range/mean) across a substrate with lateral dimensions of a 150 mm SEMI spec wafer and one SEMI-standard flat at the bottom minus a 5 mm edge exclusion zone around the edge of the wafer. To meet this criterion, the contractor shall provide documentation of a deployed system, that is the same model in the bid, that can meet these specifications. NIST is seeking responses from all responsible sources, including large, foreign, and small businesses. Small businesses are defined under the associated NAICS code for this effort, 333242, as those domestic sources with a size standard of 1,500 employees or less. Please include your company�s size classification and socio-economic status in any response to this notice.� Companies that provide equipment that can meet the stated requirements are requested to email a detailed report describing their products to forest.crumpler@nist.gov no later than the response date for this Sources Sought Notice. The report should include achievable specifications and any other information relevant to your product or capabilities.
 

Web Link

SAM.gov Permalink
(https://sam.gov/opp/c49c285f2b6c4adc96b98c6c9638e382/view)
 

Place of Performance

Address: Boulder, CO 80305, USA

Zip Code: 80305

Country: USA
 

Record

SN06631651-F 20230329/230327230110 (samdaily.us)
 

Source

SAM.gov Link to This Notice
(may not be valid after Archive Date)

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