Federal Aviation Administration 2300 East Devon Avenue, Des Plaines, IL 60018

Z -- REMOVE EXISTING GRID. INSTALL NEW CEILING,LIGHT FIXTURES AND EXIT LI GHTS, IN INDIANAPOLIS, INDIANA. SOL DTFA14-95-B-33668 DUE 032995 POC Submit a request for a bid package in writing to Maggie Gillespie,AIM, Room 151, 2300 E. Devon Avenue, Des Plaines, IL 60018 or fax request to Maggie Gillespie AIM 708-294-8050. Furnish all material, equipment, labor and supervision necessary to accomplish the following work inside the Administration wing, first and second floors. Work consists of, but is not limited to: Relocate all the furniture, computers and other items necessary that will assist the contractor in removing existing ceiling grid, installing new suspended ceiling system, light fixtures, switches and wiring. Protect all the furniture and equipment from dust and debris inside the first and second floors using polyethylene sheets. Cover all furniture, if necessary. Remove all existing ceiling grid where the ceiling is abated. Remove all existing light fixtures where the ceiling is abated in a sequential manner. Furnish and install specified ceiling grid, light fixtures, light switches and wiring. Relocate back all the furniture, computers and other items. Packages are estimated to be issued on or about 2/17/95. Bid opening is scheduled on or about 3/20/95. The bid range is between $50,000 and $100,000. The Sic Code is 1751. FOR MINORITY, WOMEN-OWNED AND DISADVANTAGED BUSINESS ENTERPRISES: The Department of Transportation (DOT), Office of Small and Disadvantaged Business Utilization (OSDBU), has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. This is applicable to any eligible prime or subcontract at any tier. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $1.0 Million per contract. The DOT provides an 80% guaranty on the bond amount to a surety against losses. Loans are also available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $500,000. For futher assistance and applicable forms concerning Bonding Assistance Program and/or STLP, please call the OSDBU at (800) 532-1169. (0025)

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