Loren Data's SAM Daily™

SAMDAILY.US - ISSUE OF JULY 03, 2024 SAM #8254
SPECIAL NOTICE

H -- Tech Licensing Opportunity: Advanced Bonding Method for Heterogeneous Systems

Notice Date

7/1/2024 11:55:26 AM
 

Notice Type

Special Notice
 

NAICS

562920 — Materials Recovery Facilities
 

Contracting Office

BATTELLE ENERGY ALLIANCE�DOE CNTR Idaho Falls ID 83415 USA
 

ZIP Code

83415
 

Solicitation Number

BA-1444
 

Response Due

7/1/2025 8:00:00 AM
 

Archive Date

07/16/2025
 

Point of Contact

Andrew Rankin
 

E-Mail Address

andrew.rankin@inl.gov
(andrew.rankin@inl.gov)
 

Description

Advanced Bonding Method for Heterogeneous Systems An advanced method for seamlessly bonding similar and dissimilar materials, maintaining grain structure to minimize disruptions at the bond interface and enhancing material properties and integrity. The Challenge: In the high-stakes realms of aerospace, electronics, and nuclear industries, the integrity of material bonds can mean the difference between success and catastrophic failure. Traditionally, bonding similar and dissimilar materials often involves using interlayers or powders, which unfortunately creates visible bond lines that can become points of weakness. Researchers at INL have pioneered a groundbreaking method to achieve bonding of dissimilar materials through a multi-stage sintering process. How it Works: This innovative bonding method is much less energy intensive relative to other diffusion welding type technologies. The process also eliminates the need for additional interface materials to achieve material bonding. It removes the weaknesses associated with visible bond lines, providing a stronger, more reliable bond for a range of materials including ceramics, metals, and various combinations. The method has been demonstrated using Electric Field Assisted Sintering (EFAS) technologies, but it is adaptable for use with multiple sintering technologies, offering flexibility across different manufacturing contexts. Key Advantages: Enhanced Durability: Bonding without visible bond lines significantly reduces potential failure points, resulting in stronger and more reliable materials. Energy Efficiency: When coupled with Electric Field Assisted Sintering, the method reduces processing time by an order of magnitude vs. hot press, providing an eco-friendly alternative to traditional methods Versatility: The technology is applicable not only in EFAS furnaces but can also be adapted for hot press, hot isostatic press, and conventional box or tube furnaces. No Additional Materials Needed: Eliminates the use of interlayers or powders, reducing material costs and complexity in the bonding process. Improved Material Properties: Bonding partially sintered materials allows for increased deformation at the bonding interface, enhancing overall quality of the bond. Problems Solved Elimination of detectable grain structure alterations (bond lines) at the interface, which can lead to inferior material properties. Addresses limitations in bonding dissimilar materials Reduced energy consumption relative to traditional bonding methods Capable of joining materials with complex geometries Market Applications Electronics manufacturing for enhanced component durability Nuclear industry for improved material reliability under extreme conditions Aerospace industry for stronger structural materials Manufacturing of ceramics with complex shapes and high strength requirements Development of composite materials with superior mechanical properties Development Status: TRL 6 US Provisional Patent Application No. 63/593,137, �METHODS OF BONDING OF SIMILAR AND DISSIMILAR MATERIALS AND RELATED ARTICLES,� BEA Docket No. BA-1444 INL Tech Partnerships: Your Gateway to Innovation INL offers strategic access to proprietary technology, enhancing small business growth and contributing to economic and public advancement. We cater licensing terms to each business we work with, ensuring mutually beneficial agreements. Engage with our diverse technology offerings to propel your company forward. Learn more about our licensing opportunities and the support we provide at https://inl.gov/technology-deployment/. For specific discussions on how your business can benefit, please contact td@inl.gov.
 

Web Link

SAM.gov Permalink
(https://sam.gov/opp/3adf04b211bc4e80ae75fed01c0a173c/view)
 

Place of Performance

Address: Idaho Falls, ID 83415, USA

Zip Code: 83415

Country: USA
 

Record

SN07113324-F 20240703/240701230105 (samdaily.us)
 

Source

SAM.gov Link to This Notice
(may not be valid after Archive Date)

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