SPECIAL NOTICE
99 -- TECHNOLOGY/BUSINESS OPPORTUNITY High-density, high-channel count 3D connector for bioelectronic interfaces
- Notice Date
- 6/7/2024 4:28:57 PM
- Notice Type
- Special Notice
- NAICS
- 334510
— Electromedical and Electrotherapeutic Apparatus Manufacturing
- Contracting Office
- LLNS � DOE CONTRACTOR Livermore CA 94551 USA
- ZIP Code
- 94551
- Solicitation Number
- IL-13932
- Response Due
- 7/7/2024 5:00:00 PM
- Archive Date
- 07/22/2024
- Point of Contact
- Yash Vaishnav, Phone: 9254223538, Charlotte Eng, Phone: 9254221905
- E-Mail Address
-
vaishnav1@llnl.gov, eng23@llnl.gov
(vaishnav1@llnl.gov, eng23@llnl.gov)
- Description
- Opportunity: Lawrence Livermore National Laboratory (LLNL), operated by the Lawrence Livermore National Security (LLNS), LLC under contract no. DE-AC52-07NA27344 (Contract 44) with the U.S. Department of Energy (DOE), is offering the opportunity to enter into a collaboration to further develop and commercialize its high-density, high-channel count 3D connector technology for bioelectronic interfaces. Background: As bioelectronic interfaces trend toward smaller features and channel counts into the thousands, there is a need for a high-density connector to accommodate these signals and interface the passive bioelectronic interface to active electronics. Given that nearly the entire market for high-channel-count bioelectronic interfaces � and neural interfaces in particular � are in research and short-term clinical trials, this represents a major unmet need and untapped market segment. Current approaches depend on commercial connectors that have tens of contacts or permanent flip-chip or wire bonding techniques.� These approaches, however, (a) dramatically increase the overall size of the device and are impractical to scale, (b) are time consuming to implement, and/or (c) are irreversible. Implantable bioelectronic interfaces are inherently single-use, and the custom active electronics are limited, so a nonpermanent connection strategy capable of handling high channel counts within a small volume is required.� Description: LLNL researchers have designed and developed a novel high-density, high-channel count 3D connector that enables hundreds or thousands of nonpermanent connections within a compact footprint. The connector addresses limitations of currently used conventional approaches that were described previously, which have an artificial ceiling on the number of recording sites of modern devices of no more than 1000 channels. A small compression force is applied during the assembly of the high-density connector that allows for electrical connections to be made between two contact arrays.� The novel design can include a compressible elastomeric layer and/or well-positioned bumps or ridges on backing plate that allow for even force distribution and improved electrical contact.�� Advantages/Benefits:� Minimize total connector area and volume with fine pitch in two dimensions and the�option to utilize the third dimension Reversible zero insertion force connection- it takes no (or negligible) force to mate two halves of a connector. A user simply brings the two halves of the connector together and it effortlessly snaps into functionally perfect alignment. Allow connection when one or both substrates are extremely flexible. Potential Applications:� Currently available neural probes have integrated or permanently bonded custom electronics.� The shortcoming of these probes is high device costs as the electronics are inherently single-use. While these probes are suitable for long-term clinical implantation in humans, they present a significant barrier to acute or sub-chronic clinical trials, fundamental research, early-stage commercial development, and cost-sensitive markets. LLNL�s high-density, high channel connector could potentially fill thisd untapped market segment. Development Status:� Current stage of technology development:� TRL-2 LLNL has filed for patent protection on this invention. LLNL is seeking industry partners with a demonstrated ability to bring such inventions to the market. Moving critical technology beyond the Laboratory to the commercial world helps our licensees gain a competitive edge in the marketplace. All licensing activities are conducted under policies relating to the strict nondisclosure of company proprietary information.� Please visit the IPO website at https://ipo.llnl.gov/resources for more information on working with LLNL and the industrial partnering and technology transfer process. Note:� THIS IS NOT A PROCUREMENT.� Companies interested in commercializing LLNL's high-density, high-channel count 3D connector technology for bioelectronic interfaces should provide an electronic OR written statement of interest, which includes the following: Company Name and address. The name, address, and telephone number of a point of contact. A description of corporate expertise and/or facilities relevant to commercializing this technology. Please provide a complete electronic OR written statement to ensure consideration of your interest in LLNL's high-density, high-channel count 3D connector technology for bioelectronic interfaces. The subject heading in an email response should include the Notice ID and/or the title of LLNL�s Technology/Business Opportunity and directed to the Primary and Secondary Point of Contacts listed below. Written responses should be directed to: Lawrence Livermore National Laboratory Innovation and Partnerships Office P.O. Box 808, L-779 Livermore, CA� 94551-0808 Attention:�� IL-13932
- Web Link
-
SAM.gov Permalink
(https://sam.gov/opp/383ea2646db04b01a695fa0881c9f041/view)
- Place of Performance
- Address: Livermore, CA, USA
- Country: USA
- Country: USA
- Record
- SN07089929-F 20240609/240607230113 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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