Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF JANUARY 6,1995 PSA#1257

Federal Aviation Administration, 2300 East Devon Ave., Des Plaines Il

Y -- CONSTRUCTION - CASING DUCT BANK INSTALLATION AT CHICAGO O'HARE IN TERNATIONAL AIRPORT, CHICAGO, ILLINOIS. SOL DTFA14-95-B-33663 DUE 022795 POC Contact Felicia Bauer at (708) 294-7232 for bid packages. ''No collect calls will be accepted''. Construction - casing duct bank installation at Chicago O'Hare International Airport, Chicago, Illinois. Work consists of but is not limited to the following: boring and the installation of a 140 feet of 24 steel casing with spacers for 4-4 inch duct cells; installation of 560 linear feet of 4 inch rigid nonmetallic PVC conduit within the casing; the pumping of grout into the casing installation to form a monolithic system of duct formation; connection of this new duct system to the existing concrete encased duct on both sides of the taxiway; clean and verify continuity of the entire duct system from manhole to manhole as shown on the project drawings; restoration of site to original condition. Estimated dollar range of this project is between $50,000 and $100,000. The estimated Issue Date is January 27, 1995, with a Bid Opening Date on or about February 27, 1995. The Standard Industrial Code (SIC) is 1629 (heavy construction). Contract duration is 7 calendar days. The procurement is open to all business concerns. FOR MINORITY, WOMEN-OWNED AND DISADVANTAGED BUSINESS ENTERPRISES: The Department of Transportation (DOT), Office of Small and Disadvantaged Business Utilization (OSDBU), has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. This is applicable to any eligible prime or subcontract at any tier. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $1.0 milion per contract. The DOT provides an 80% guaranty on the bond amount to a surety against losses. Loans are also available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $500,000. For further information and applicable forms concerning Bonding Assistance Program and/or the STLP, please call the OSDBU at (800) 532-1169. (0004)

Loren Data Corp. http://www.ld.com (SYN# 0098 19950105\Y-0006.SOL)


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