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COMMERCE BUSINESS DAILY ISSUE OF JANUARY 27,1995 PSA#1271Advanced Research Projects Agency (ARPA), Contracts Management Office
(CMO), 3701 North Fairfax Drive, Arlington, VA 22203-1714 A -- DESIGN-FOR-ENVIRONMENT AND RECYCLING OF MILITARY ELECTRONIC
SYSTEMS SOL BAA95-17 DUE 031095 POC Dr. Lawrence H. Dubois, POC,
ARPA/DSO, FAX: (703)696-2201. The Advanced Research Projects Agency
(ARPA) is soliciting innovative proposals in the
modelling/design-for-environment and recycling/reclamation of military
electronic systems. BACKGROUND: The electronics and computer industry
is the largest manufacturing employer in the United States and
therefore its success is critical to both the defense and civilian
sectors of our economy. The generation of manufacturing by-products and
the disposition of outdated or malfunctioning electronic systems,
however, are creating increasingly important technical and financial
concerns for the Department of Defense. Thus, there is a need to
improve future processes and materials to prevent the production of
hazardous waste and its release to the environment and to enhance the
ability to reuse and/or recycle the resulting products. PROGRAMMATIC
REQUIREMENTS: ARPA has budgeted approximately $3M to develop a
cost-shared, cooperative effort with industry in the (1)
modelling/design-for-environment and (2) recycling/reclamation of
military electronic systems. The details of this program are based on
the recently released ''Electronics Industry Environmental Roadmap''
coordinated by the Microelectronics and Computer Technology Corporation
of Austin, TX. A copy of this roadmap may be obtained from Mr. Ryan
Gallagher (fax: (703) 351-8662, e-mail: rgallagher@sysplan.com). It is
anticipated that up to three research and development projects of no
more than two years duration will be conducted. Partial efforts that
address individual critical issues will be considered, however, teaming
of these efforts into a coherent program capable of meeting the
objectives summarized in the TECHNOLOGY DEVELOPMENT section of this BAA
is encouraged. All programs must culminate in a significant end-point
demonstration of solutions to critical issues within the initial period
of support.Excluded for the purposes of this solicitation are proposals
for studies and/or evaluations. In addition, proposals which deal with
semiconductor chip manufacturing are excluded due to the work that
SEMATECH is performing in this area. Such proposals will be judged to
be non-responsive. TECHNOLOGY DEVELOPMENT: ARPA is seeking innovative
proposals only in the following two areas: (1) The development of
design-for- environment tools and the demonstration of the
applicability of these tools in a real electronic system and/or
component. The goal of this section of the program is to integrate
environmental considerations into existing product and process design
practices so that the ''greening'' of a product and/or process becomes
transparent to the design engineer (Chapter 3 of the roadmap). (2) The
development of technologies for the remanufacture of electronic systems
through the reuse and/or recycle of system components. Envisioned
concepts include product-design technologies that maximize product
recycle and minimize the impact of manufacturing on the environment,
dismantling technologies that enhance manufacturing and reprocessing
along with novel reuse/remanufacturing technologies that produce
materials and modules that meet ''new'' product specifications (Chapter
8 of the roadmap). Since the major components of any electronic
assembly are plastic, metal, and glass, this program can serve as a
model for pollution prevention in a wide variety of DoD systems.
Projects must demonstrate a significant, positive environmental impact
and contain a clear mechanism to commercialize the technologies
developed. Therefore the offeror must (1) identify in the proposal how
the work fits within the scope of Chapters 3 or 8 of the roadmap and
(2) design a plan to commercialize the results of the effort including
a cost trade-off analysis with a comparison to existing systems.
Specific manufacturing/disposal issues (e.g., electronic components,
printed wiring boards, packaging, and displays) are discussed in detail
in the roadmap. Critical to the development of any new, more
environmentally benign, technology is the understanding that the proper
choice of this technology can lead to significant cost savings as well
as to true performance advantages. PROPOSAL: Contractors having the
technical and management capabilities, facilities, and experience
necessary to conduct all or portions of this program are invited to
submit proposals describing their technical approach, management
concept, participants, relevant experience, and cost and timing of the
project. Teaming is encouraged, as appropriate. Within seven business
days ARPA will acknowledge receipt of the submission and assign a
control number that should be used in all further correspondence
regarding this proposal. Proposers should obtain pamphlet BAA 95-17,
ECEM (Environmentally Conscious Electronics Manufacturing) Proposer
Information, which provides further background on this program and
details of the proposal format (including page limits: Technical Volume
- 30 p., Cost Volume - unlimited, and a special cover sheet). Proposals
not meeting this format may not be reviewed. The pamphlet may be
obtained in writing or via e-mail from Mr. Ryan Gallagher (fax: (703)
351-8662, e-mail: rgallagher@sysplan.com).This CBD notice itself
constitutes the Broad Agency Announcement as contemplated by FAR
6.102(d)(2). A formal RFP or other solicitation regarding this
announcement will not be issued. Requests for same will be disregarded.
Evaluation and selection of proposal(s) for award will be made to those
offerors whose proposal is considered most advantageous to the
Government, price and other factors considered. The Government reserves
the right to select for award any, all, part, or none of the proposals
received in response to this announcement. In addition, the Government
reserves the right to award either contracts or assistance instruments.
All responsible sources capable of satisfying the Government's needs
may submit proposals which will be evaluated as received. Because of
the technical breadth implied in this solicitation, and the end-point
demonstration component required, no portion of this BAA will be set
aside for HBCU and MI participation, however these entities are
encouraged to apply. EVALUATION CRITERIA: Evaluation of the proposals
will be based on the following four criteria, in decreasing order of
importance: (1) the scientific and technical merits of the proposed
effort including the goals and the feasibility of the approach, (2) the
quality of the demonstration, the adequacy of the technical tasks
proposed to reach this demonstration, and a realistic mechanism to
begin commercialization of the technology within the proposed time
frame of the program, (3) the qualifications of the principal
investigator and other key research personnel, their record of past
performance, and the adequacy of current and planned equipment and
facilities to accomplish the research objectives, and (4) cost, cost
realism, and quality and quantity of cost share. REPORTS AND OTHER
CONTRACTUAL REQUIREMENTS: As a minimum, all contracted efforts will be
required to submit the following Contract Data Requirements List
(CDRL) items: R&D Status Report, Project Planning Chart, Funds and
Man-Hour Expenditure Report, Contract Funds Status Report, copies of
billing statements, a Final Technical Report, and copies of any
presentation materials. CLOSING AND SUBMISSION: All proposals are due
no later than 4 PM EST, 10 March 1995. Offerors should submit one
original and seven copies of the proposal to: ARPA/DSO, ATTN.
BAA#95-17/Dubois, 3701 N. Fairfax Dr., Arlington, VA 22203-1714.
Questions regarding this BAA may be submitted in writing or via e-mail
to Dr. Dubois (fax: (703) 696-2201, e-mail: ldubois@arpa.mil). (0025) Loren Data Corp. http://www.ld.com (SYN# 0002 19950126\A-0002.SOL)
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