AWARD
59 -- SEMICONDUCTOR DEVIC
- Notice Date
- 12/12/2023 7:05:55 AM
- Notice Type
- Award Notice
- NAICS
- 334412
— Bare Printed Circuit Board Manufacturing
- Contracting Office
- DLA LAND AND MARITIME COLUMBUS OH 43218-3990 USA
- ZIP Code
- 43218-3990
- Solicitation Number
- SPE7L124T2405
- Archive Date
- 12/27/2023
- Point of Contact
- Desmond Forshey614-692-6154
- E-Mail Address
-
Desmond.Forshey@dla.mil
(Desmond.Forshey@dla.mil)
- Award Number
- SPE7M524P1473
- Award Date
- 12/12/2023
- Awardee
- RESION LLC
- Award Amount
- 75330.00
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/0d5ee8c11ae5452ea857d82064d7ad90/view)
- Record
- SN06909254-F 20231214/231212230039 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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