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COMMERCE BUSINESS DAILY ISSUE OF JANUARY 6,1995 PSA#1257Federal Aviation Administration, 2300 East Devon Ave., Des Plaines Il Y -- CONSTRUCTION - CASING DUCT BANK INSTALLATION AT CHICAGO O'HARE IN
TERNATIONAL AIRPORT, CHICAGO, ILLINOIS. SOL DTFA14-95-B-33663 DUE
022795 POC Contact Felicia Bauer at (708) 294-7232 for bid packages.
''No collect calls will be accepted''. Construction - casing duct bank
installation at Chicago O'Hare International Airport, Chicago,
Illinois. Work consists of but is not limited to the following: boring
and the installation of a 140 feet of 24 steel casing with spacers for
4-4 inch duct cells; installation of 560 linear feet of 4 inch rigid
nonmetallic PVC conduit within the casing; the pumping of grout into
the casing installation to form a monolithic system of duct formation;
connection of this new duct system to the existing concrete encased
duct on both sides of the taxiway; clean and verify continuity of the
entire duct system from manhole to manhole as shown on the project
drawings; restoration of site to original condition. Estimated dollar
range of this project is between $50,000 and $100,000. The estimated
Issue Date is January 27, 1995, with a Bid Opening Date on or about
February 27, 1995. The Standard Industrial Code (SIC) is 1629 (heavy
construction). Contract duration is 7 calendar days. The procurement is
open to all business concerns. FOR MINORITY, WOMEN-OWNED AND
DISADVANTAGED BUSINESS ENTERPRISES: The Department of Transportation
(DOT), Office of Small and Disadvantaged Business Utilization (OSDBU),
has programs to assist minority, women-owned and disadvantaged
business enterprises to acquire short-term working capital and bonding
assistance for transportation-related contracts. This is applicable to
any eligible prime or subcontract at any tier. The DOT Bonding
Assistance Program enables firms to apply for bid, performance and
payment bonds up to $1.0 milion per contract. The DOT provides an 80%
guaranty on the bond amount to a surety against losses. Loans are also
available under the DOT Short Term Lending Program (STLP) at prime
interest rates to provide accounts receivable financing. The maximum
line of credit is $500,000. For further information and applicable
forms concerning Bonding Assistance Program and/or the STLP, please
call the OSDBU at (800) 532-1169. (0004) Loren Data Corp. http://www.ld.com (SYN# 0098 19950105\Y-0006.SOL)
Y - Construction of Structures and Facilities Index Page
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