NASA Lewis Research Center, 21000 Brookpark Road, Cleveland, Ohio 44135

A -- SOURCES SOUGHT FOR MMIC PACKAGING POC Gerald J. Chomos, Project Manager, (216) 433-3485, MS 54-2. NASA Lewis Research Center is plannning a procurement in the area of monolithic microwave/millimeter-wave integrated circuit (MMIC) packaging. This program intends to focus effort on the development of reliable, high-performance, low-cost packaging for high-frequency communications electronics, including phased array antennas. A primary goal of this effort is the cultivation of U.S. suppliers for such packaging, created through highly interactive programs established between NASA and domestic industrial partners. An existing 18-36 GHz package design, already demonstrated in working hardware, will be used as a baseline from which manufacturing, mass production, reliability, and quality assurance issues will be addressed. The anticipated outcome of this procurement will be multiple cost-sharing contracts in which vendors will attempt (at minimum) to duplicate existing packages at low cost with high yield, then will maintain the capability and skills to supply MMIC packaging of similar function to commercial and Government users. This is a pre-solicitation notice to inform the industry of NASA's intent and to encourage interest parties to submit a Statement of Interest package that contains a brief narrative description of the qualifications and relevant microwave packaging experience of interested companies to the address shown above. Responses should not exceed five pages of narrative materials and may additionally include photographs or graphics of applicable hardware or capabilities. All responses received before 4/7/95 will be reviewed. Responses received after 4/7/95 will be reviewed at the discretion of NASA. All interested parties may submit information for evaluation of their R&D capabilities to the above named individual. See Numbered Note(s): 25. (0068)

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