AWARD
36 -- Wafer Dicing Saw and Water Conditioning/Recycling System
- Notice Date
- 9/22/2023 11:06:21 AM
- Notice Type
- Award Notice
- NAICS
- 333242
— Semiconductor Machinery Manufacturing
- Contracting Office
- FA8751 AFRL RIKO ROME NY 13441-4514 USA
- ZIP Code
- 13441-4514
- Solicitation Number
- FA875123C0008
- Archive Date
- 10/07/2023
- Point of Contact
- Richard Childres
- E-Mail Address
-
Richard.Childres@us.af.mil
(Richard.Childres@us.af.mil)
- Award Number
- FA875123C0008
- Award Date
- 09/22/2023
- Awardee
- DISCO HI-TEC AMERICA INC San Jose CA 95138 USA
- Award Amount
- 522399.71
- Description
- Wafer Dicing Saw and Water Conditioning/Recycling System
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/caf609df72b34faca744b190b79269a6/view)
- Place of Performance
- Address: Rome, NY 13441, USA
- Zip Code: 13441
- Country: USA
- Zip Code: 13441
- Record
- SN06841768-F 20230924/230922230050 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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