Federal Aviation Administration, Mike Monroney Aeronautical Center, NAS Acquisition Contracting Team, AMQ-210, P.O. Box 25082, 6500 S. MacArthur Blvd., Oklahoma City, OK 73125-4929

59 -- MODIFIED APPROACH LIGHTING SYSTEM TUBE INTERFACE PRINTED CIRCUIT BOARD SOL DTFA-02-95-R-50030 DUE 041195 POC Brent Foreman, Contracting Officer, (405) 954-7894 This is a reprocurement of defaulted contract DTFA-02-92-D-92142 and is being processed IAW the provisions contained in Federal Acquisition Regulation (FAR) Clause 52.249-8, ''Default (Fixed-Price Supply and Service.'' The Federal Aviation Administration (FAA) has a requirement for Modified Approach Landing System (ALS) Tube Interface Printed Circuit Boards (PCB). The Standard Industrial Classification (SIC) Code is 3672. The requirement will be awarded using an Indefinite-Delivery/Indefinite Quantity format for a base year and 2 one-year options. Estimated quantities for the base year are 2998 each, second year 1200 each, and the third year 600 each. Any contract resulting from this solicitation will include FAR Clause 52.217-9, Option to Extend the Term of the Contract. The awardee will be required to procure all components, fabricate each printed circuit board, mount and solded components on the pcb, and conformal coat to form a unitized assembly IAW Purchase Description AOS-222-002 and its support documents. Two each first articles will be required approximately 60 to 90 days after award. For Minority, Women-Owned and Disadvantaged Business Enterprises: The Department of Transportation (DOT) Office of Small and Disadvantaged Business Utilization has programs to assist minority, women-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contacts. Loans are available under the DOT Short Term Lending Program (STLP) at prime interest rates up to $500,000 per contract to provide accounts receivable financing. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $500,000 per contract. DOT provides an 80 percent guaranty on the bond amount to a surety against losses. For further information and applicable forms concerning the STLP and Bonding Assistance Program, please call (800) 532-1169. (0047)

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