Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF JANUARY 27,1995 PSA#1271

Advanced Research Projects Agency (ARPA), Contracts Management Office (CMO), 3701 North Fairfax Drive, Arlington, VA 22203-1714

A -- DESIGN-FOR-ENVIRONMENT AND RECYCLING OF MILITARY ELECTRONIC SYSTEMS SOL BAA95-17 DUE 031095 POC Dr. Lawrence H. Dubois, POC, ARPA/DSO, FAX: (703)696-2201. The Advanced Research Projects Agency (ARPA) is soliciting innovative proposals in the modelling/design-for-environment and recycling/reclamation of military electronic systems. BACKGROUND: The electronics and computer industry is the largest manufacturing employer in the United States and therefore its success is critical to both the defense and civilian sectors of our economy. The generation of manufacturing by-products and the disposition of outdated or malfunctioning electronic systems, however, are creating increasingly important technical and financial concerns for the Department of Defense. Thus, there is a need to improve future processes and materials to prevent the production of hazardous waste and its release to the environment and to enhance the ability to reuse and/or recycle the resulting products. PROGRAMMATIC REQUIREMENTS: ARPA has budgeted approximately $3M to develop a cost-shared, cooperative effort with industry in the (1) modelling/design-for-environment and (2) recycling/reclamation of military electronic systems. The details of this program are based on the recently released ''Electronics Industry Environmental Roadmap'' coordinated by the Microelectronics and Computer Technology Corporation of Austin, TX. A copy of this roadmap may be obtained from Mr. Ryan Gallagher (fax: (703) 351-8662, e-mail: rgallagher@sysplan.com). It is anticipated that up to three research and development projects of no more than two years duration will be conducted. Partial efforts that address individual critical issues will be considered, however, teaming of these efforts into a coherent program capable of meeting the objectives summarized in the TECHNOLOGY DEVELOPMENT section of this BAA is encouraged. All programs must culminate in a significant end-point demonstration of solutions to critical issues within the initial period of support.Excluded for the purposes of this solicitation are proposals for studies and/or evaluations. In addition, proposals which deal with semiconductor chip manufacturing are excluded due to the work that SEMATECH is performing in this area. Such proposals will be judged to be non-responsive. TECHNOLOGY DEVELOPMENT: ARPA is seeking innovative proposals only in the following two areas: (1) The development of design-for- environment tools and the demonstration of the applicability of these tools in a real electronic system and/or component. The goal of this section of the program is to integrate environmental considerations into existing product and process design practices so that the ''greening'' of a product and/or process becomes transparent to the design engineer (Chapter 3 of the roadmap). (2) The development of technologies for the remanufacture of electronic systems through the reuse and/or recycle of system components. Envisioned concepts include product-design technologies that maximize product recycle and minimize the impact of manufacturing on the environment, dismantling technologies that enhance manufacturing and reprocessing along with novel reuse/remanufacturing technologies that produce materials and modules that meet ''new'' product specifications (Chapter 8 of the roadmap). Since the major components of any electronic assembly are plastic, metal, and glass, this program can serve as a model for pollution prevention in a wide variety of DoD systems. Projects must demonstrate a significant, positive environmental impact and contain a clear mechanism to commercialize the technologies developed. Therefore the offeror must (1) identify in the proposal how the work fits within the scope of Chapters 3 or 8 of the roadmap and (2) design a plan to commercialize the results of the effort including a cost trade-off analysis with a comparison to existing systems. Specific manufacturing/disposal issues (e.g., electronic components, printed wiring boards, packaging, and displays) are discussed in detail in the roadmap. Critical to the development of any new, more environmentally benign, technology is the understanding that the proper choice of this technology can lead to significant cost savings as well as to true performance advantages. PROPOSAL: Contractors having the technical and management capabilities, facilities, and experience necessary to conduct all or portions of this program are invited to submit proposals describing their technical approach, management concept, participants, relevant experience, and cost and timing of the project. Teaming is encouraged, as appropriate. Within seven business days ARPA will acknowledge receipt of the submission and assign a control number that should be used in all further correspondence regarding this proposal. Proposers should obtain pamphlet BAA 95-17, ECEM (Environmentally Conscious Electronics Manufacturing) Proposer Information, which provides further background on this program and details of the proposal format (including page limits: Technical Volume - 30 p., Cost Volume - unlimited, and a special cover sheet). Proposals not meeting this format may not be reviewed. The pamphlet may be obtained in writing or via e-mail from Mr. Ryan Gallagher (fax: (703) 351-8662, e-mail: rgallagher@sysplan.com).This CBD notice itself constitutes the Broad Agency Announcement as contemplated by FAR 6.102(d)(2). A formal RFP or other solicitation regarding this announcement will not be issued. Requests for same will be disregarded. Evaluation and selection of proposal(s) for award will be made to those offerors whose proposal is considered most advantageous to the Government, price and other factors considered. The Government reserves the right to select for award any, all, part, or none of the proposals received in response to this announcement. In addition, the Government reserves the right to award either contracts or assistance instruments. All responsible sources capable of satisfying the Government's needs may submit proposals which will be evaluated as received. Because of the technical breadth implied in this solicitation, and the end-point demonstration component required, no portion of this BAA will be set aside for HBCU and MI participation, however these entities are encouraged to apply. EVALUATION CRITERIA: Evaluation of the proposals will be based on the following four criteria, in decreasing order of importance: (1) the scientific and technical merits of the proposed effort including the goals and the feasibility of the approach, (2) the quality of the demonstration, the adequacy of the technical tasks proposed to reach this demonstration, and a realistic mechanism to begin commercialization of the technology within the proposed time frame of the program, (3) the qualifications of the principal investigator and other key research personnel, their record of past performance, and the adequacy of current and planned equipment and facilities to accomplish the research objectives, and (4) cost, cost realism, and quality and quantity of cost share. REPORTS AND OTHER CONTRACTUAL REQUIREMENTS: As a minimum, all contracted efforts will be required to submit the following Contract Data Requirements List (CDRL) items: R&D Status Report, Project Planning Chart, Funds and Man-Hour Expenditure Report, Contract Funds Status Report, copies of billing statements, a Final Technical Report, and copies of any presentation materials. CLOSING AND SUBMISSION: All proposals are due no later than 4 PM EST, 10 March 1995. Offerors should submit one original and seven copies of the proposal to: ARPA/DSO, ATTN. BAA#95-17/Dubois, 3701 N. Fairfax Dr., Arlington, VA 22203-1714. Questions regarding this BAA may be submitted in writing or via e-mail to Dr. Dubois (fax: (703) 696-2201, e-mail: ldubois@arpa.mil). (0025)

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